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M87C257-10F7

STMicroelectronics

M87C257-10F7 by STMicroelectronics

M87C257-10F7 by STMicroelectronics is a 32Kx8 UVPROM EPROM with a ceramic, rectangular package. It operates at 5V, supports -40 °C to 105 °C temp range, and features a max access time of 100 ns. Ideal for industrial applications requiring reliable data storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,815 parts In-Stock

1+ parts

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3,815

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Anansix

USA . 2,510 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,510

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Digiode

USA . 2,024 parts In-Stock

1+ parts

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100+ parts

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2,024

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,378 parts In-Stock

1+ parts

$5.487

100+ parts

-

1k+ parts

$4.938

10k+ parts

-

2,378

$5.487

-

$4.938

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MKK Technologies

India . 813 parts In-Stock

1+ parts

$10.318

100+ parts

-

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813

$10.318

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DigiPath Technology Company

USA . 813 parts In-Stock

1+ parts

$10.318

100+ parts

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813

$10.318

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Corphita

USA . 4,024 parts In-Stock

1+ parts

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4,024

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Parana Technologies

USA . 892 parts In-Stock

1+ parts

-

100+ parts

$6.560

1k+ parts

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10k+ parts

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892

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$6.560

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Overview

Unlock the potential of your projects with the M87C257-10F7 EPROM from STMicroelectronics, a trusted leader in semiconductor innovation. Designed with precision and reliability in mind, this high-performance memory solution ensures outstanding data integrity across industrial applications. Its robust ceramic package withstands extreme temperatures, making it perfect for demanding environments. Elevate your product designs with the quality and durability that only STMicroelectronics can offer!

Feature Benefit Bullets

Package Body Material: CERAMIC

The ceramic packaging offers superior durability and performance, protecting the chip from environmental factors.

Package Shape: RECTANGULAR

The rectangular shape enables efficient space utilization on PCBs, making it easier to integrate into various designs.

Input/Output Type: COMMON

The common I/O type simplifies interfacing with other components, enhancing compatibility with various systems.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply makes this EPROM compatible with a wide range of devices and systems.

Power Supplies (V): 5

Single power supply requirement contributes to lower circuit complexity and ease of integration.

No. of Terminals: 28

The 28 terminals allow for multiple connection options, providing versatility in design and connectivity.

Package Style (Meter): IN-LINE

In-line package style facilitates easier manual and automated soldering processes during assembly.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliable performance in demanding environments.

Organization: 32KX8

The organization of 32K x 8 bits provides a good balance between capacity and performance for a variety of applications.

Output Characteristics: 3-STATE

3-state output capability allows for more flexible designs by enabling sharing of data lines among multiple devices.

Minimum Operating Temperature: -40 °C

The wide temperature range (-40 °C to 105 °C) makes the product suitable for industrial and outdoor applications.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and reduces the risk of whisker growth, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal positioning allows for efficient PCB layout options and easier access during testing.

Temperature Grade: INDUSTRIAL

Industrial temperature grade certification ensures that the product can withstand harsh operating conditions.

Technology: CMOS

CMOS technology combines low power consumption with high speed, making this EPROM effective for various applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust mechanical support, making it ideal for high-reliability applications.

Maximum Supply Current: 30 mA

Low maximum supply current helps in reducing power consumption, contributing to overall system efficiency.

No. of Words: 32768 words

32K words of memory offers substantial data storage for many application needs in embedded systems.

Memory Width: 8

An 8-bit memory width is ideal for standard data processing applications, allowing for efficient data handling.

Terminal Pitch: 2.54 mm

Standard 2.54 mm terminal pitch enables compatibility with a wide range of perfboards and sockets.

No. of Words Code: 32K

32K words coding provides significant flexibility for various programming and data storage requirements.

Memory Density: 262144 bit

The memory density of 262144 bits allows for sufficient storage space for numerous applications.

Memory IC Type: UVPROM

As a UVPROM, this product offers the ability to be erased and reprogrammed, providing long-term usability.

Maximum Standby Current: 0.0001 Amp

Extremely low standby current ensures minimal power consumption when the device is not in active use.

Maximum Access Time: 100 ns

A maximum access time of 100 ns ensures quick data retrieval, making it suitable for high-speed applications.

Technical Specifications

EPROM M87C257-10F7 attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

100 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-XDIP-T28

JESD-609 Code:

e3

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

28

No. of Words:

32768 words

No. of Words Code:

32K

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Standby Current:

.0001 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

30 mA

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

M87C257-10F7 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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