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M74HC573TTR

STMicroelectronics

M74HC573TTR by STMicroelectronics

M74HC573TTR by STMicroelectronics is an 8-bit bus driver with a propagation delay of 33 ns and operates b/w 2-6 V. Its compact design features a thin profile, making it ideal for space-constrained applications. This CMOS device supports true output polarity and is suitable for military-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,997 parts In-Stock

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LWI Electronics Inc

India . 4,930 parts In-Stock

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Anansix

USA . 2,450 parts In-Stock

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Digiode

USA . 522 parts In-Stock

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Andel Nordic

Denmark . 2,909 parts In-Stock

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$5.199

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$4.991

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$4.991

2,909

$5.199

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$4.991

$4.991

AZTECH Wire

Italy . 90 parts In-Stock

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$16.350

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90

$16.350

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IDEA Electronic Components Group

UK . 590 parts In-Stock

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$22.135

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$19.922

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590

$22.135

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$19.922

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MKK Technologies

India . 854 parts In-Stock

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$41.624

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854

$41.624

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DigiPath Technology Company

USA . 854 parts In-Stock

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$41.624

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$41.624

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Component Stockers USA

USA . 222 parts In-Stock

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$99.990

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Perfect Parts

USA . 56,343 parts In-Stock

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Authorized Procurement Solutions

USA . 30,000 parts In-Stock

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Microchip USA

USA . 4,936 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,869 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,246 parts In-Stock

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Parana Technologies

USA . 1,815 parts In-Stock

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$26.466

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Assy Fe

Spain . 1,000 parts In-Stock

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Corphita

USA . 643 parts In-Stock

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Overview

Elevate your designs with the M74HC573TTR from STMicroelectronics, a leader in innovation and quality. This robust 8-bit bus driver combines exceptional performance with superior reliability, making it perfect for diverse applications, from automotive to industrial control. With low power consumption and rapid switching speeds, it empowers your projects while ensuring efficiency. Experience the advantage of seamless integration and unparalleled support from a trusted manufacturer—choose M74HC573TTR for your next breakthrough!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and protection against environmental factors.

Propagation Delay At Nominal Supply: 33 ns

A low propagation delay contributes to faster signal transmission, making this product ideal for high-speed applications.

Surface Mount: YES

Surface mounting allows for reduced PCB space and easier assembly, making integration simpler.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on circuit boards and allows for efficient layout designs.

No. of Bits: 8

With 8 bits, this product can handle a significant amount of data, suitable for various applications.

Nominal Supply Voltage / Vsup: 4.5 V

Operating at a nominal supply voltage of 4.5V ensures compatibility with a wide range of electronic devices.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF helps to reduce power consumption and enhances performance in high-frequency circuits.

Power Supplies (V): 2/6

Supports a versatile range of power supplies, making it adaptable to various power supply scenarios.

No. of Terminals: 20

20 terminals provide ample connection points for versatile interfacing and signal processing.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile facilitate more compact circuit designs, critical for modern electronics.

Maximum I (ol): 6 Amp

Capability to handle up to 6 Amps makes this product suitable for applications requiring high current output.

Propagation Delay (tpd): 235 ns

While slightly higher than nominal propagation delays, it still supports efficient data transfer for various systems.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature allows for use in demanding environments without risking failure.

Output Characteristics: 3-STATE

3-state output capability enables versatile communication in bus systems, improving system efficiency.

Minimum Operating Temperature: -55 °C

The wide temperature range ensures reliability in extreme environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This finish enhances corrosion resistance and ensures reliable connections over time.

Terminal Position: DUAL

Dual terminal positioning offers flexibility in design and layout, making it adaptable to various PCB designs.

No. of Ports: 2

Two ports facilitate bidirectional communication, enhancing the functionality of the device in networks.

Maximum Seated Height: 1.2 mm

Low seated height allows for easy integration into compact designs without risking height constraints.

Width: 4.4 mm

Narrow width enables the use of more components in tight layouts, improving overall design efficiency.

Output Polarity: TRUE

True output polarity ensures predictable behavior, crucial for accurate data transfer and integrity.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage allows it to be compatible with battery-operated and energy-sensitive applications.

Maximum Time At Peak Reflow Temperature: 40 s

This feature offers flexibility in the soldering process, ensuring robust assembly without compromising component integrity.

Peak Reflow Temperature: 260 °C

High peak reflow temperature accommodates a variety of soldering processes, enhancing compatibility with assembly technologies.

Length: 6.5 mm

Compact length aids in saving board real estate while providing necessary functionality.

Temperature Grade: MILITARY

Military-grade temperature classification ensures high reliability and performance in critical applications.

Technology: CMOS

CMOS technology offers low power consumption, making this product suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and solderability for reliable connections.

Terminal Pitch: 0.65 mm

This finer pitch allows for more compact designs and better use of PCB space.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, necessitating standard handling procedures for assembly and storage.

Maximum Supply Voltage (Vsup): 6 V

The capability to handle up to 6V maximizes flexibility in design, accommodating diverse operating conditions.

Technical Specifications

Bus Driver & Transceivers M74HC573TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

33 ns

Propagation Delay (tpd):

235 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Trade Compliance

M74HC573TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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