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M93C46-MN6P

STMicroelectronics

M93C46-MN6P by STMicroelectronics

M93C46-MN6P by STMicroelectronics is a 1024-bit EEPROM with a 5V supply, featuring a synchronous operating mode and a max clock frequency of 2 MHz. It supports software write protection and operates in temperatures from -40 °C to 85 °C. Ideal for industrial applications, it offers high endurance with up to 1M write/erase cycles.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Vyrian

USA . 4,989 parts In-Stock

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Anansix

USA . 2,285 parts In-Stock

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Digiode

USA . 702 parts In-Stock

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Component Sense

UK . 153 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 104 parts In-Stock

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Bristol Electronics

USA . 57 parts In-Stock

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Atlantic Semiconductor

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Microchip USA

USA . 174 parts In-Stock

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$3.392

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IDEA Electronic Components Group

UK . 2,272 parts In-Stock

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$4.664

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$4.198

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MKK Technologies

India . 1,369 parts In-Stock

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$8.771

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DigiPath Technology Company

USA . 1,369 parts In-Stock

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AZTECH Wire

Italy . 722 parts In-Stock

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$9.780

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QUARKTWIN TECHNOLOGY LTD

USA . 10,528 parts In-Stock

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Corphita

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Parana Technologies

USA . 379 parts In-Stock

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Kepictronics

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Overview

Elevate your designs with the M93C46-MN6P EEPROM from STMicroelectronics, a leader in semiconductor innovation. Renowned for their commitment to quality, STMicroelectronics delivers unmatched reliability and performance. This compact, industrial-grade memory solution is perfect for applications ranging from consumer electronics to automotive systems, offering exceptional write endurance and robust data retention. Experience seamless integration and peace of mind, knowing you’re backed by a trusted name in technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material that ensures reliability and protection against environmental factors.

Surface Mount: YES

Allows for compact designs and simplifies the assembly process, making it suitable for modern electronics.

Package Shape: RECTANGULAR

Optimizes space utilization on PCB, allowing for a more compact layout.

Operating Mode: SYNCHRONOUS

Synchronizes data transfer for faster and more efficient operations compared to asynchronous systems.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage level that ensures compatibility with a wide range of electronic systems.

Power Supplies (V): 5

Facilitates design simplicity and system integration as it operates on commonly available power supply levels.

No. of Terminals: 8

Provides sufficient connectivity while maintaining a small footprint, ideal for space-constrained applications.

Package Style (Meter): SMALL OUTLINE

Enhances the space efficiency of PCB layouts, making it perfect for modern, compact devices.

Alternate Memory Width: 8

Allows for flexible data handling, making it versatile for various applications requiring different memory widths.

Maximum Operating Temperature: 85 °C

Ensures reliable operation in industrial conditions where temperature variations can occur.

Organization: 64X16

Provides a balanced structure for efficient data access and management, catering to a variety of applications.

Minimum Operating Temperature: -40 °C

Suitable for extreme environments, ensuring reliable functioning in harsh conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Offers excellent electrical conductivity and resistance to corrosion, ensuring long-term reliability.

Terminal Position: DUAL

Enables a stable connection with minimized risk of mechanical stress during assembly or use.

Write Protection: SOFTWARE

Adds an extra layer of security against inadvertent data modification, preserving data integrity.

Maximum Seated Height: 1.75 mm

A low profile that is suitable for high-density applications, allowing for compact design in tight spaces.

Maximum Clock Frequency (fCLK): 2 MHz

Allows for higher speed data transfers, enhancing overall system performance.

Width: 3.9 mm

Compact width allowing for more components to fit within the same PCB area.

Minimum Supply Voltage (Vsup): 4.5 V

Ensures flexibility in power supply options while continuing to meet operational reliability.

Length: 4.9 mm

Short length contributes to space-efficient designs in compact electronic products.

Temperature Grade: INDUSTRIAL

Designed for reliability in demanding applications typically found in industrial environments.

Technology: CMOS

Provides low power consumption and high-speed performance, making it suitable for battery-powered devices.

Parallel or Serial: SERIAL

Minimizes pin count on the device, allowing for simpler designs and reduced PCB size.

Terminal Form: GULL WING

Facilitates easy soldering and is less prone to damage during assembly.

Maximum Supply Current: 1.5 mA

Ensures low power consumption during operation, ideal for portable and battery-operated devices.

No. of Words: 64 words

Provides a moderate amount of memory, suitable for applications that do not require extensive storage.

Memory Width: 16

Facilitates processing of wider data, improving system throughput and efficiency.

Minimum Data Retention Time: 40 years

Ensures long-term data stability, making it suitable for applications where data integrity over time is critical.

Terminal Pitch: 1.27 mm

Standard pitch that makes it compatible with existing PCB designs and assembly processes.

No. of Words Code: 64

Convenient for coding applications and offers enough capacity for simple data storage needs.

Maximum Supply Voltage (Vsup): 5.5 V

Provides a safe operating range for various applications, enhancing design flexibility.

Endurance: 1,000,000 Write/Erase Cycles

Indicates high reliability and longevity under frequent write/erase operations, ideal for dynamic applications.

Serial Bus Type: MICROWIRE

Allows for easy integration into various systems with minimal pin usage, ensuring design efficiency.

Maximum Write Cycle Time (tWC): 5 ms

Fast write cycles enhance performance in applications requiring quick data recording.

Memory Density: 1024 bit

Provides adequate memory capacity for a range of applications without excessive size.

Memory IC Type: EEPROM

Non-volatile memory that retains data without power, making it perfect for critical data storage.

Maximum Standby Current: 0.00005 Amp

Extremely low standby current helps to save energy in battery-operated devices.

Technical Specifications

EEPROM M93C46-MN6P attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Alternate Memory Width:

8

Maximum Clock Frequency (fCLK):

2 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64X16

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.00005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

1.5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

SOFTWARE

Trade Compliance

M93C46-MN6P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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