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M87C257-10F6

STMicroelectronics

M87C257-10F6 by STMicroelectronics

M87C257-10F6 by STMicroelectronics is a 32Kx8 UVPROM with a ceramic, metal-sealed package. It operates asynchronously at 5V, featuring a max access time of 100 ns and an industrial temp range of -40 °C to 85 °C. Ideal for reliable data storage in harsh environments.

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3

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1k+

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Vyrian

USA . 3,937 parts In-Stock

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Digiode

USA . 888 parts In-Stock

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Anansix

USA . 874 parts In-Stock

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IDEA Electronic Components Group

UK . 479 parts In-Stock

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$4.396

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$3.956

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479

$4.396

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MKK Technologies

India . 2,288 parts In-Stock

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$8.266

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DigiPath Technology Company

USA . 2,288 parts In-Stock

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$8.266

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Corphita

USA . 4,817 parts In-Stock

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Parana Technologies

USA . 1,752 parts In-Stock

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$5.256

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$5.256

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Overview

Elevate your projects with the M87C257-10F6 EPROM from STMicroelectronics, a trusted leader in semiconductor solutions. Crafted with meticulous care, this high-quality memory chip ensures robust performance in challenging environments, boasting an industrial temperature grade and exceptional reliability. Ideal for applications in telecommunications, automotive, and consumer electronics, it delivers efficient data storage and rapid access, empowering you to innovate with confidence and precision. Unleash your potential with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed construction provides excellent protection against environmental factors, making it suitable for industrial applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on circuit boards, allowing for efficient layout and component placement.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for flexible timing, enabling use in various applications without the need for external clock signals.

Input/Output Type: COMMON

A common I/O type ensures compatibility with various systems and ease of integration into existing designs.

Nominal Supply Voltage / Vsup (V): 5

A standard supply voltage of 5V ensures compatibility with most logic circuits, making the component easy to use in common systems.

Power Supplies (V): 5

Consistent power supply requirements (5V) simplify design considerations and reduce the complexity of power management.

No. of Terminals: 28

With 28 terminals, this EPROM offers sufficient connection points for versatile application in various circuitry.

Package Style (Meter): IN-LINE, WINDOW

The in-line package with a window allows for easy observation and programming of the chip, enhancing usability.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C enables reliable performance in various temperature environments, suitable for industrial usage.

Organization: 32KX8

The organization of 32Kx8 allows for ample memory capacity, suitable for storing substantial data sets in embedded applications.

Output Characteristics: 3-STATE

3-state output characteristics result in better data flow control within the circuit, preventing bus contention during operations.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures reliability in extreme cold environments, making it ideal for industrial and aerospace applications.

Terminal Finish: MATTE TIN

Matte tin finish promotes good solderability while minimizing oxidation, ensuring reliable connections during assembly.

Terminal Position: DUAL

Dual terminal positions facilitate straightforward mounting and ease in PCB layout design.

Maximum Seated Height: 5.72 mm

A maximum seated height of 5.72 mm allows for efficient use of space in compact electronics.

Width: 15.24 mm

The compact width of 15.24 mm helps in dense PCB layouts, providing flexibility in design.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5 V broadens the range of power supply options, enhancing compatibility with various circuits.

Length: 36.92 mm

At 36.92 mm long, the EPROM is optimized for standard board sizes, ensuring easy integration.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade specifications, this EPROM guarantees reliable performance in challenging environments.

Technology: CMOS

CMOS technology enhances performance and reduces power consumption, making it an ideal choice for battery-driven applications.

Parallel or Serial: PARALLEL

Parallel data access increases read/write speed, improving overall system performance for data-intensive applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and are easy to solder, ensuring durability in various applications.

Maximum Supply Current: 30 mA

A maximum supply current of 30 mA demonstrates low power consumption, making it efficient for energy-sensitive applications.

No. of Words: 32768 words

With 32,768 words of memory, this EPROM offers substantial storage for code and data, suitable for complex applications.

Memory Width: 8

An 8-bit memory width allows for efficient data handling and greater compatibility with microcontrollers.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is standard for many layouts, enhancing ease of integration into various PCB designs.

No. of Words Code: 32K

The coding capability of 32K words makes it a fitting choice for applications requiring moderate to high data storage.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5 V, it allows for tolerance in voltage fluctuations, enhancing reliability.

Memory Density: 262144 bit

High memory density of 262,144 bits makes it suitable for applications where space and performance are critical.

Memory IC Type: UVPROM

The UVPROM type allows for flexible reprogramming, making it ideal for development and prototyping.

Maximum Standby Current: 0.0001 Amp

Low maximum standby current (0.0001 Amp) ensures minimal power draw when not in use, which is vital for energy-efficient designs.

Maximum Access Time: 100 ns

With a maximum access time of 100 ns, it delivers fast performance, suitable for high-speed applications.

Technical Specifications

EPROM M87C257-10F6 attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

100 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-CDIP-T28

JESD-609 Code:

e3

Length:

36.92 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.72 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

M87C257-10F6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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