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M74HC533RM13TR

STMicroelectronics

M74HC533RM13TR by STMicroelectronics

M74HC533RM13TR by STMicroelectronics is an 8-bit bus driver with a propagation delay of 38 ns and operates b/w 2-6 V. Its compact design features a dual terminal layout and supports military-grade temperatures from -55 °C to 125 °C. Ideal for high-speed data transmission in demanding applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,053 parts In-Stock

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8,053

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Digiode

USA . 3,426 parts In-Stock

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3,426

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Anansix

USA . 2,820 parts In-Stock

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2,820

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ComSIT Distribution GmbH

Germany . 109 parts In-Stock

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109

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Distributors (Availability)

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Andel Nordic

Denmark . 3,642 parts In-Stock

1+ parts

$1.455

100+ parts

-

1k+ parts

$1.397

10k+ parts

$1.397

3,642

$1.455

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$1.397

$1.397

AZTECH Wire

Italy . 998 parts In-Stock

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$18.560

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998

$18.560

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IDEA Electronic Components Group

UK . 1,445 parts In-Stock

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$21.521

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$19.369

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1,445

$21.521

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$19.369

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Microchip USA

USA . 290 parts In-Stock

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$33.386

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290

$33.386

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MKK Technologies

India . 1,615 parts In-Stock

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$40.468

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1,615

$40.468

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DigiPath Technology Company

USA . 1,615 parts In-Stock

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$40.468

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1,615

$40.468

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Corphita

USA . 2,648 parts In-Stock

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Perfect Parts

USA . 939 parts In-Stock

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939

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Parana Technologies

USA . 837 parts In-Stock

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$25.731

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837

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$25.731

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Cyclops Electronics Ltd (Excess)

UK . 419 parts In-Stock

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Overview

Elevate your designs with the M74HC533RM13TR from STMicroelectronics, a trusted leader in semiconductor innovation. This high-performance bus driver ensures seamless data transmission across various applications, from automotive to industrial systems. With robust reliability and exceptional thermal performance, it thrives in demanding environments. Experience enhanced efficiency and superior quality that only ST can deliver, empowering your projects for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 38 ns

A low propagation delay allows for faster data transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount technology enables efficient use of space on PCBs and is compatible with automated assembly processes.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient layout and placement on circuit boards, optimizing space utilization.

No. of Bits: 8

With an 8-bit interface, this product can handle substantial data width, suitable for various data communication tasks.

Nominal Supply Voltage / Vsup (V): 4.5

A nominal supply voltage of 4.5V makes it compatible with common digital systems, ensuring ease of integration.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF ensures efficient drive capabilities, allowing for improved signal integrity in communication.

Power Supplies (V): 2/6

Supports a wide range of power supplies, making it versatile for different system requirements.

No. of Terminals: 20

20 terminals provide ample connectivity options, supporting various configurations and applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves board space, making it ideal for compact electronic designs.

Maximum I (ol): 6 Amp

A maximum output current of 6 Amps allows this product to drive higher loads, making it suitable for demanding applications.

Propagation Delay (tpd): 265 ns

While the maximum propagation delay is longer, it ensures stable performance in less critical paths of circuit designs.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature makes this product suitable for harsh environments, enhancing reliability.

Output Characteristics: 3-STATE

The 3-state output allows for greater flexibility in bus systems, enabling multiple devices to share the same communication line.

Minimum Operating Temperature: -55 °C

A wide temperature range (-55 °C to 125 °C) ensures reliable performance in extreme environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides excellent corrosion resistance and enhances solderability for better electrical performance.

Terminal Position: DUAL

The dual terminal position offers flexible mounting options for circuit designers.

No. of Ports: 2

Having 2 ports enables communication between multiple devices without the need for additional components.

Maximum Seated Height: 2.65 mm

A low seated height helps maintain low profile in designs, ideal for compact and space-constrained applications.

Width: 7.5 mm

A moderate width allows for balanced board layouts, facilitating easier routing of connections.

Output Polarity: INVERTED

Inverted output polarity can simplify design requirements in certain applications, allowing for easier integration.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage threshold permits better compatibility with battery-operated devices and low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

A generous maximum time at peak reflow temperature allows for reliable soldering without damaging the component.

Peak Reflow Temperature °C: 260

High peak reflow temperature rating ensures compatibility with advanced PCB assembly processes.

Length: 12.8 mm

A compact length aids in space-saving designs while providing necessary electrical connectivity.

Temperature Grade: MILITARY

MIL-STD temperature grade implies robust design for military applications, ensuring high reliability under harsh conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals provide easy soldering and effective heat dissipation during operation.

Packing Method: TR

Tape and reel packing method ensures efficient handling and automated placement processes in production.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for compatibility with standard PCB designs and helps in avoiding soldering issues.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 designates a moderate level of sensitivity to moisture, suggesting careful handling to maintain reliability.

Maximum Supply Voltage (Vsup): 6 V

High maximum supply voltage enhances capability and flexibility in a range of applications, especially in power-intensive scenarios.

Technical Specifications

Bus Driver & Transceivers M74HC533RM13TR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

38 ns

Propagation Delay (tpd):

265 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

M74HC533RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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