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M74HCT652RM13TR

STMicroelectronics

M74HCT652RM13TR by STMicroelectronics

M74HCT652RM13TR by STMicroelectronics is an 8-bit bus driver with a propagation delay of 52 ns and operates at a nominal voltage of 5V. It features independent control and supports bidirectional data flow, making it ideal for high-speed communication in military applications. Its compact SO package ensures efficient space utilization in electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,365 parts In-Stock

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8,365

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Digiode

USA . 3,181 parts In-Stock

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3,181

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Anansix

USA . 2,128 parts In-Stock

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2,128

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,824 parts In-Stock

1+ parts

$9.763

100+ parts

-

1k+ parts

$9.372

10k+ parts

$9.372

2,824

$9.763

-

$9.372

$9.372

IDEA Electronic Components Group

UK . 2,073 parts In-Stock

1+ parts

$13.850

100+ parts

-

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$12.465

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2,073

$13.850

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$12.465

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AZTECH Wire

Italy . 499 parts In-Stock

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$14.720

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499

$14.720

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MKK Technologies

India . 1,978 parts In-Stock

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$26.043

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1,978

$26.043

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DigiPath Technology Company

USA . 1,978 parts In-Stock

1+ parts

$26.043

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1,978

$26.043

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Component Stockers USA

USA . 348 parts In-Stock

1+ parts

$99.990

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348

$99.990

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Corphita

USA . 4,594 parts In-Stock

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4,594

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Parana Technologies

USA . 2,090 parts In-Stock

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$16.559

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2,090

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$16.559

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Perfect Parts

USA . 179 parts In-Stock

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179

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GreenTree Electronics

Israel . 160 parts In-Stock

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160

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Authorized Procurement Solutions

USA . 152 parts In-Stock

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Overview

Unlock unmatched performance with the M74HCT652RM13TR from STMicroelectronics, a leader in innovation and quality. This versatile bus driver and transceiver seamlessly enhances your electronic designs, ensuring reliable data transfer with superior speed and efficiency. Built for durability and precision, it thrives in both consumer and industrial applications. Experience the benefits of enhanced design flexibility, reduced power consumption, and robust operation under varied conditions—all backed by ST's commitment to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures a lightweight yet durable design, making it suitable for various electronic applications.

Propagation Delay At Nominal Supply: 55 ns

With a propagation delay of just 55 ns, this product allows for fast switching speeds, enhancing overall system performance.

Surface Mount: YES

The surface mount capability enables easy integration into modern PCB designs, facilitating compact layouts and optimized space usage.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient space utilization on PCBs, allowing for higher density designs.

No. of Bits: 8

An 8-bit configuration ensures that the product can handle substantial data simultaneously, suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this product compatible with most standard digital circuits.

Power Supplies (V): 5

Using a 5V power supply simplifies design and reduces component count, providing ease of integration.

No. of Terminals: 24

Having 24 terminals enhances the connectivity options, supporting complex signal routing and interfacing.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes board space usage while maintaining robust performance.

Maximum I (ol): 6 Amp

A maximum output current of 6A allows the device to drive loads effectively, making it versatile for many applications.

Propagation Delay (tpd): 52 ns

With a low propagation delay of 52 ns, this product supports high-speed data communication, which is ideal for demanding applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this product is suitable for use in high-temperature environments, ensuring reliability.

Output Characteristics: 3-STATE

The 3-state output characteristic allows for greater flexibility in bus systems, enabling multiple devices to share the same communication line.

Trigger Type: POSITIVE EDGE

Positive edge triggering ensures consistent performance in synchronous systems, making this product reliable for timing-critical applications.

Minimum Operating Temperature: -55 °C

A minimum operating temperature of -55 °C enables this product to function in extreme low-temperature environments, ensuring reliability.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish enhances solderability and ensures excellent long-term reliability in various environments.

Terminal Position: DUAL

The dual terminal position enhances layout options, promoting design flexibility and adaptability.

No. of Ports: 2

Having 2 ports allows for interfacing between multiple devices, increasing the versatility of applications.

Maximum Seated Height: 2.65 mm

A low seated height of 2.65 mm is suitable for space-constrained applications without sacrificing electrical performance.

Width: 7.5 mm

The compact width facilitates easy accommodation on various PCB layouts, ensuring efficient design.

Output Polarity: TRUE

True output polarity guarantees correct signal interpretation in digital circuits, promoting compatibility.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5V provides flexibility in power supply design.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time of 30 seconds at peak reflow temperature ensures compatibility with standard soldering processes.

Peak Reflow Temperature °C: 250

The high peak reflow temperature capability ensures robustness during assembly processes.

Length: 15.4 mm

A length of 15.4 mm contributes to compact PCB designs while offering ample terminal spacing for soldering.

Temperature Grade: MILITARY

Rated for military temperature grades, this product is designed for extreme reliability in harsh conditions.

Technology: CMOS

CMOS technology provides high speed and low power consumption, making this device suitable for battery-operated or power-sensitive applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and enhance mechanical stability in PCB applications.

Packing Method: TR

Tape and reel (TR) packing method enables efficient handling and automated assembly processes.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is compatible with standard PCB layouts, promoting design flexibility.

Count Direction: BIDIRECTIONAL

Bidirectional count direction supports robust data communication between devices, maximizing versatility.

Control Type: INDEPENDENT CONTROL

Independent control enhances the product's capability to manage multiple data lines effectively and efficiently.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates reasonable handling requirements, simplifying storage and usage.

Maximum Supply Voltage (Vsup): 5.5 V

The flexibility of a maximum supply voltage of 5.5V accommodates various power supply designs.

Technical Specifications

Bus Driver & Transceivers M74HCT652RM13TR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

HCT

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

250

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

55 ns

Propagation Delay (tpd):

52 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

M74HCT652RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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