Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
M74HC73RM13TR by STMicroelectronics is a dual 2-bit latch with a negative edge trigger, ideal for high-speed applications. It operates b/w 2-6V, features a max frequency of 20MHz, and has a propagation delay of just 190ns. This compact surface-mount device ensures reliable performance in military-grade environments.
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Vyrian
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Microchip USA
$0.648
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$20.021
$18.019
AZTECH Wire
$20.660
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$37.648
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Component Stockers USA
$99.990
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$23.938
The durable plastic/epoxy material ensures reliability and protection against environmental factors.
Surface mount technology allows for easier integration into compact electronic circuits and improves assembly efficiency.
Having two functions increases versatility, enabling more complex operations in a single package.
The rectangular shape is suited for efficient use of PCB space and can simplify layout design.
With two bits, this product can handle more data and provides better flexibility in digital applications.
This nominal voltage allows for a balance between performance and energy efficiency in low-power applications.
Low load capacitance facilitates faster switching speeds, enhancing overall circuit performance.
The wide range of supply voltage supports various applications, promoting compatibility and adaptability.
Having 14 terminals allows for multiple connections, providing flexibility in circuit design.
The small outline package is ideal for space-constrained designs, enabling more compact electronics.
A high output current capability allows the latch to drive larger loads, enhancing its functionality in various applications.
A relatively low propagation delay means improved speed for digital circuits, making it suitable for high-frequency applications.
The ability to operate at high temperatures makes the product suitable for harsh environments and demanding applications.
Negative edge triggering allows for precise control in sequential logic circuits, enhancing performance.
A wide temperature range ensures reliable performance in extreme conditions, essential for military and aerospace applications.
The premium terminal finish enhances solderability and corrosion resistance, improving reliability.
Dual terminal position supports easy layout integration and optimizes PCB space usage.
The low seated height allows for a slimmer profile in designs, making it suitable for modern compact electronics.
The narrow width contributes to space efficiency in PCB layouts, enabling higher density designs.
Complementary output polarity allows for versatile application in both digital and linear circuits.
A low minimum supply voltage enhances compatibility with battery-operated devices and energy-efficient designs.
This specification ensures that the device can withstand the reflow soldering process without damage.
The high reflow temperature tolerance indicates robustness, suitable for modern manufacturing processes.
A compact length facilitates efficient board layout and integration into small electronic devices.
The military-grade specification ensures high reliability and performance in critical applications.
A high maximum frequency capability makes it suitable for high-speed digital applications and signal processing.
CMOS technology offers low power consumption and high noise immunity, perfect for battery-operated applications.
Gull wing terminals provide excellent mechanical stability and ease of soldering, enhancing assembly quality.
The TR packing method is efficient for automated assembly processes, saving time and costs in manufacturing.
A standard terminal pitch facilitates compatibility with common PCB designs, simplifying integration.
The minimum frequency specification indicates capability for a wide range of applications, from low to high-frequency circuits.
A maximum supply voltage of 6 V accommodates various circuit designs, offering flexibility in power management.
Latches & Flip-Flops M74HC73RM13TR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics
Additional Features:
Family:
JESD-30 Code:
JESD-609 Code:
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Minimum Operating Temperature:
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Peak Reflow Temperature (C):
Power Supplies (V):
Propagation Delay (tpd):
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M74HC73RM13TR Logic ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
LM358AN
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Secos
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N5819HW-7-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Lite-on Semiconductor
LM107H
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Minimum Voltage Gain: 25000;
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
LM555CMX
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Sangdest Microelectronics (Nanjing)
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Config: SINGLE; No. of Phases: 1; No. of Elements: 1;
Central Semiconductor
LIS2DH12TR
STMicroelectronics
LIS2DH12TR by STMicroelectronics is a 3-axis accelerometer with digital voltage output. It operates b/w -40 to 85°C, with supply voltage range of 1.71-3.6V. Ideal for applications requiring precise motion sensing in compact spaces like wearables and IoT devices.
FDN5618P
FDN5618P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage. It features a single configuration with built-in diode, suitable for switching applications. With 10A IDM and 0.17 ohm RDS(on), it operates in the temperature range of -55 to 150 °C, making it ideal for various electronic devices.
Good-ark Electronics
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V; No. of Phases: 1;
Micro Commercial Components
2N7002
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 240; Terminal Finish: TIN LEAD;
Transys Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 60 V; Maximum Operating Temperature: 150 Cel;
LM358N
Motorola
1N4148WS
Panjit International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Continental Device India
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SN74AS175BDR
Texas Instruments
SN74AS175BDR by Texas Instruments is a 4-bit latch with positive edge trigger. It operates at a nominal voltage of 5V and has a propagation delay of 10ns. This small outline package is commonly used in applications requiring flip-flops and latches.
