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M74HCT14RM13TR

STMicroelectronics

M74HCT14RM13TR by STMicroelectronics

STMicroelectronics M74HCT14RM13TR is a CMOS Logic Gates IC with 6 functions, 45ns propagation delay at 5V. It features Schmitt Trigger technology, operates b/w -55 to 125 °C, and has a small outline package for military-grade applications.

Median Price

$0.250

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

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TEDSS.com

USA . 4,240 parts In-Stock

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Magnum Semiconductors LLP

India . 28,000 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Vyrian

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Digiode

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Semi Source

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Sea View Technologies

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Bristol Electronics

USA . 3,120 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,360 parts In-Stock

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J2 Sourcing AB

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Greenchips

USA . 646 parts In-Stock

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SIE Connect GmbH - GreenChips

Germany . 646 parts In-Stock

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EMSNET

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Anansix

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LWI Electronics Inc

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Prism Electronics

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IDEA Electronic Components Group

UK . 990 parts In-Stock

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$8.417

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$7.575

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AZTECH Wire

Italy . 717 parts In-Stock

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$12.580

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Microchip USA

USA . 299 parts In-Stock

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MKK Technologies

India . 2,009 parts In-Stock

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DigiPath Technology Company

USA . 2,009 parts In-Stock

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GreenTree Electronics

Israel . 120,000 parts In-Stock

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Perfect Parts

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QUARKTWIN TECHNOLOGY LTD

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Metaverse IC Inc.

Canada . 12,581 parts In-Stock

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 6,935 parts In-Stock

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Assy Fe

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Alle Elektronik GmbH

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Corphita

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Parana Technologies

USA . 549 parts In-Stock

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Kepictronics

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Overview

Unlock the power of precision with the M74HCT14RM13TR by STMicroelectronics. This high-quality logic gate offers unmatched reliability and performance for a wide range of applications. With its durable plastic/epoxy construction and innovative technology, this product delivers fast propagation delay and precise operation at a nominal supply voltage of 5V. Ideal for military-grade projects, the M74HCT14RM13TR ensures optimal functionality in extreme conditions. Trust STMicroelectronics to provide cutting-edge solutions that exceed expectations and deliver exceptional value to customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the logic gates easy to handle and suitable for a variety of applications.

Propagation Delay At Nominal Supply: 45 ns

Low propagation delay ensures fast signal processing and efficient operation of the logic gates.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V makes these logic gates compatible with many existing systems and components.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on circuit boards, making these logic gates ideal for compact designs.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, these logic gates can withstand harsh environmental conditions and maintain reliable performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making these logic gates energy efficient and reliable.

Technical Specifications

Logic Gates M74HCT14RM13TR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

45 ns

Propagation Delay (tpd):

45 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

M74HCT14RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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