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M74HCT573TTR

STMicroelectronics

M74HCT573TTR by STMicroelectronics

M74HCT573TTR by STMicroelectronics is an 8-bit bus driver with a propagation delay of 45 ns and operates at a nominal voltage of 5V. Its compact design features a thin profile and supports military-grade temperatures from -55 °C to 125 °C. Ideal for high-speed data transmission in various electronic applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Vyrian

USA . 8,471 parts In-Stock

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Digiode

USA . 2,710 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,167 parts In-Stock

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Bristol Electronics

USA . 2,167 parts In-Stock

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Dan-Mar Components

USA . 2,167 parts In-Stock

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Anansix

USA . 527 parts In-Stock

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Prism Electronics

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Distributors (Availability)

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Ampacity Inc.

Singapore . 147 parts In-Stock

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$7.000

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147

$7.000

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Andel Nordic

Denmark . 3,086 parts In-Stock

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$8.955

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$8.597

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$8.597

3,086

$8.955

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$8.597

$8.597

AZTECH Wire

Italy . 69 parts In-Stock

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$12.150

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69

$12.150

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IDEA Electronic Components Group

UK . 1,264 parts In-Stock

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$12.240

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$11.016

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Microchip USA

USA . 106 parts In-Stock

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$17.316

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MKK Technologies

India . 1,219 parts In-Stock

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$23.016

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DigiPath Technology Company

USA . 1,219 parts In-Stock

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Kepictronics

USA . 60,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 29,581 parts In-Stock

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Authorized Procurement Solutions

USA . 22,000 parts In-Stock

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Perfect Parts

USA . 11,945 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,307 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,871 parts In-Stock

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Corphita

USA . 2,491 parts In-Stock

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Parana Technologies

USA . 1,894 parts In-Stock

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$14.634

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Overview

Elevate your designs with the M74HCT573TTR from STMicroelectronics, a leader in high-quality semiconductor solutions. This 8-bit bus driver guarantees superior performance and reliability for various applications, from automotive to industrial control. With its robust temperature range and efficient power consumption, this device ensures longevity and efficiency. Trust in ST's commitment to innovation and quality, and enhance your projects with unmatched value and performance today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the internal components, making the product suitable for various environments.

Propagation Delay At Nominal Supply: 45 ns

A low propagation delay ensures fast data transmission, making this product efficient for high-speed applications.

Surface Mount: YES

Surface mount capability allows for compact designs and efficient use of PCB space, making it ideal for modern electronics.

Package Shape: RECTANGULAR

The rectangular package shape is standard, facilitating easy integration into various PCBs.

No. of Bits: 8

With an 8-bit capacity, this product can handle moderate data throughput, suitable for a variety of applications.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with commonly used power systems.

Load Capacitance (CL): 50 pF

A low load capacitance increases switching speed and efficiency, making it suitable for high-frequency applications.

Power Supplies (V): 5

Designed for 5V power supplies, it is versatile and can be easily integrated into existing systems.

No. of Terminals: 20

A higher number of terminals allows for more connections, providing flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

A small outline and thin profile facilitate dense layouts on PCBs, ideal for space-constrained applications.

Maximum I (ol): 6 Amp

With a maximum output current of 6A, this product can drive heavier loads, making it suitable for power-sensitive applications.

Propagation Delay (tpd): 59 ns

The propagation delay of 59 ns, while slightly higher than the nominal supply delay, still supports reasonably high-speed operations.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature means the device can be used in extreme environments, enhancing versatility.

Output Characteristics: 3-STATE

3-state output capability allows for great flexibility in bus systems, ensuring proper data handling without conflicts.

Minimum Operating Temperature: -55 °C

A wide temperature range allows this product to function in harsh environments, making it ideal for military and industrial applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish enhances solderability and ensures reliable connections over time.

Terminal Position: DUAL

Dual terminal positioning offers flexibility in design, easing the integration process into various layouts.

No. of Ports: 2

The presence of two ports allows for bi-directional data communication, expanding its application potential.

Maximum Seated Height: 1.2 mm

With a low seated height, the package is suitable for applications requiring low-profile components.

Width: 4.4 mm

A compact width facilitates the development of space-efficient electronic circuits.

Output Polarity: TRUE

True output polarity indicates expected behavior, simplifying design processes for engineers.

Minimum Supply Voltage (Vsup): 4.5 V

Operation at a minimum voltage of 4.5V adds flexibility in applications with varying supply voltages.

Maximum Time At Peak Reflow Temperature (s): 40

Allowing a maximum of 40 seconds at peak reflow ensures effective soldering without damaging components.

Peak Reflow Temperature °C: 260

A high peak reflow temperature ensures compatibility with lead-free soldering processes, adhering to modern manufacturing standards.

Length: 6.5 mm

The compact length of 6.5 mm makes this device suitable for integration into small form-factor devices.

Temperature Grade: MILITARY

MILITARY-grade temperature classification ensures reliability and robustness under extreme conditions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this bus driver highly efficient.

Terminal Form: GULL WING

Gull wing terminals enhance solderability and reliability of connections, important for long-term device performance.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for tighter spacing on PCBs, maximizing design efficiency.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates reasonable moisture sensitivity, prompting proper handling and storage to ensure reliability.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V provides a safety margin, enhancing the component's reliability in varying conditions.

Technical Specifications

Bus Driver & Transceivers M74HCT573TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

45 ns

Propagation Delay (tpd):

59 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Trade Compliance

M74HCT573TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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