SN74LS273NE4
Rochester Electronics
D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
CD4013BCM
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
74VHC175MTCX
National Semiconductor
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
SN74AHC74PWG4
SN74AHC74PWG4 by Texas Instruments is a dual-function latches & flip-flops IC with 10.5ns propagation delay at 3.3V, ideal for automotive applications. It operates b/w -40 to 125°C, has a max frequency of 75MHz, and features complementary output polarity in a small outline package.
SN74HC74NSR
SN74HC74NSR by Texas Instruments is a dual-function latches & flip-flops IC with 14 terminals. It operates at a supply voltage range of 2-6V, has a propagation delay of 220ns, and can handle load capacitance up to 50pF. Ideal for industrial applications requiring positive edge triggering and complementary output polarity.
5962-9321701QRA
Qp Semiconductor
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
NC7SZ74K8X_NL
Fairchild Semiconductor
Fairchild Semiconductor's NC7SZ74K8X_NL is a CMOS latch with 7.5ns propagation delay, operating at 1.8V to 3.3V. It features a small outline package suitable for industrial applications, with a max frequency of 175MHz and dual terminal position for easy installation in compact spaces.
74HC74PW,112
Nexperia
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: TSSOP; Package Shape: RECTANGULAR;
SN74ACT74DG4
SN74ACT74DG4 by Texas Instruments is a dual-function latches & flip-flops IC with 14 terminals. It operates at a nominal voltage of 5V, has a load capacitance of 50pF, and offers a max frequency of 125MHz. Ideal for industrial applications requiring positive edge triggering and complementary output polarity.
CD74HC73MTE4
CD74HC73MTE4 by Texas Instruments is a dual-function latch & flip-flop with 2 bits, operating at 4.5V nominal voltage. With a propagation delay of 240ns and max frequency of 20MHz, it's ideal for military-grade applications requiring negative edge triggering in small outline packages.
CD4043BPWR
CD4043BPWR by Texas Instruments is a 4-bit latch with a propagation delay of 140 ns at 5V. It features a small outline package, operates b/w -55 to 125 °C, and has a max supply voltage of 18V. Ideal for applications requiring high-level trigger type and true output polarity in military-grade environments.
SN74LS273N
CD4043BE
CD4043BE by Texas Instruments is a 4-bit latch with 140 ns propagation delay at 5V. It features a 3-STATE output and operates in temperatures ranging from -55 to 125°C. Ideal for military applications due to its CMOS technology and through-hole terminal form.
CD40175BM
CD40175BM by Texas Instruments is a 4-bit latch/flip-flop with a propagation delay of 400 ns and a max operating temperature of 125°C. It is commonly used in military-grade applications due to its small outline package style and moisture sensitivity level of 1.
MM74HC74AMTCX
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: TSSOP; Package Shape: RECTANGULAR;
SN74HC74DBR
SN74HC74DBR by Texas Instruments is a dual-function latch with 14 terminals and a supply voltage range of 2-6V. It has a propagation delay of 220ns, operates at temperatures from -40 to 85°C, and supports a max frequency of 25MHz. Ideal for industrial applications requiring positive edge triggering in compact designs.
SN74LS74ADR2
D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
CD4013BM96
CD4013BM96 by Texas Instruments is a CMOS latches & flip-flops IC with 2 functions, 300 ns propagation delay at 5V. It has a small outline package and operates b/w -55 to 125 °C. Ideal for military-grade applications requiring positive edge triggering and complementary output polarity.
MC100EP131FA
MC100EP131FA by Onsemi is a 4-bit latch with 0.6 ns propagation delay, operating at -40 to 85 °C. It has a supply voltage of 3.3V and can handle up to 5.5V. Ideal for high-speed applications in industrial settings due to its ECL technology and max frequency of 3GHz.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
M74HC279RM13TR
R-S LATCH; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
M74HC279M1R
M74HC279B1R
R-S LATCH; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
M74HC273B1R
M74HC74M1R
M74HC259B1R
D LATCH; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
M74HC109M1R
J-KBAR FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
M74HC107TTR
J-K FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: TSSOP; Package Shape: RECTANGULAR;
M74HC109TTR
J-KBAR FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
M74HC112B1N
J-K FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
M74HC107B1R
J-K FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;
M74HC107F1
J-K FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;
M74HC109B1R
J-KBAR FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
M74HC109M1
J-KBAR FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
M74HC107RM13TR
J-K FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
M74HC109RM13TR
M74HC107C1R
J-K FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE;
M74HC109C1
J-KBAR FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE;
M74HC107M1
J-K FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
M74HC109C1R
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