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M74HC75TTR

STMicroelectronics

M74HC75TTR by STMicroelectronics

M74HC75TTR by STMicroelectronics is a dual 2-bit latch with a propagation delay of 33 ns, operating b/w 2-6 V. It features a compact SO package and supports high-level triggering. Ideal for military applications, it withstands temperatures from -55 °C to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,922 parts In-Stock

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Digiode

USA . 4,104 parts In-Stock

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4,104

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Anansix

USA . 341 parts In-Stock

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341

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Distributors (Availability)

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AZTECH Wire

Italy . 734 parts In-Stock

1+ parts

$10.180

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734

$10.180

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IDEA Electronic Components Group

UK . 353 parts In-Stock

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$12.278

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$11.050

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353

$12.278

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$11.050

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MKK Technologies

India . 577 parts In-Stock

1+ parts

$23.089

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577

$23.089

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DigiPath Technology Company

USA . 577 parts In-Stock

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$23.089

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577

$23.089

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QUARKTWIN TECHNOLOGY LTD

USA . 11,324 parts In-Stock

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Microchip USA

USA . 3,549 parts In-Stock

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3,549

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Parana Technologies

USA . 2,025 parts In-Stock

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$14.681

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$14.681

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Corphita

USA . 926 parts In-Stock

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Overview

Unlock the power of innovation with the M74HC75TTR from STMicroelectronics. This high-quality latch and flip-flop solution excels in performance and reliability, making it perfect for a variety of applications, from consumer electronics to industrial automation. With its robust design and superior manufacturing standards, you can trust the M74HC75TTR to enhance your projects, providing fast switching times, low power consumption, and exceptional durability. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures longevity and reliability in various applications.

Propagation Delay At Nominal Supply: 33 ns

A low propagation delay increases the speed of data transfer, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for efficient space-saving designs and easier integration into modern circuitry.

No. of Functions: 2

Having multiple functions enhances versatility, enabling more complex designs with fewer components.

Package Shape: RECTANGULAR

The rectangular shape is standard for PCB layouts, facilitating easier placement and soldering.

No. of Bits: 2

Supports 2-bit data operations, ideal for applications requiring straightforward logic processing.

Nominal Supply Voltage / Vsup (V): 4.5

Operating at a nominal voltage allows it to work efficiently with common power supplies.

Load Capacitance (CL): 50 pF

This load capacitance helps achieve stable performance even in fast switching environments.

Power Supplies (V): 2/6

Supports a range of supply voltages, providing flexibility for various designs and applications.

No. of Terminals: 16

Multiple terminals enable robust connections and support for various interfacing needs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact package style is ideal for space-constrained circuit designs.

Maximum I (ol): 4 Amp

With a 4 Amp output rating, this product can handle significant loads, making it suitable for power applications.

Propagation Delay (tpd): 190 ns

While slightly higher, this parameter still allows for moderate-speed operations in less demanding applications.

Maximum Operating Temperature: 125 °C

High temperature tolerance makes it suitable for use in harsh environments.

Trigger Type: HIGH LEVEL

High-level triggering ensures reliable operations in logic circuits where high signal levels are expected.

Minimum Operating Temperature: -55 °C

The wide temperature range enables operation in extreme conditions, making it suitable for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Quality terminal finishes provide excellent conductivity and corrosion resistance for enhanced longevity.

Terminal Position: DUAL

Dual terminal positioning aids in effective signal distribution and connection stability.

Maximum Seated Height: 1.2 mm

A low seated height is beneficial for low-profile designs, contributing to slimmer device profiles.

Width: 4.4 mm

The narrow width allows for compact PCB design without sacrificing performance.

Output Polarity: COMPLEMENTARY

Complementary output polarity can simplify design by reducing the number of required components.

Minimum Supply Voltage (Vsup): 2 V

Lower voltage operation increases the range of applications, especially in low-power designs.

Length: 5 mm

Compact size aids in fitting the component into tight spaces on circuit boards.

Temperature Grade: MILITARY

Designed to meet military standards, ensuring reliability in critical and demanding environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for modern electronics.

Terminal Form: GULL WING

Gull-wing terminals facilitate excellent soldering and allow for reliable connections.

Terminal Pitch: 0.65 mm

The standard terminal pitch enhances compatibility with various PCB layouts and designs.

Maximum Supply Voltage (Vsup): 6 V

A maximum supply voltage of 6 V allows compatibility with a wide range of voltage levels in various applications.

Technical Specifications

Latches & Flip-Flops M74HC75TTR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

33 ns

Propagation Delay (tpd):

190 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

HIGH LEVEL

Width:

4.4 mm

Trade Compliance

M74HC75TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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