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M74HCT174RM13TR

STMicroelectronics

M74HCT174RM13TR by STMicroelectronics

M74HCT174RM13TR by STMicroelectronics is a 6-bit CMOS flip-flop with a 5V supply and a max propagation delay of 35 ns. It features a compact SO package, ideal for space-constrained applications. Operating b/w -55 °C to 125 °C, it suits military-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,118 parts In-Stock

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Digiode

USA . 1,821 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,301 parts In-Stock

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Anansix

USA . 1,239 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 515 parts In-Stock

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Legend Electronics Inc.

USA . 165 parts In-Stock

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Ashlea Components Ltd

UK . 2 parts In-Stock

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Microchip USA

USA . 270 parts In-Stock

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$11.315

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AZTECH Wire

Italy . 670 parts In-Stock

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$17.430

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IDEA Electronic Components Group

UK . 308 parts In-Stock

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$19.743

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$17.769

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MKK Technologies

India . 25 parts In-Stock

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$37.126

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DigiPath Technology Company

USA . 25 parts In-Stock

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$37.126

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Component Stockers USA

USA . 256 parts In-Stock

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$99.990

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A-Z Elektronik GmbH

Germany . 8,700 parts In-Stock

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Assy Fe

Spain . 2,500 parts In-Stock

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Corphita

USA . 1,907 parts In-Stock

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Perfect Parts

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Parana Technologies

USA . 364 parts In-Stock

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Kepictronics

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Overview

Elevate your designs with the M74HCT174RM13TR from STMicroelectronics, a leader in semiconductor innovation. This robust 6-bit latch promises unmatched reliability and efficiency, suitable for diverse applications from automotive to industrial control systems. With its compact size and superior performance under extreme conditions, it ensures seamless integration and longevity. Trust in STMicroelectronics to deliver quality you can count on, enhancing your projects while maximizing value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material offers reliable protection and performance under a variety of environmental conditions, making it suitable for long-term use.

Surface Mount: YES

The surface mount design allows for efficient use of space on PCBs, facilitating compact and high-density electronic designs.

Package Shape: RECTANGULAR

The rectangular shape is ideal for achieving a compact layout, optimizing board space and enhancing circuit density.

No. of Bits: 6

With 6 bits, this latch provides flexibility for a variety of applications, supporting 64 different states.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal voltage of 5V makes it compatible with standard digital circuits, ensuring ease of integration.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF ensures minimal power loss and better signal integrity, making this product suitable for high-speed applications.

Power Supplies (V): 5

Standard power supply specifications contribute to ease of design and widespread compatibility with existing systems.

No. of Terminals: 16

A 16-terminal configuration provides multiple connection points, facilitating versatile connections and circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style is advantageous for space-constrained applications, allowing for efficient layout and optimal performance.

Maximum I (ol): 4 Amp

With a maximum output drive current of 4 Amps, this product can handle a wide range of loads, making it versatile for many applications.

Propagation Delay (tpd): 35 ns

A propagation delay of 35 ns allows for fast switching speeds, making it suitable for high-speed digital applications.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures (up to 125 °C) ensures reliability in harsh environments, making it ideal for military and industrial applications.

Trigger Type: POSITIVE EDGE

Positive edge triggering allows for precise timing control, enhancing the synchronization of complex digital circuits.

Minimum Operating Temperature: -55 °C

Operating down to -55 °C expands the product's applicability in extreme conditions, particularly in military and aerospace contexts.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent corrosion resistance and reliable electrical connections, prolonging the product's lifespan.

Terminal Position: DUAL

Dual terminal positioning enhances mounting versatility, enabling flexible integration into various circuit designs.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm allows for low-profile designs, which is beneficial in space-constrained applications.

Width: 3.9 mm

With a width of 3.9 mm, this component can fit into tight spaces on PCBs, enabling higher density designs.

Output Polarity: TRUE

True output polarity allows for straightforward logic level interfacing, simplifying design considerations.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5V ensures stability in operation under various load conditions, enhancing system reliability.

Length: 9.9 mm

A compact length of 9.9 mm supports high-density PCB layouts, making it an excellent choice for modern electronic designs.

Temperature Grade: MILITARY

The military-grade temperature classification ensures that this product can withstand harsh conditions, ideal for military and aerospace applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminals enhance solderability and reliability, ensuring a strong mechanical and electrical connection to the PCB.

Packing Method: TR

The tape and reel packing method benefits automated assembly processes, improving manufacturing efficiency.

Terminal Pitch: 1.27 mm

The standard 1.27 mm terminal pitch makes it easy to integrate with common PCB layouts and facilitates the design process.

Minimum fmax: 24 MHz

A minimum frequency of 24 MHz supports high-speed applications, ensuring responsive performance in various electronic circuits.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V provides flexibility in power supply choices, accommodating a range of operating conditions.

Technical Specifications

Latches & Flip-Flops M74HCT174RM13TR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

6

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay (tpd):

35 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

24 MHz

Trade Compliance

M74HCT174RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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