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M95010-DW3G/W

STMicroelectronics

M95010-DW3G/W by STMicroelectronics

M95010-DW3G/W by STMicroelectronics is a 1024-bit EEPROM with a 5 MHz SPI interface, ideal for automotive applications. It operates b/w -40 °C to 125 °C and features hardware/software write protection. With a compact SOIC package, it ensures efficient space utilization in designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,622 parts In-Stock

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1,622

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Digiode

USA . 1,340 parts In-Stock

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1,340

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Vyrian

USA . 436 parts In-Stock

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436

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 980 parts In-Stock

1+ parts

$1.984

100+ parts

-

1k+ parts

$1.785

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980

$1.984

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$1.785

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MKK Technologies

India . 743 parts In-Stock

1+ parts

$3.730

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743

$3.730

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DigiPath Technology Company

USA . 743 parts In-Stock

1+ parts

$3.730

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743

$3.730

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Parana Technologies

USA . 1,272 parts In-Stock

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$2.372

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1,272

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$2.372

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Corphita

USA . 1,133 parts In-Stock

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Overview

Unlock the power of reliable data storage with the M95010-DW3G/W EEPROM from STMicroelectronics. Renowned for excellence, STMicroelectronics delivers a top-tier solution designed for automotive applications and beyond, ensuring performance even in extreme conditions. With its robust write protection and impressive endurance, this compact device guarantees safety and longevity, making it the perfect choice for innovators seeking quality and efficiency in their designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and cost-effectiveness, making it suitable for various applications.

Surface Mount: YES

Being surface mount allows for efficient PCB space utilization and enables automated assembly processes.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy integration into circuit designs and optimal layout configurations.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for simpler interfacing with microcontrollers, improving system responsiveness.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal 5V makes it compatible with a wide range of standard electronic systems.

Power Supplies (V): 5

Standard power supply ensures easy integration without additional voltage regulators.

No. of Terminals: 8

The 8 terminals provide a compact solution while allowing essential connections for operation.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

A small outline and thin profile make it ideal for space-constrained applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature allows for use in harsh environments, enhancing reliability.

Organization: 128X8

This organization provides a balance between memory capacity and ease of data access.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures functionality in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish ensures high reliability and excellent electrical conductivity.

Terminal Position: DUAL

Dual terminal position enhances flexibility for circuit design and board layout.

Write Protection: HARDWARE/SOFTWARE

The dual-write protection mechanism safeguards data integrity, making it robust for critical applications.

Maximum Seated Height: 1.2 mm

A low profile height allows for miniaturization in overall system design.

Maximum Clock Frequency (fCLK): 5 MHz

A maximum clock frequency of 5 MHz supports fast data transfer rates, improving performance.

Width: 3 mm

A compact width aids in space-saving designs for various electronic devices.

Minimum Supply Voltage (Vsup): 4.5 V

Minimum voltage requirement ensures compatibility with slightly lower voltage systems.

Length: 4.4 mm

A compact length contributes to a smaller footprint on the printed circuit board.

Temperature Grade: AUTOMOTIVE

Automotive-grade components are designed to perform reliably in demanding and fluctuating temperature conditions.

Technology: CMOS

CMOS technology allows for lower power consumption and greater efficiency.

Parallel or Serial: SERIAL

Serial communication simplifies connections and reduces the number of required pins.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve mechanical stability.

Maximum Supply Current: 3 mA

A low maximum supply current enhances energy efficiency in battery-operated designs.

No. of Words: 128 words

With 128 words available, it provides sufficient capacity for many applications without being overly complex.

Memory Width: 8

An 8-bit memory width aligns with typical data structures, making it suitable for embedded systems.

Minimum Data Retention Time: 40

A long retention time ensures data longevity, critical for important information storage.

Terminal Pitch: 0.65 mm

A compact terminal pitch allows for denser designs while maintaining ease of soldering.

No. of Words Code: 128

Consistency in word codes ensures simplicity in programming and data management.

Maximum Supply Voltage (Vsup): 5.5 V

Flexible supply voltage range allows for compatibility with various power sources.

Endurance: 1000000 Write/Erase Cycles

High endurance rating indicates reliability for frequent updating and extensive use.

Serial Bus Type: SPI

SPI allows for high-speed serial communication, enhancing data throughput.

Maximum Write Cycle Time (tWC): 5 ms

Fast write cycle time ensures efficient data updates, reducing latency in applications.

Memory Density: 1024 bit

A memory density of 1024 bits strikes a balance between performance and space efficiency.

Memory IC Type: EEPROM

EEPROM technology is ideal for applications requiring data retention without power.

Maximum Standby Current: 0.000005 Amp

Extremely low standby current contributes to extended battery life in portable devices.

Technical Specifications

EEPROM M95010-DW3G/W attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

5 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M95010-DW3G/W Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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