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M95040-RMN6P

STMicroelectronics

M95040-RMN6P by STMicroelectronics

M95040-RMN6P by STMicroelectronics is a 512x8-bit EEPROM with a synchronous operating mode and SPI serial bus. It operates b/w 1.8V to 5.5V, supports up to 1M write/erase cycles, and functions in industrial applications with a max temp of 85 °C. Its compact SOIC package ensures efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,111 parts In-Stock

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4,111

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Anansix

USA . 2,725 parts In-Stock

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2,725

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Digiode

USA . 800 parts In-Stock

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800

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IDEA Electronic Components Group

UK . 2,081 parts In-Stock

1+ parts

$1.856

100+ parts

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1k+ parts

$1.670

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2,081

$1.856

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$1.670

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MKK Technologies

India . 1,565 parts In-Stock

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$3.489

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$3.489

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DigiPath Technology Company

USA . 1,565 parts In-Stock

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$3.489

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1,565

$3.489

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AZTECH Wire

Italy . 687 parts In-Stock

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$8.370

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687

$8.370

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QUARKTWIN TECHNOLOGY LTD

USA . 25,241 parts In-Stock

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Corphita

USA . 4,413 parts In-Stock

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Microchip USA

USA . 3,955 parts In-Stock

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3,955

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Parana Technologies

USA . 2,087 parts In-Stock

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$2.219

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2,087

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$2.219

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Overview

Unlock the potential of your projects with the M95040-RMN6P EEPROM from STMicroelectronics, a leader in innovative semiconductor solutions. This compact, robust memory device offers exceptional reliability and performance across diverse applications, from industrial automation to consumer electronics. With its dual write protection and high endurance of 1 million cycles, you gain peace of mind and longevity for your designs. Elevate your creations with quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides durability and protection against environmental factors.

Surface Mount: YES

Surface mount technology enables high-density circuit design, making the product ideal for compact applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space, optimizing layout in electronic designs.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures faster data transfer rates and improved performance compared to asynchronous designs.

Nominal Supply Voltage / Vsup (V): 2.5

A nominal supply voltage of 2.5V supports lower power consumption, enhancing battery life in portable devices.

Power Supplies (V): 2/5

Versatile power supply options (2V to 5V) make it compatible with a wide range of applications.

No. of Terminals: 8

With 8 terminals, this EEPROM offers sufficient connectivity while maintaining a compact layout.

Package Style (Meter): SMALL OUTLINE

A small outline package style facilitates efficient space utilization on printed circuit boards (PCBs).

Maximum Operating Temperature: 85 °C

An operating temperature of 85 °C ensures reliability for industrial applications under high-temperature conditions.

Organization: 512X8

The memory organization of 512x8 bits allows for efficient data storage and retrieval, making it suitable for various applications.

Minimum Operating Temperature: -40 °C

The ability to function in temperatures as low as -40 °C enhances suitability for harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish provides excellent corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positioning improves soldering capabilities and PCB layout flexibility.

Write Protection: HARDWARE/SOFTWARE

Both hardware and software write protection enhance data security, preventing accidental data loss.

Maximum Seated Height: 1.75 mm

A low seated height is ideal for applications where space is a concern and helps in maintaining a slim profile.

Maximum Clock Frequency (fCLK): 5 MHz

A maximum clock frequency of 5 MHz allows for fast data access and efficient operation.

Width: 3.9 mm

At a width of 3.9 mm, this EEPROM is compact and can fit into tighter spaces on a PCB.

Minimum Supply Voltage (Vsup): 1.8 V

The minimum supply voltage of 1.8V allows compatibility with modern low-power circuits.

Maximum Time At Peak Reflow Temperature (s): 40

A reflow time of up to 40 seconds accommodates various soldering processes without damaging the component.

Peak Reflow Temperature °C: 260

Withstanding reflow temperatures of 260 °C ensures that the EEPROM can be reliably soldered in high-temp environments.

Length: 4.9 mm

A compact length of 4.9 mm provides flexibility in PCB layout design while maintaining high functionality.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grades, this EEPROM is suitable for use in demanding environments.

Technology: CMOS

CMOS technology allows for lower power consumption and higher integration density.

Parallel or Serial: SERIAL

Serial communication simplifies connections and helps reduce PCB space requirements.

Terminal Form: GULL WING

Gull wing terminals simplify soldering and provide a stable connection for reliable operation.

Maximum Supply Current: 1 mA

Low maximum supply current makes this EEPROM ideal for energy-sensitive applications.

No. of Words: 512 words

With 512 words available, this EEPROM offers substantial storage capacity for many applications.

Memory Width: 8

An 8-bit memory width allows for efficient data processing and transmission.

Minimum Data Retention Time: 40 years

A long data retention time of 40 years ensures that stored information remains intact for extended periods.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch provides sufficient space for soldering while maintaining compact designs.

No. of Words Code: 512

With a word code of 512, applications can easily manage and reference data effectively.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V allows compatibility with a variety of standard electronic components.

Endurance: 1000000 Write/Erase Cycles

High endurance of up to 1,000,000 write/erase cycles ensures long product life and reliability.

Serial Bus Type: SPI

The SPI bus type enables fast and flexible communication, making integration easier in complex systems.

Maximum Write Cycle Time (tWC): 5 ms

A maximum write cycle time of 5 ms improves efficiency in operations requiring rapid data updates.

Memory Density: 4096 bit

A memory density of 4096 bits offers ample storage for various applications.

Memory IC Type: EEPROM

As an EEPROM, it provides non-volatile memory, retaining data even when powered off.

Maximum Standby Current: 0.0000005 Amp

Extremely low standby current enhances energy efficiency, making it perfect for battery-operated devices.

Technical Specifications

EEPROM M95040-RMN6P attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

5 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.0000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

1 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M95040-RMN6P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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