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M74HCT574RM13TR

STMicroelectronics

M74HCT574RM13TR by STMicroelectronics

M74HCT574RM13TR by STMicroelectronics is an 8-bit bus driver with a 5V supply, featuring a 54 ns propagation delay and 3-state output. Ideal for high-speed data transmission in military applications, it operates b/w -55 °C to 125°C. Its compact SO package ensures efficient space utilization.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ComSIT Distribution GmbH

Germany . 6,000 parts In-Stock

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6,000

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Digiode

USA . 3,804 parts In-Stock

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3,804

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Vyrian

USA . 2,123 parts In-Stock

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2,123

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Connector Distribution Corp

USA . 1,800 parts In-Stock

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1,800

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Right Parts Inc.

USA . 1,800 parts In-Stock

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1,800

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Anansix

USA . 1,427 parts In-Stock

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1,427

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Distributors (Availability)

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Andel Nordic

Denmark . 3,231 parts In-Stock

1+ parts

$6.216

100+ parts

-

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$5.967

10k+ parts

$5.967

3,231

$6.216

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$5.967

$5.967

Microchip USA

USA . 342 parts In-Stock

1+ parts

$14.550

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342

$14.550

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AZTECH Wire

Italy . 277 parts In-Stock

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$20.800

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277

$20.800

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IDEA Electronic Components Group

UK . 1,487 parts In-Stock

1+ parts

$27.813

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$25.032

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1,487

$27.813

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$25.032

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MKK Technologies

India . 111 parts In-Stock

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$52.301

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111

$52.301

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DigiPath Technology Company

USA . 111 parts In-Stock

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$52.301

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111

$52.301

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Component Stockers USA

USA . 371 parts In-Stock

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$99.990

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371

$99.990

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A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 1,689 parts In-Stock

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$33.255

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1,689

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$33.255

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Assy Fe

Spain . 990 parts In-Stock

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990

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Corphita

USA . 156 parts In-Stock

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156

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Overview

Unlock unparalleled performance with the M74HCT574RM13TR from STMicroelectronics, a leader in innovation. This high-quality bus driver and transceiver is designed to enhance system reliability, offering superior speed and efficiency for your applications. With its robust temperature range and compact packaging, it excels in demanding environments, making it perfect for industrial, automotive, and consumer electronics. Elevate your projects today with this trusted solution!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction ensures reliability in various environmental conditions, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for more compact designs and higher circuit density, enhancing PCB layout flexibility.

Package Shape: RECTANGULAR

The rectangular package shape is optimal for space-efficient designs, facilitating easy integration onto PCBs.

No. of Bits: 8

With 8 bits, this product enables efficient data handling, suitable for a variety of digital communication tasks.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with a broad range of electronic systems, making it easy to integrate.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF allows for effective signal integrity in high-speed applications, ensuring reliable performance.

Power Supplies (V): 5

Utilizing a common power supply voltage simplifies design and reduces power requirements for the overall system.

No. of Terminals: 20

With 20 terminals, this device provides ample connection options for complex configurations, increasing versatility.

Package Style (Meter): SMALL OUTLINE

The small outline packaging is excellent for space-constrained applications, promoting compact designs.

Maximum I (ol): 6 Amp

A high output drive capability of up to 6 Amps allows for powering larger loads, making it suitable for robust applications.

Propagation Delay (tpd): 54 ns

A propagation delay of just 54 ns supports high-speed applications, ensuring minimal delay in signal transmission.

Maximum Operating Temperature: 125 °C

The ability to operate at a maximum temperature of 125 °C makes this device suitable for harsh environments.

Output Characteristics: 3-STATE

3-state output characteristics enhance functionality in bus systems, allowing multiple devices to share the same line.

Trigger Type: POSITIVE EDGE

The positive edge triggering ensures prompt response to input signals, maximizing operational efficiency.

Minimum Operating Temperature: -55 °C

A wide temperature range from -55 °C ensures reliable performance in extreme conditions, suitable for military and aerospace applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish provides excellent corrosion resistance and ensures reliable electrical connections.

Terminal Position: DUAL

Dual terminal positioning offers flexibility in design, facilitating various layout configurations.

No. of Ports: 2

Having 2 ports allows for versatile connections and increased functionality, making it valuable in multi-device systems.

Maximum Seated Height: 2.65 mm

The low seated height enables better space management on PCBs, ideal for compact applications.

Width: 7.5 mm

With a width of 7.5 mm, this product is designed for high-density layouts, maximizing space efficiency on PCBs.

Output Polarity: TRUE

True output polarity is standard for digital signaling, ensuring compatibility with most devices and systems.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5V allows for flexibility in power supply options, accommodating a variety of systems.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, this product can withstand manufacturing processes without degradation, ensuring reliability.

Peak Reflow Temperature: 260

A peak reflow temperature of 260 °C is suitable for modern assembly techniques, providing compatibility with advanced soldering processes.

Length: 12.8 mm

The length of 12.8 mm is manageable for standard PCB designs, allowing for easy placement and soldering.

Temperature Grade: MILITARY

MILITARY temperature grading assures high reliability and performance under demanding conditions, perfect for defense applications.

Maximum Frequency At Nominal Supply: 21000000 Hz

A maximum operating frequency of 21 MHz supports high-speed data transfer, enhancing overall system performance.

Technology: CMOS

CMOS technology allows for low power consumption, making it a cost-effective choice for various applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering, improving assembly efficiency and quality.

Packing Method: TR

The TR packing method optimizes space and improves handling for automated assembly processes.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a good balance between precision and ease of soldering, enhancing manufacturability.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, ensuring precautions are necessary during storage and handling.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V provides overhead for voltage fluctuations, ensuring stable operation in various environments.

Technical Specifications

Bus Driver & Transceivers M74HCT574RM13TR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

21000000 Hz

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

54 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

M74HCT574RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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