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M74HC563RM13TR

STMicroelectronics

M74HC563RM13TR by STMicroelectronics

M74HC563RM13TR by STMicroelectronics is an 8-bit bus driver with a propagation delay of 33 ns, operating b/w 2-6 V. It features a compact SO package and supports high load capacitance (50 pF) for efficient signal transmission. Ideal for military applications, it operates in extreme temperatures from -55 °C to 125 °C.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 7,122 parts In-Stock

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Digiode

USA . 2,629 parts In-Stock

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Anansix

USA . 868 parts In-Stock

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868

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Andel Nordic

Denmark . 3,982 parts In-Stock

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$1.224

100+ parts

-

1k+ parts

$1.175

10k+ parts

$1.175

3,982

$1.224

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$1.175

$1.175

AZTECH Wire

Italy . 1,031 parts In-Stock

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$12.440

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$12.440

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IDEA Electronic Components Group

UK . 659 parts In-Stock

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$22.459

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$20.213

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659

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Microchip USA

USA . 447 parts In-Stock

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$38.187

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447

$38.187

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MKK Technologies

India . 777 parts In-Stock

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$42.233

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777

$42.233

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DigiPath Technology Company

USA . 777 parts In-Stock

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$42.233

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Component Stockers USA

USA . 767 parts In-Stock

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$99.990

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Corphita

USA . 4,191 parts In-Stock

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Perfect Parts

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Parana Technologies

USA . 270 parts In-Stock

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$26.853

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$26.853

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Overview

Elevate your designs with the M74HC563RM13TR from STMicroelectronics, a leader in innovation and reliability. This robust bus driver/transceiver ensures top-notch performance, featuring low propagation delays and exceptional thermal stability for diverse applications—be it automotive, industrial, or communication systems. Its compact design and superior build quality promise seamless integration and long-lasting durability, delivering unmatched value that propels your projects to success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Utilizing durable plastic/epoxy enhances reliability and protects the components.

Propagation Delay At Nominal Supply: 33 ns

A low propagation delay ensures fast signal transmission, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact designs and automated assembly, addressing space constraints.

Package Shape: RECTANGULAR

Rectangular shape aids in efficient layout and space management on PCBs.

No. of Bits: 8

Supports 8-bit data transmission, providing ample bandwidth for most applications.

Nominal Supply Voltage / Vsup: 4.5 V

Ideal nominal supply voltage ensures compatibility with a range of systems while optimizing performance.

Load Capacitance (CL): 50 pF

Moderate load capacitance helps maintain signal integrity during operation.

Power Supplies (V): 2/6

Versatile power supply options allow flexibility in integration with various circuits.

No. of Terminals: 20

A sufficient number of terminals for versatile connections and easier interfacing with multiple devices.

Package Style (Meter): SMALL OUTLINE

Small outline package reduces footprint, enabling higher component density on PCBs.

Maximum I (ol): 6 Amp

High output current capability supports powering larger loads effectively.

Propagation Delay (tpd): 235 ns

While slightly higher than nominal, this delay accommodates various signal processing requirements.

Maximum Operating Temperature: 125 °C

High operational temperature rating ensures reliability in extreme conditions.

Output Characteristics: 3-STATE

3-state outputs enhance flexibility in bus systems, allowing multiple devices to communicate efficiently.

Minimum Operating Temperature: -55 °C

Wide operating temperature range makes it suitable for harsh environments, particularly in military applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Quality terminal finish ensures excellent electrical connectivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal position facilitates easier access and management of connections.

No. of Ports: 2

Dual ports allow for increased interfacing options and more complex circuit designs.

Maximum Seated Height: 2.65 mm

Low seated height supports compact designs in space-constrained applications.

Width: 7.5 mm

Compact width contributes to versatility in PCB design without sacrificing performance.

Output Polarity: INVERTED

Inverted output can simplify interfacing with logic levels of other devices.

Minimum Supply Voltage (Vsup): 2 V

Lower supply voltage allows operation in battery-powered systems, improving energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for proper soldering during assembly without compromising component integrity.

Peak Reflow Temperature °C: 260

High peak reflow temperature supports compatibility with lead-free soldering processes.

Length: 12.8 mm

Compact length is advantageous for achieving space efficiency in circuit designs.

Temperature Grade: MILITARY

Designed to meet military standards, indicating robustness and reliability for critical applications.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high-speed performance.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and heat dissipation during operation.

Packing Method: TR

Tape and reel packing allows for automated handling and ease of integration in manufacturing.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows compatibility with a variety of PCB layouts and designs.

Moisture Sensitivity Level (MSL): 3

Moderate MSL indicates caution is needed for handling, ensuring reliability post-assembly.

Maximum Supply Voltage (Vsup): 6 V

Allows compatibility with a broad range of applications, accommodating various power supply designs.

Technical Specifications

Bus Driver & Transceivers M74HC563RM13TR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

33 ns

Propagation Delay (tpd):

235 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

M74HC563RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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