Loading...

M74HCT74RM13TR

STMicroelectronics

M74HCT74RM13TR by STMicroelectronics

M74HCT74RM13TR by STMicroelectronics is a dual positive edge-triggered flip-flop in a compact 14-terminal SO package. It operates at 5V with a max frequency of 18 MHz and features a propagation delay of just 50 ns, ideal for high-speed digital applications. Its military-grade specs ensure reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 31,920 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

31,920

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 7,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,500

-

-

-

-

Vyrian

USA . 6,769 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,769

-

-

-

-

Anansix

USA . 2,760 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,760

-

-

-

-

First Choice Components Inc.

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Digiode

USA . 2,177 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,177

-

-

-

-

Component Sense

UK . 766 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

766

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 300 parts In-Stock

1+ parts

$11.219

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$11.219

-

-

-

AZTECH Wire

Italy . 736 parts In-Stock

1+ parts

$12.670

100+ parts

-

1k+ parts

-

10k+ parts

-

736

$12.670

-

-

-

IDEA Electronic Components Group

UK . 2,231 parts In-Stock

1+ parts

$18.172

100+ parts

-

1k+ parts

$16.355

10k+ parts

-

2,231

$18.172

-

$16.355

-

MKK Technologies

India . 1,378 parts In-Stock

1+ parts

$34.171

100+ parts

-

1k+ parts

-

10k+ parts

-

1,378

$34.171

-

-

-

DigiPath Technology Company

USA . 1,378 parts In-Stock

1+ parts

$34.171

100+ parts

-

1k+ parts

-

10k+ parts

-

1,378

$34.171

-

-

-

Perfect Parts

USA . 28,560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

28,560

-

-

-

-

Kepictronics

USA . 10,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,500

-

-

-

-

Cyclops Electronics Ltd (Excess)

UK . 8,640 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,640

-

-

-

-

A-Z Elektronik GmbH

Germany . 7,008 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,008

-

-

-

-

Alle Elektronik GmbH

Germany . 4,672 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,672

-

-

-

-

Corphita

USA . 4,427 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,427

-

-

-

-

Assy Fe

Spain . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Parana Technologies

USA . 1,047 parts In-Stock

1+ parts

-

100+ parts

$21.727

1k+ parts

-

10k+ parts

-

1,047

-

$21.727

-

-

Authorized Procurement Solutions

USA . 998 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

998

-

-

-

-

Overview

Unlock the potential of your designs with the M74HCT74RM13TR from STMicroelectronics, a trusted leader in high-quality semiconductor solutions. This versatile latch and flip-flop device ensures reliable performance across various applications, from automotive to consumer electronics. With its robust construction and superior temperature range, you can count on enhanced durability and efficiency, delivering exceptional value for your projects while streamlining your design process!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the construction provides durability and resistance to environmental factors, making the component reliable in various applications.

Surface Mount: YES

Surface mount capability allows for easier integration into compact circuits, making it suitable for modern electronic devices.

No. of Functions: 2

Having multiple functions increases design flexibility and allows for more complex operations in a single package.

Package Shape: RECTANGULAR

The rectangular shape is standard and facilitates easy PCB layout, enhancing manufacturability.

Nominal Supply Voltage / Vsup (V): 5

A standard voltage supply makes it compatible with many electronic systems, simplifying power management.

Load Capacitance (CL): 50 pF

Low load capacitance ensures minimal delay and higher speed, improving the overall performance of the device.

Power Supplies (V): 5

Universal power supply requirements make this product versatile for various applications and reduce complexity.

No. of Terminals: 14

The presence of multiple terminals provides flexibility in signal routing and device interconnections in complex circuits.

Package Style (Meter): SMALL OUTLINE

The small outline design saves board space, making it ideal for applications where real estate is at a premium.

Maximum I (ol): 4 Amp

High output current capability allows it to drive larger loads, making it suitable for power-intensive applications.

Propagation Delay (tpd): 50 ns

Short propagation delay contributes to high-speed operation, which is critical in fast-switching applications.

Maximum Operating Temperature: 125 °C

High operating temperature rating ensures reliability in demanding environments, suitable for military and industrial applications.

Trigger Type: POSITIVE EDGE

Positive edge triggering is common in digital circuits, making it easy to integrate with digital signaling systems.

Minimum Operating Temperature: -55 °C

Wide temperature range allows operation in extreme conditions, which is critical for aerospace and military applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finishing ensures excellent conductivity and corrosion resistance for improved signal integrity.

Terminal Position: DUAL

Dual terminal positioning allows for enhanced layout flexibility in PCB design and assembly, optimizing space utilization.

Maximum Seated Height: 1.75 mm

Low profile ensures compatibility with low-clearance applications, reducing the overall height of the device assembly.

Width: 3.9 mm

Narrow width allows for dense packing of components on a PCB, enhancing design efficiency.

Output Polarity: COMPLEMENTARY

Complementary output provides flexibility in signal processing and enhances circuit design capabilities.

Minimum Supply Voltage (Vsup): 4.5 V

The ability to operate at lower voltages offers efficiency benefits and compatibility with battery-powered applications.

Length: 8.65 mm

Compact length supports space savings on a PCB while facilitating efficient layouts.

Temperature Grade: MILITARY

Military-grade specifications ensure high reliability under harsh conditions, making it suitable for critical applications.

Maximum Frequency At Nominal Supply: 18000000 Hz

High frequency enables the component to handle fast digital signals, essential for modern high-speed data applications.

Technology: CMOS

CMOS technology is energy-efficient and offers low power consumption, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and assembly, supporting high-volume manufacturing.

Packing Method: TR

Tape and reel packaging optimizes the component's compatibility with automated pick-and-place assembly systems.

Terminal Pitch: 1.27 mm

Standard terminal pitch supports easy integration into existing designs and helps reduce layout complexity.

Minimum fmax: 18 MHz

Minimum frequency ensures solid performance in a variety of digital applications, supporting multimedia and communication needs.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to handle a range of voltage supply enhances circuit design flexibility and ensures stability under variations.

Technical Specifications

Latches & Flip-Flops M74HCT74RM13TR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

18000000 Hz

Maximum I (ol):

4 Amp

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay (tpd):

50 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

18 MHz

Trade Compliance

M74HCT74RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20