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M74HC73B1R

STMicroelectronics

M74HC73B1R by STMicroelectronics

M74HC73B1R by STMicroelectronics is a CMOS latches & flip-flops IC with 2 functions, operating at a frequency of up to 20MHz. It has a nominal voltage of 4.5V and can function in temperatures ranging from -55°C to 125°C. Ideal for military-grade applications requiring fast propagation delay and low power consumption.

Median Price

$0.303

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 76 parts In-Stock

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$0.303

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Vyrian

USA . 4,934 parts In-Stock

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Digiode

USA . 1,199 parts In-Stock

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Anansix

USA . 483 parts In-Stock

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EMSNET

USA . 118 parts In-Stock

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GSS - Global Semi Support

USA . 15 parts In-Stock

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Pegasus Components GmbH

Germany . 11 parts In-Stock

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Zilex Electronics Inc.

Canada . 5 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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$0.297

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$0.285

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Microchip USA

USA . 101 parts In-Stock

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$2.080

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IDEA Electronic Components Group

UK . 520 parts In-Stock

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$13.359

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$12.023

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AZTECH Wire

Italy . 595 parts In-Stock

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$19.715

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MKK Technologies

India . 2,285 parts In-Stock

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$25.121

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DigiPath Technology Company

USA . 2,285 parts In-Stock

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Ampacity Inc.

Singapore . 313 parts In-Stock

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$56.000

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Parana Technologies

USA . 1,394 parts In-Stock

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Corphita

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Assy Fe

Spain . 158 parts In-Stock

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Perfect Parts

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Overview

Enhance your electronic projects with the M74HC73B1R by STMicroelectronics, a top-quality latch & flip-flop device designed to meet your needs. With STMicroelectronics' reputation for excellence in semiconductor manufacturing, you can trust in the reliability and performance of this product. Ideal for a wide range of applications, this versatile component offers value and benefits that will take your projects to the next level. Upgrade your circuits with the M74HC73B1R and experience the advantages it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components of the latch, ensuring a longer lifespan for the product.

No. of Functions: 2

Having 2 functions allows for versatile functionality in controlling multiple circuits or processes simultaneously.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V provides a stable power source for the latch, ensuring consistent performance.

Propagation Delay (tpd): 190 ns

The low propagation delay of 190 nanoseconds ensures quick response times and efficient operation of the latch.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this latch energy-efficient and reliable in various environments.

Maximum Frequency At Nominal Supply: 20,000,000 Hz

With a high maximum frequency, this latch can handle fast data processing and signal switching efficiently.

Technical Specifications

Latches & Flip-Flops M74HC73B1R attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Additional Features:

MASTER SLAVE OPERATION

Family:

HC/UH

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

4 Amp

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

2/6

Propagation Delay (tpd):

190 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

NEGATIVE EDGE

Width:

7.62 mm

Minimum fmax:

24 MHz

Trade Compliance

M74HC73B1R Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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