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M74HCT244RM13TR

STMicroelectronics

M74HCT244RM13TR by STMicroelectronics

M74HCT244RM13TR by STMicroelectronics is a CMOS bus driver with a 5V supply, featuring a propagation delay of 38 ns and supporting 3-state outputs. It operates in temperatures from -55 °C to 125 °C, making it ideal for military applications. This compact device has 20 terminals and handles up to 6A load current.

Median Price

$2.630

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4 parts In-Stock

1+ parts

$2.630

100+ parts

-

1k+ parts

$1.423

10k+ parts

$1.337

4

$2.630

-

$1.423

$1.337

Distributors (In-Stock)

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Digiode

USA . 2,906 parts In-Stock

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$2.498

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2,906

$2.498

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Vyrian

USA . 7,599 parts In-Stock

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7,599

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Resion

USA . 1,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,000 parts In-Stock

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1,000

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Speed Components Ltd

Israel . 990 parts In-Stock

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990

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Bristol Electronics

USA . 413 parts In-Stock

1+ parts

-

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$1.058

1k+ parts

$0.988

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413

-

$1.058

$0.988

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Dan-Mar Components

USA . 413 parts In-Stock

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413

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Anansix

USA . 296 parts In-Stock

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296

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J2 Sourcing AB

Sweden . 79 parts In-Stock

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79

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LWI Electronics Inc

India . 51 parts In-Stock

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51

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Distributors (Availability)

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Andel Nordic

Denmark . 482 parts In-Stock

1+ parts

$1.393

100+ parts

-

1k+ parts

$1.338

10k+ parts

$1.338

482

$1.393

-

$1.338

$1.338

Corphita

USA . 1,119 parts In-Stock

1+ parts

$2.367

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1,119

$2.367

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Microchip USA

USA . 160 parts In-Stock

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$20.273

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160

$20.273

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IDEA Electronic Components Group

UK . 353 parts In-Stock

1+ parts

$24.829

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$22.346

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353

$24.829

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$22.346

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MKK Technologies

India . 2,226 parts In-Stock

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$46.689

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2,226

$46.689

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DigiPath Technology Company

USA . 2,226 parts In-Stock

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$46.689

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2,226

$46.689

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A-Z Elektronik GmbH

Germany . 5,190 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,460 parts In-Stock

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3,460

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Speed Components Ltd (Excess)

Israel . 1,000 parts In-Stock

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1,000

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Parana Technologies

USA . 756 parts In-Stock

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$29.687

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756

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Perfect Parts

USA . 142 parts In-Stock

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Authorized Procurement Solutions

USA . 100 parts In-Stock

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100

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Overview

Elevate your designs with the M74HCT244RM13TR from STMicroelectronics—your go-to solution for reliable bus driving and transceiver applications. Renowned for its exceptional quality and performance, STMicroelectronics ensures this product meets the highest standards, delivering efficiency and robustness. With a compact design and low power consumption, this device seamlessly integrates into diverse projects, enhancing operational speed and reliability while providing unmatched value for innovative engineers like you!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package ensures durability and resistance to environmental factors, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 38 ns

Fast propagation delay enhances the performance of data transmission, allowing for quicker responsiveness in systems.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space, facilitating modern electronics applications.

No. of Functions: 2

Multiple functions in a single device reduce component count and save space, promoting design simplicity.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient layout on PCBs, improving overall assembly and performance.

No. of Bits: 4

Supports 4-bit data transmission, making it versatile for various applications requiring moderate data throughputs.

Nominal Supply Voltage / Vsup (V): 5

Standard 5V supply voltage fits well within most digital systems, ensuring easy integration.

Load Capacitance (CL): 50 pF

Lower load capacitance allows for faster switching times, improving signal integrity and performance.

Power Supplies (V): 5

Uses a commonly available power supply voltage, simplifying design and reducing costs.

No. of Terminals: 20

20 terminals provide flexibility for various connections and configurations in your design.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves board space and enables denser circuit designs.

Maximum I (ol): 6 Amp

Able to handle high output current, making it suitable for applications that require robust performance.

Propagation Delay (tpd): 50 ns

Reasonable propagation delay facilitates reliable data communication in fast-paced digital systems.

Maximum Operating Temperature: 125 °C

High temperature rating provides reliability in demanding environments, making it a good choice for industrial use.

Output Characteristics: 3-STATE

3-state output capability allows for flexible system design by enabling devices to share a common data bus.

Minimum Operating Temperature: -55 °C

Low temperature tolerance ensures reliable operation in extreme environments, ideal for military and aerospace applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Quality terminal finish ensures good conductivity and resistance to corrosion, enhancing overall reliability.

Terminal Position: DUAL

Dual terminal position provides versatile mounting options and design flexibility in PCB layout.

No. of Ports: 2

Two ports allow for effective data routing and connection possibilities in various applications.

Maximum Seated Height: 2.65 mm

Compact height enables the product to fit in tight spaces, crucial for modern low-profile design requirements.

Width: 7.5 mm

Narrow width aids in PCB space management, optimizing layout for complex electronic systems.

Output Polarity: TRUE

True output polarity simplifies design considerations in compatibility with logic levels.

Minimum Supply Voltage (Vsup): 4.5 V

Wide supply voltage range provides flexibility for various design requirements.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for accurate soldering processes during assembly, ensuring connection reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures good solder joint quality and durability.

Length: 12.8 mm

Compact length contributes to space-efficient designs, making it ideal for dense circuitry.

Temperature Grade: MILITARY

Military temperature grade ensures high reliability and performance in extreme conditions, suitable for defense and aerospace.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance, critical for modern electronic applications.

Terminal Form: GULL WING

Gull wing terminals facilitate automated assembly processes and improve solder joint integrity.

Packing Method: TR

Tape and reel packing method is ideal for automated assembly, enhancing manufacturing efficiency.

Terminal Pitch: 1.27 mm

Standard terminal pitch supports widespread compatibility with various PCB designs and layouts.

Control Type: ENABLE LOW

Low enable control simplifies interfacing with other devices and logic levels in a circuit.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level indicates adequate handling and storage conditions prior to assembly.

Maximum Supply Voltage (Vsup): 5.5 V

This capability allows for safe operation within a defined range, minimizing risk of overvoltage damage.

Technical Specifications

Bus Driver & Transceivers M74HCT244RM13TR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

38 ns

Propagation Delay (tpd):

50 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

M74HCT244RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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