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M74HC4050TTR

STMicroelectronics

M74HC4050TTR by STMicroelectronics

M74HC4050TTR by STMicroelectronics is a CMOS logic gate with a 23 ns propagation delay and operates b/w 2-6 V. It features 6 functions in a compact 16-terminal package, ideal for high-speed applications. Its military-grade design ensures reliability in extreme temperatures from -55 °C to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,719 parts In-Stock

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Digiode

USA . 2,778 parts In-Stock

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Anansix

USA . 341 parts In-Stock

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341

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AZTECH Wire

Italy . 1,199 parts In-Stock

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$12.120

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$12.120

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Microchip USA

USA . 444 parts In-Stock

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$25.296

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444

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IDEA Electronic Components Group

UK . 365 parts In-Stock

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$29.452

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$26.507

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365

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$26.507

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MKK Technologies

India . 575 parts In-Stock

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$55.382

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DigiPath Technology Company

USA . 575 parts In-Stock

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$55.382

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QUARKTWIN TECHNOLOGY LTD

USA . 23,885 parts In-Stock

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Perfect Parts

USA . 21,643 parts In-Stock

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Assy Fe

Spain . 12,495 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,907 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,938 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Corphita

USA . 2,961 parts In-Stock

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GreenTree Electronics

Israel . 2,396 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 2,396 parts In-Stock

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Parana Technologies

USA . 614 parts In-Stock

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$35.214

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Overview

Elevate your electronic designs with the M74HC4050TTR from STMicroelectronics, a leader in innovative technology. This high-quality logic gate delivers exceptional performance and reliability, making it ideal for a variety of applications such as signal conditioning and level shifting. Its compact surface-mount design ensures versatility, while ST’s commitment to excellence guarantees longevity and efficiency. Experience the benefits of superior engineering combined with unmatched support that empowers your projects to succeed!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction ensures durability and protection against environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 23 ns

A low propagation delay contributes to faster circuit response times, enhancing overall system performance.

Surface Mount: YES

Surface mount capability allows for compact designs and easier integration into modern PCB layouts.

No. of Functions: 6

Multiple functions in a single package increase versatility, allowing for complex logic operations within a minimal footprint.

Package Shape: RECTANGULAR

The rectangular shape optimizes space and layout on the PCB, facilitating efficient design.

Nominal Supply Voltage / Vsup (V): 4.5

Operating at a nominal supply voltage of 4.5V ensures compatibility with common power sources used in digital circuits.

Load Capacitance (CL): 50 pF

The specified load capacitance is suitable for a wide range of applications, providing flexibility in circuit design.

Power Supplies (V): 2/6

This dual voltage supply range enhances operational flexibility across different system requirements.

No. of Terminals: 16

A higher number of terminals allows for greater connectivity options and more complex functionalities on a single chip.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile save space on PCBs, which is critical for compact electronic devices.

Maximum I (ol): 4 Amp

A high output current rating enables driving larger loads, providing versatility in application.

Propagation Delay (tpd): 150 ns

Although higher than the nominal supply propagation delay, it meets the needs of many application scenarios where speed is still satisfactory.

Maximum Operating Temperature: 125 °C

A wide operating temperature range makes this component reliable in harsh environments.

Minimum Operating Temperature: -55 °C

The ability to function at low temperatures extends the product’s applicability in extreme conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This high-quality terminal finish enhances corrosion resistance and ensures better conductivity.

Terminal Position: DUAL

Dual terminal position facilitates flexible mounting options in various PCB layouts.

Maximum Seated Height: 1.2 mm

The low seated height is suitable for designs where space is a prime concern.

Width: 4.4 mm

A compact width allows for denser packing of components on a PCB.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage enables compatibility with low-power applications, making it energy-efficient.

Maximum Time At Peak Reflow Temperature (s): 40

This time specification ensures reliable soldering during assembly without damaging the component.

Peak Reflow Temperature °C: 260

Compatibility with high reflow temperatures ensures durability during PCB assembly processes.

Length: 5 mm

The short length contributes to a compact form factor, ideal for space-constrained applications.

Temperature Grade: MILITARY

Military-grade components offer durability and reliability in demanding applications, such as aerospace or defense.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, which is perfect for modern digital applications.

Terminal Form: GULL WING

Gull wing terminals facilitate better soldering and are widely accepted in surface mount technologies.

Terminal Pitch: 0.65 mm

A tighter terminal pitch allows for more compact designs, accommodating larger functionality in smaller areas.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates a balanced approach to handling and storage, allowing moderate production handling conditions.

Maximum Supply Voltage (Vsup): 6 V

The high maximum supply voltage increases compatibility with a variety of applications and enables greater flexibility in design.

Technical Specifications

Logic Gates M74HC4050TTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

23 ns

Propagation Delay (tpd):

150 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Trade Compliance

M74HC4050TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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