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M74HC73RM13TR

STMicroelectronics

M74HC73RM13TR by STMicroelectronics

M74HC73RM13TR by STMicroelectronics is a dual 2-bit latch with a negative edge trigger, ideal for high-speed applications. It operates b/w 2-6V, features a max frequency of 20MHz, and has a propagation delay of just 190ns. This compact surface-mount device ensures reliable performance in military-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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ComSIT Distribution GmbH

Germany . 2,622 parts In-Stock

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Vyrian

USA . 1,968 parts In-Stock

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Anansix

USA . 1,275 parts In-Stock

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1,275

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Connector Distribution Corp

USA . 493 parts In-Stock

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Right Parts Inc.

USA . 493 parts In-Stock

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493

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Digiode

USA . 410 parts In-Stock

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410

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Distributors (Availability)

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Microchip USA

USA . 446 parts In-Stock

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$0.648

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446

$0.648

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IDEA Electronic Components Group

UK . 272 parts In-Stock

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$20.021

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$18.019

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272

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AZTECH Wire

Italy . 539 parts In-Stock

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$20.660

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539

$20.660

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MKK Technologies

India . 1,766 parts In-Stock

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$37.648

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$37.648

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DigiPath Technology Company

USA . 1,766 parts In-Stock

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$37.648

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1,766

$37.648

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Component Stockers USA

USA . 676 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 26,531 parts In-Stock

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Corphita

USA . 4,171 parts In-Stock

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Parana Technologies

USA . 1,328 parts In-Stock

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$23.938

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$23.938

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Overview

Elevate your designs with the M74HC73RM13TR from STMicroelectronics, a leader in high-performance semiconductor solutions. This reliable latch and flip-flop device offers unmatched durability and efficiency in a compact surface-mount package, perfect for automotive, industrial, and consumer applications. Benefit from superior quality and precision as you enhance your projects with speed and reliability, all backed by ST's renowned commitment to innovation and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for easier integration into compact electronic circuits and improves assembly efficiency.

No. of Functions: 2

Having two functions increases versatility, enabling more complex operations in a single package.

Package Shape: RECTANGULAR

The rectangular shape is suited for efficient use of PCB space and can simplify layout design.

No. of Bits: 2

With two bits, this product can handle more data and provides better flexibility in digital applications.

Nominal Supply Voltage / Vsup: 4.5 V

This nominal voltage allows for a balance between performance and energy efficiency in low-power applications.

Load Capacitance (CL): 50 pF

Low load capacitance facilitates faster switching speeds, enhancing overall circuit performance.

Power Supplies (V): 2/6 V

The wide range of supply voltage supports various applications, promoting compatibility and adaptability.

No. of Terminals: 14

Having 14 terminals allows for multiple connections, providing flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package is ideal for space-constrained designs, enabling more compact electronics.

Maximum I (ol): 4 Amp

A high output current capability allows the latch to drive larger loads, enhancing its functionality in various applications.

Propagation Delay (tpd): 190 ns

A relatively low propagation delay means improved speed for digital circuits, making it suitable for high-frequency applications.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures makes the product suitable for harsh environments and demanding applications.

Trigger Type: NEGATIVE EDGE

Negative edge triggering allows for precise control in sequential logic circuits, enhancing performance.

Minimum Operating Temperature: -55 °C

A wide temperature range ensures reliable performance in extreme conditions, essential for military and aerospace applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish enhances solderability and corrosion resistance, improving reliability.

Terminal Position: DUAL

Dual terminal position supports easy layout integration and optimizes PCB space usage.

Maximum Seated Height: 1.75 mm

The low seated height allows for a slimmer profile in designs, making it suitable for modern compact electronics.

Width: 3.9 mm

The narrow width contributes to space efficiency in PCB layouts, enabling higher density designs.

Output Polarity: COMPLEMENTARY

Complementary output polarity allows for versatile application in both digital and linear circuits.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage enhances compatibility with battery-operated devices and energy-efficient designs.

Maximum Time At Peak Reflow Temperature: 40 s

This specification ensures that the device can withstand the reflow soldering process without damage.

Peak Reflow Temperature: 260 °C

The high reflow temperature tolerance indicates robustness, suitable for modern manufacturing processes.

Length: 8.65 mm

A compact length facilitates efficient board layout and integration into small electronic devices.

Temperature Grade: MILITARY

The military-grade specification ensures high reliability and performance in critical applications.

Maximum Frequency At Nominal Supply: 20 MHz

A high maximum frequency capability makes it suitable for high-speed digital applications and signal processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, perfect for battery-operated applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and ease of soldering, enhancing assembly quality.

Packing Method: TR

The TR packing method is efficient for automated assembly processes, saving time and costs in manufacturing.

Terminal Pitch: 1.27 mm

A standard terminal pitch facilitates compatibility with common PCB designs, simplifying integration.

Minimum fmax: 24 MHz

The minimum frequency specification indicates capability for a wide range of applications, from low to high-frequency circuits.

Maximum Supply Voltage (Vsup): 6 V

A maximum supply voltage of 6 V accommodates various circuit designs, offering flexibility in power management.

Technical Specifications

Latches & Flip-Flops M74HC73RM13TR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Additional Features:

MASTER SLAVE OPERATION

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

190 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Trigger Type:

NEGATIVE EDGE

Width:

3.9 mm

Minimum fmax:

24 MHz

Trade Compliance

M74HC73RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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