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M87C257-10F3

STMicroelectronics

M87C257-10F3 by STMicroelectronics

M87C257-10F3 by STMicroelectronics is a 32Kx8 UVPROM with a max access time of 100 ns, ideal for automotive applications. It operates asynchronously at a nominal voltage of 5V and features a ceramic, metal-sealed package. With a temp range of -40 °C to 125 °C, it ensures reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,326 parts In-Stock

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Anansix

USA . 1,923 parts In-Stock

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Vyrian

USA . 924 parts In-Stock

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924

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IDEA Electronic Components Group

UK . 2,271 parts In-Stock

1+ parts

$4.572

100+ parts

-

1k+ parts

$4.115

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$4.572

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$4.115

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MKK Technologies

India . 919 parts In-Stock

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$8.598

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919

$8.598

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DigiPath Technology Company

USA . 919 parts In-Stock

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$8.598

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919

$8.598

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Corphita

USA . 3,081 parts In-Stock

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Parana Technologies

USA . 122 parts In-Stock

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$5.467

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122

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$5.467

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Overview

Unlock the potential of your designs with the M87C257-10F3 EPROM from STMicroelectronics, a leader in high-quality semiconductor solutions. With its robust ceramic and metal-sealed package, this reliable memory solution thrives in demanding automotive environments, ensuring optimal performance under extreme temperatures. Enjoy fast access times and exceptional stability, empowering your innovations across various applications while benefiting from STMicroelectronics' commitment to excellence and reliability.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed co-fired package ensures excellent protection against environmental factors, making it suitable for demanding applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient layout and integration onto PCBs, optimizing space in compact designs.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for faster data access without the need for a clock signal, enhancing performance in various applications.

Input/Output Type: COMMON

Common I/O type simplifies circuit design, ensuring compatibility with a wide range of devices and systems.

Nominal Supply Voltage / Vsup: 5 V

The standard supply voltage of 5V aligns with common digital systems, reducing complexity in power supply design.

Power Supplies (V): 5

Supports a standard voltage level, making it easily integrable with existing circuitry in various applications.

No. of Terminals: 28

A sufficient number of terminals allows for versatile interfacing options and expanded functionality.

Package Style (Meter): IN-LINE, WINDOW

The in-line, window style enhances accessibility for programming and testing, improving usability in development environments.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product is suitable for automotive and industrial applications where temperature extremes are common.

Organization: 32KX8

This memory organization provides ample storage capacity, meeting the demands of complex applications efficiently.

Output Characteristics: 3-STATE

3-state outputs allow for bus sharing, enabling multiple devices to be connected without interference, which simplifies system design.

Minimum Operating Temperature: -40 °C

The capability to operate at very low temperatures makes this product ideal for harsh environmental conditions.

Terminal Finish: MATTE TIN

Matte tin finish offers good solderability and enhances reliability, ensuring long-term performance in various applications.

Terminal Position: DUAL

Dual terminal positioning facilitates easier assembly and connection on PCBs, enhancing design flexibility.

Maximum Seated Height: 5.72 mm

The compact seated height allows for better space management on PCBs, catering to space-constrained applications.

Width: 15.24 mm

This width ensures compatibility with standard board layouts while optimizing real estate on the printed circuit board.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage enables operation in power-efficient designs, making it suitable for battery-operated devices.

Length: 36.92 mm

The length supports efficient placement on boards and allows for easy integration with other components.

Temperature Grade: AUTOMOTIVE

Rated for automotive applications, this product meets stringent reliability requirements, ensuring long-term performance in vehicles.

Technology: CMOS

CMOS technology provides low power consumption and high speed, making this memory suitable for high-performance applications.

Parallel or Serial: PARALLEL

Parallel configuration enables faster data transfer rates, improving overall system performance.

Terminal Form: THROUGH-HOLE

Through-hole design ensures strong mechanical stability and is ideal for robust applications in various environments.

Maximum Supply Current: 30 mA

This manageable current rating ensures efficient power usage without overloading circuits, ideal for energy-sensitive designs.

No. of Words: 32768 words

With a significant word count, it supports a wide range of applications that require substantial data storage.

Memory Width: 8

An 8-bit memory width strikes a balance between speed and efficiency, suitable for standard applications.

Terminal Pitch: 2.54 mm

A standard terminal pitch of 2.54mm simplifies the design and manufacturing process, ensuring compatibility with common board layouts.

No. of Words Code: 32K

Provides sufficient memory coding capacity for diverse applications, enhancing versatility.

Maximum Supply Voltage (Vsup): 5.5 V

The reasonable maximum voltage helps in maintaining stability and protecting the device from overvoltage conditions.

Memory Density: 262144 bit

This high memory density makes it suitable for applications requiring extensive data storage capabilities.

Memory IC Type: UVPROM

As a UVPROM, this memory can be erased and reprogrammed, providing flexibility and efficiency in data management.

Maximum Standby Current: 0.0001 Amp

Extremely low standby current helps conserve power, particularly in portable applications.

Maximum Access Time: 100 ns

Fast access time is crucial for performance-sensitive applications, ensuring quick data retrieval and processing.

Technical Specifications

EPROM M87C257-10F3 attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

100 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-CDIP-T28

JESD-609 Code:

e3

Length:

36.92 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.72 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

M87C257-10F3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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