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M74HC244RM13TR

STMicroelectronics

M74HC244RM13TR by STMicroelectronics

M74HC244RM13TR by STMicroelectronics is a CMOS bus driver featuring a 27 ns propagation delay and operates b/w 2-6 V. With 4 bits and dual ports, it supports high-speed data transmission in compact electronic designs. Ideal for military applications due to its robust temperature range (-55 °C to 125 °C).

Median Price

$1.125

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

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Component Electronics Inc.

Canada . 96 parts In-Stock

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$1.150

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$0.870

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$0.750

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96

$1.150

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ComSIT Distribution GmbH

Germany . 14,060 parts In-Stock

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Vyrian

USA . 5,376 parts In-Stock

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J2 Sourcing AB

Sweden . 3,000 parts In-Stock

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MRC Electronics

USA . 2,000 parts In-Stock

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EMSNET

USA . 1,782 parts In-Stock

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Digiode

USA . 1,113 parts In-Stock

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Goldney Electronics S.L.

Spain . 836 parts In-Stock

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Anansix

USA . 789 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 650 parts In-Stock

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650

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ACDS - Activité Composants Distribution Service

France . 582 parts In-Stock

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Bristol Electronics

USA . 545 parts In-Stock

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$1.125

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$0.630

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545

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$0.630

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Microfarads

USA . 525 parts In-Stock

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MISTER SPROCKETS

USA . 190 parts In-Stock

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LWI Electronics Inc

India . 170 parts In-Stock

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Sensible Micro Corp

USA . 100 parts In-Stock

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$0.936

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$0.864

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100

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$0.936

$0.864

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Lighthouse Electronics, Inc.

USA . 72 parts In-Stock

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Distributors (Availability)

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Benley Electronics

USA . 4 parts In-Stock

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$1.750

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4

$1.750

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Andel Nordic

Denmark . 349 parts In-Stock

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$1.766

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$1.695

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$1.695

349

$1.766

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$1.695

$1.695

AZTECH Wire

Italy . 746 parts In-Stock

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$8.380

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746

$8.380

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$11.553

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$10.513

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$9.473

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350

$11.553

$10.513

$9.473

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Microchip USA

USA . 468 parts In-Stock

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$13.018

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468

$13.018

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IDEA Electronic Components Group

UK . 1,093 parts In-Stock

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$19.547

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$17.593

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$17.593

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MKK Technologies

India . 1,133 parts In-Stock

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$36.757

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$36.757

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DigiPath Technology Company

USA . 1,133 parts In-Stock

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$36.757

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Metaverse IC Inc.

Canada . 46,835 parts In-Stock

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Perfect Parts

USA . 28,607 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 20,153 parts In-Stock

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Assy Fe

Spain . 10,900 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,512 parts In-Stock

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GreenTree Electronics

Israel . 4,836 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,341 parts In-Stock

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Kepictronics

USA . 3,763 parts In-Stock

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Corphita

USA . 3,368 parts In-Stock

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Parana Technologies

USA . 1,972 parts In-Stock

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$23.372

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$23.372

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Speed Components Ltd (Excess)

Israel . 980 parts In-Stock

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980

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Cyclops Electronics Ltd (Excess)

UK . 582 parts In-Stock

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582

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Overview

Elevate your projects with the M74HC244RM13TR from STMicroelectronics, a leading name in semiconductor innovation. This robust bus driver ensures seamless data transfer and reliability across various applications, from automotive to industrial controls. With its exceptional propagation delay and low power consumption, it provides unmatched efficiency and performance. Trust in STMicroelectronics' quality for a solution that enhances your designs and delivers long-lasting value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers excellent insulation and robustness, making it suitable for a variety of environments.

Propagation Delay At Nominal Supply: 27 ns

A low propagation delay allows for faster signal switching, ensuring high performance in data transmission.

Surface Mount: YES

Surface mount technology enables compact design and ease of automated assembly, saving space on PCBs.

No. of Functions: 2

Having multiple functions in a single device can reduce component count and complexity in the circuit design.

Package Shape: RECTANGULAR

The rectangular shape contributes to more efficient use of board space and allows for easier layout on PCB.

No. of Bits: 4

With 4 bits, this device can transmit more data simultaneously, improving overall throughput.

Nominal Supply Voltage / Vsup (V): 4.5

Operating at 4.5V provides a balance between performance and energy efficiency, suitable for many applications.

Load Capacitance (CL): 50 pF

A low load capacitance ensures fast switching times and is advantageous for high-speed applications.

Power Supplies (V): 2/6

The flexibility in power supply voltages allows for versatile application in various circuit designs.

No. of Terminals: 20

Having 20 terminals allows for a versatile connection and ensures compatibility with multiple interfaces.

Package Style (Meter): SMALL OUTLINE

Small outline packages save space and enable the integration of more components in limited areas.

Maximum I (ol): 6 Amp

A high output current capability supports various load requirements, making it suitable for demanding applications.

Propagation Delay (tpd): 195 ns

While slightly higher than nominal supply, this value still represents adequate performance for many digital applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature increases reliability in harsh environments.

Output Characteristics: 3-STATE

3-state output capability provides greater flexibility in bus systems and improved control over data lines.

Minimum Operating Temperature: -55 °C

The ability to operate at low temperatures expands application potential for military and aerospace uses.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finishes enhance solderability and reduce intermetallic compound formation, ensuring longevity.

Terminal Position: DUAL

Dual terminal positioning allows flexibility in PCB design and layout, facilitating easier integration.

No. of Ports: 2

Two ports enable connectivity between multiple devices, aiding in efficient communication in complex systems.

Maximum Seated Height: 2.65 mm

A low seated height is beneficial for compact designs and enhances compatibility with low-profile applications.

Width: 7.5 mm

A moderate width helps in maintaining layout density while providing ample PCB space for routing.

Output Polarity: TRUE

True output polarity indicates straightforward logic configuration, which is often preferred in digital designs.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage ensures that this device can operate in low-power and battery-operated applications.

Maximum Time At Peak Reflow Temperature (s): 30

A defined peak reflow time ensures the integrity of the device during soldering, improving manufacturing reliability.

Peak Reflow Temperature °C: 260

A high peak reflow temperature allows for compatibility with various soldering processes and materials.

Length: 12.8 mm

A moderate length helps in maintaining a compact footprint while providing enough surface area for functionality.

Temperature Grade: MILITARY

Military-grade temperature specifications ensure enhanced durability and reliability under extreme conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it perfect for complex logic applications.

Terminal Form: GULL WING

Gull wing terminals offer excellent mechanical stability and ease of soldering, enhancing manufacturing reliability.

Packing Method: TR

The tape and reel packing method allows for efficient handling and automated assembly processes.

Terminal Pitch: 1.27 mm

A standard terminal pitch provides compatibility with various PCB layouts and easing soldering processes.

Control Type: ENABLE LOW

Low enable control type minimizes power consumption when not in use, making it energy-efficient.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, advising proper handling for reliability in use.

Maximum Supply Voltage (Vsup): 6 V

The capability to operate at a higher voltage enhances performance adaptability across diverse applications.

Technical Specifications

Bus Driver & Transceivers M74HC244RM13TR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

27 ns

Propagation Delay (tpd):

195 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

M74HC244RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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