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M74HC367B1R

STMicroelectronics

M74HC367B1R by STMicroelectronics

M74HC367B1R by STMicroelectronics is a 6-bit bus driver with 26ns propagation delay, operating at supply voltages from 2V to 6V. It features a 3-STATE output and is designed for military-grade applications requiring true output polarity control. The package style is in-line with dual terminal position, making it suitable for high-reliability systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,133 parts In-Stock

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Anansix

USA . 2,818 parts In-Stock

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Digiode

USA . 1,808 parts In-Stock

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R&J Components

USA . 789 parts In-Stock

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LWI Electronics Inc

India . 97 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 116 parts In-Stock

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$1.293

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Andel Nordic

Denmark . 266 parts In-Stock

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$5.358

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$5.144

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$5.144

266

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$5.144

AZTECH Wire

Italy . 1,090 parts In-Stock

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$12.950

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$12.950

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IDEA Electronic Components Group

UK . 1,199 parts In-Stock

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$25.652

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$23.087

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MKK Technologies

India . 2,162 parts In-Stock

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$48.238

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DigiPath Technology Company

USA . 2,162 parts In-Stock

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$48.238

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Perfect Parts

USA . 3,472 parts In-Stock

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Corphita

USA . 813 parts In-Stock

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Parana Technologies

USA . 112 parts In-Stock

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$30.671

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Assy Fe

Spain . 45 parts In-Stock

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Overview

Enhance your electronic designs with the M74HC367B1R bus driver and transceiver from STMicroelectronics. With a reputation for top-quality components, STMicroelectronics delivers reliable products that meet the demands of various applications. This versatile 6-bit device not only offers fast propagation delay and high output current but also features 3-state output characteristics for added flexibility. Whether you're working on industrial automation or automotive electronics, the M74HC367B1R provides the value, performance, and reliability that customers seek in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability, ensuring the product can withstand harsh environmental conditions.

Propagation Delay At Nominal Supply: 26 ns

Low propagation delay ensures faster signal transmission and response times, making the product ideal for time-sensitive applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration and compact placement within electronic systems.

No. of Bits: 6

6-bit bus driver offers sufficient data handling capability for various communication protocols and data transmission requirements.

Nominal Supply Voltage / Vsup (V): 4.5

Ideal supply voltage ensures stable and efficient operation of the bus driver and transceivers.

Load Capacitance (CL): 150 pF

The specified load capacitance ensures compatibility with various external devices and components for seamless data communication.

Power Supplies (V): 2/6

The availability of multiple power supply options allows for flexible voltage configurations based on specific application requirements.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options for interfacing with other circuitry and peripherals.

Output Characteristics: 3-STATE

3-STATE output allows for high impedance state, providing versatility in signal routing and system design.

Temperature Grade: MILITARY

Military-grade temperature range ensures reliability and performance in extreme environmental conditions, making it suitable for rugged applications.

Technical Specifications

Bus Driver & Transceivers M74HC367B1R attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Additional Features:

ONE FUNCTION WITH TWO BITS

Control Type:

ENABLE LOW

Family:

HC/UH

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Load Capacitance (CL):

150 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

6

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

26 ns

Propagation Delay (tpd):

160 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

M74HC367B1R Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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