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M74HC244TTR

STMicroelectronics

M74HC244TTR by STMicroelectronics

M74HC244TTR from STMicroelectronics is a CMOS bus driver with a 27 ns propagation delay and operates b/w 2-6 V. It features 4 bits in a compact 20-terminal package, ideal for high-speed data transmission in military applications. Its robust design supports temperatures from -55 °C to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Vyrian

USA . 5,758 parts In-Stock

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Digiode

USA . 4,550 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,380 parts In-Stock

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Bristol Electronics

USA . 2,380 parts In-Stock

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Dan-Mar Components

USA . 2,380 parts In-Stock

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Anansix

USA . 2,213 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

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Prism Electronics

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Andel Nordic

Denmark . 1,518 parts In-Stock

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$9.113

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$8.748

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$8.748

1,518

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$8.748

AZTECH Wire

Italy . 347 parts In-Stock

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$12.280

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Microchip USA

USA . 289 parts In-Stock

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$13.741

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IDEA Electronic Components Group

UK . 1,201 parts In-Stock

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$24.634

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MKK Technologies

India . 2,050 parts In-Stock

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$46.322

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DigiPath Technology Company

USA . 2,050 parts In-Stock

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$46.322

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Component Stockers USA

USA . 309 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 17,344 parts In-Stock

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Perfect Parts

USA . 13,349 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,026 parts In-Stock

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Corphita

USA . 4,396 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,017 parts In-Stock

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Parana Technologies

USA . 738 parts In-Stock

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$29.454

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Overview

Unlock superior performance with the M74HC244TTR from STMicroelectronics, a trusted leader in semiconductor solutions. This high-quality bus driver & transceiver delivers efficiency and reliability for your digital applications, ensuring seamless data flow in compact designs. With its robust temperature range and low propagation delay, it’s perfect for automotive, industrial, and consumer electronics. Elevate your projects with this advanced technology that promises durability and exceptional performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, making it suitable for various electronic applications.

Propagation Delay At Nominal Supply: 27 ns

Fast signal transmission helps in improving overall circuit performance.

Surface Mount: YES

Facilitates compact designs and efficient manufacturing processes.

No. of Functions: 2

Increases versatility by allowing multiple functions within a single chip.

Package Shape: RECTANGULAR

Offers an efficient layout for circuit board design.

No. of Bits: 4

Suitable for applications requiring compact data handling capabilities.

Nominal Supply Voltage / Vsup (V): 4.5

Optimized voltage level for balanced performance and power consumption.

Load Capacitance (CL): 50 pF

Allows for high-speed performance in applications while minimizing signal degradation.

Power Supplies (V): 2/6

Flexibility in power supply options allows for diverse applications.

No. of Terminals: 20

Provides multiple connection options for diverse circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Ideal for space-constrained applications, enhancing design efficiency.

Maximum I (ol): 6 Amp

Can handle higher current loads for robust performance in demanding applications.

Propagation Delay (tpd): 195 ns

Allows for reliable timing in high-speed data transmission applications.

Maximum Operating Temperature: 125 °C

Suitable for high-temperature environments, ensuring reliability.

Output Characteristics: 3-STATE

Flexible output options enhance system design and compatibility.

Minimum Operating Temperature: -55 °C

Ensures functionality in extreme cold conditions, ideal for military applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Enhances corrosion resistance and ensures reliable electrical connections.

Terminal Position: DUAL

Offers versatility in circuit layout and design options.

No. of Ports: 2

Allows for simultaneous data transmission, improving overall system efficiency.

Maximum Seated Height: 1.2 mm

Enables low-profile design, making it ideal for portable devices.

Width: 4.4 mm

Compact size contributes to space-saving solutions in electronic designs.

Output Polarity: TRUE

Ensures consistent output characteristics compatible with logic levels.

Minimum Supply Voltage (Vsup): 2 V

Supports low power applications, enhancing energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 40

Compatible with modern soldering processes, ensuring manufacturing reliability.

Peak Reflow Temperature °C: 260

Capable of withstanding high temperatures during soldering, maintaining integrity.

Length: 6.5 mm

Compact dimensions facilitate tighter layouts in circuit boards.

Temperature Grade: MILITARY

Meets rigorous military standards for performance and reliability.

Technology: CMOS

Low power consumption and high density make it efficient for modern applications.

Terminal Form: GULL WING

Designed for easy mounting and assembly, enhancing manufacturing efficiency.

Packing Method: TR

Optimizes space for storage and transportation, increasing logistics efficiency.

Terminal Pitch: 0.65 mm

Allows for compact placement of components on PCB, maximizing board space.

Control Type: ENABLE LOW

Provides simple and effective control in various digital applications.

Moisture Sensitivity Level (MSL): 3

Indicates moderate sensitivity to moisture, suitable for standard manufacturing processes.

Maximum Supply Voltage (Vsup): 6 V

Offers a high voltage tolerance, making it versatile in power supply applications.

Technical Specifications

Bus Driver & Transceivers M74HC244TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

27 ns

Propagation Delay (tpd):

195 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Trade Compliance

M74HC244TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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