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M87C257-12F3

STMicroelectronics

M87C257-12F3 by STMicroelectronics

M87C257-12F3 by STMicroelectronics is a 32Kx8 UVPROM with a max access time of 120 ns, ideal for automotive applications. It operates asynchronously at a nominal voltage of 5V and features a robust ceramic package. With dual terminals and a temp range of -40 °C to 125 °C, it ensures reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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ComSIT Distribution GmbH

Germany . 20,702 parts In-Stock

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ComSIT USA

USA . 20,702 parts In-Stock

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Vyrian

USA . 4,495 parts In-Stock

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Digiode

USA . 2,503 parts In-Stock

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Anansix

USA . 1,249 parts In-Stock

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IDEA Electronic Components Group

UK . 850 parts In-Stock

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$2.282

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$2.053

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MKK Technologies

India . 207 parts In-Stock

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$4.290

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DigiPath Technology Company

USA . 207 parts In-Stock

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Authorized Procurement Solutions

USA . 6,500 parts In-Stock

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Corphita

USA . 1,251 parts In-Stock

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Metaverse IC Inc.

Canada . 1,031 parts In-Stock

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Kepictronics

USA . 931 parts In-Stock

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Parana Technologies

USA . 852 parts In-Stock

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Assy Fe

Spain . 12 parts In-Stock

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Overview

Unlock the power of innovation with the M87C257-12F3 EPROM from STMicroelectronics—where quality meets reliability. Built with automotive-grade resilience, this memory chip delivers seamless performance from -40 °C to 125 °C, making it ideal for demanding applications. With its robust design and proven pedigree, you gain not just a component, but a trusted partner in your projects, ensuring enhanced efficiency and longevity in your electronic solutions. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed body provides enhanced durability and resistance to environmental factors, making it suitable for demanding applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on PCBs, facilitating easier integration into various designs.

Operating Mode: ASYNCHRONOUS

Asynchronous operation ensures quick response times and simplifies interfacing with microcontrollers and other devices.

Input/Output Type: COMMON

Common I/O type supports multiple applications, providing flexibility in device communication.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal voltage of 5V is standard for many digital devices, ensuring compatibility and ease of integration.

Power Supplies (V): 5

Single 5V power supply simplifies design and reduces the need for additional power management components.

No. of Terminals: 28

The 28-terminal configuration provides adequate connectivity for a range of applications, while maintaining a compact size.

Package Style (Meter): IN-LINE, WINDOW

The in-line, window package style allows for easy handling and programming, making it user-friendly for developers.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this EPROM can function in high-temperature environments, suitable for automotive applications.

Organization: 32KX8

The 32K x 8 organization enables efficient storage and retrieval of data, making it a suitable choice for various data-intensive applications.

Output Characteristics: 3-STATE

3-state outputs facilitate effective bus management and allow multiple devices to share the same data lines without conflicts.

Minimum Operating Temperature: -40 °C

Operating in temperatures as low as -40 °C makes this EPROM reliable in extreme environments, essential for automotive and industrial applications.

Terminal Finish: MATTE TIN

The matte tin finish enhances solderability and reduces corrosion risk, improving overall longevity and reliability of connections.

Terminal Position: DUAL

Dual terminal position allows for versatile placement options on PCBs, optimizing design layout.

Maximum Seated Height: 5.72 mm

A low seated height of 5.72 mm allows for compact designs and more efficient use of board space.

Width: 15.24 mm

The 15.24 mm width helps maintain a compact footprint on PCBs, which is critical for space-constrained applications.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum operating voltage of 4.5 V ensures flexibility in power supply options, accommodating a variety of systems.

Length: 36.92 mm

At 36.92 mm in length, this EPROM remains compact while offering sufficient terminal space for robust connections.

Temperature Grade: AUTOMOTIVE

Designed specifically for automotive use, the device ensures reliability and performance in critical vehicle applications.

Technology: CMOS

CMOS technology enables low power consumption and high speed, making the EPROM efficient and effective for various uses.

Parallel or Serial: PARALLEL

Parallel operation allows for faster data transfer rates, improving performance in high-speed applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust mechanical support and reliability in soldered connections.

Maximum Supply Current: 30 mA

With a maximum supply current of 30 mA, the device is energy-efficient and can operate effectively within various system designs.

No. of Words: 32768 words

Offering 32768 words of memory capacity allows for significant data storage, meeting the needs of a wide range of applications.

Memory Width: 8

An 8-bit memory width aligns with common data formats, simplifying integration into diverse digital systems.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is standard, facilitating compatibility with existing PCB designs and components.

No. of Words Code: 32K

The 32K words provide ample memory space for storage and programming, suitable for complex applications.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V ensures safe operation within standard voltage ranges, protecting the device from overvoltage conditions.

Memory Density: 262144 bit

With a memory density of 262144 bits, this EPROM offers substantial data capacity for advanced functionalities.

Memory IC Type: UVPROM

As a UVPROM, it allows for easy erasure and reprogramming, providing flexibility in application changes.

Maximum Standby Current: 0.0001 Amp

Minimal standby current ensures low power consumption during idle periods, contributing to overall energy efficiency.

Maximum Access Time: 120 ns

A fast maximum access time of 120 ns allows for quicker data retrieval, enhancing system responsiveness.

Technical Specifications

EPROM M87C257-12F3 attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

120 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-CDIP-T28

JESD-609 Code:

e3

Length:

36.92 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.72 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

M87C257-12F3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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