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M74HC373B1R

STMicroelectronics

M74HC373B1R by STMicroelectronics

STMicroelectronics M74HC373B1R is an 8-bit bus driver with 31ns propagation delay, operating at a supply voltage of 4.5V. It features 3-STATE output characteristics and is suitable for military-grade applications requiring CMOS technology and a temperature range of -55 to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,746 parts In-Stock

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Lakeview Electronics

USA . 4,175 parts In-Stock

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Anansix

USA . 2,315 parts In-Stock

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2,315

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Digiode

USA . 1,922 parts In-Stock

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Cogito LLC

Ukraine . 1,047 parts In-Stock

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ComSIT Distribution GmbH

Germany . 820 parts In-Stock

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820

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LWI Electronics Inc

India . 408 parts In-Stock

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Connector Distribution Corp

USA . 128 parts In-Stock

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128

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Right Parts Inc.

USA . 128 parts In-Stock

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128

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Executive Electronics, Inc.

USA . 90 parts In-Stock

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Zilex Electronics Inc.

Canada . 64 parts In-Stock

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Bristol Electronics

USA . 60 parts In-Stock

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Atlantic Semiconductor

USA . 36 parts In-Stock

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PC Components Company LLC

USA . 29 parts In-Stock

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Infinite Electronics LLP

India . 20 parts In-Stock

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Sea View Technologies

USA . 5 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 1,382 parts In-Stock

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$4.790

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$4.598

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$4.598

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$4.790

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$4.598

Microchip USA

USA . 181 parts In-Stock

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$10.677

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AZTECH Wire

Italy . 1,071 parts In-Stock

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$13.180

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IDEA Electronic Components Group

UK . 199 parts In-Stock

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$26.071

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$23.464

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MKK Technologies

India . 2,176 parts In-Stock

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$49.025

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DigiPath Technology Company

USA . 2,176 parts In-Stock

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$49.025

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Corphita

USA . 4,947 parts In-Stock

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Parana Technologies

USA . 791 parts In-Stock

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$31.172

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Perfect Parts

USA . 273 parts In-Stock

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Assy Fe

Spain . 1 parts In-Stock

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Overview

Unlock seamless data transfer and enhanced communication capabilities with the M74HC373B1R from STMicroelectronics. As a trusted leader in semiconductor manufacturing, STMicroelectronics ensures top-notch quality and reliability in every product. Ideal for a wide range of applications, this bus driver & transceiver offers customers unparalleled value with its 3-STATE output characteristics, true output polarity, and low propagation delay. Experience the benefits of efficient data transmission and improved system performance with the M74HC373B1R - the ultimate solution for your connectivity needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver & transceivers, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 31 ns

Low propagation delay allows for fast signal transmission, making this product suitable for time-sensitive applications.

Nominal Supply Voltage / Vsup (V): 4.5

Optimal supply voltage for efficient performance and power consumption, providing reliable operation.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, enabling multiple devices to share the same communication channel without interference.

Temperature Grade: MILITARY

Designed to withstand extreme temperature conditions, ensuring reliability in harsh environments.

Technical Specifications

Bus Driver & Transceivers M74HC373B1R attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Load Capacitance (CL):

150 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

31 ns

Propagation Delay (tpd):

265 ns

Qualification:

Not Qualified

Maximum Seated Height:

3.93 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.62 mm

Trade Compliance

M74HC373B1R Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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