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M74HC175B1R

STMicroelectronics

M74HC175B1R by STMicroelectronics

M74HC175B1R by STMicroelectronics is a 4-bit latch with a supply voltage of 4.5V, operating temperature range of -55 to 125°C, and max frequency of 21MHz. It is used in military-grade applications requiring positive edge triggering and complementary output polarity.

Median Price

$0.482

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 975 parts In-Stock

1+ parts

$0.323

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975

$0.323

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Chip1Stop

Japan . 6,834 parts In-Stock

1+ parts

$0.641

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6,834

$0.641

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DigiKey

USA . 155 parts In-Stock

1+ parts

$0.710

100+ parts

$0.400

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155

$0.710

$0.400

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Verical

USA . 975 parts In-Stock

1+ parts

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$0.323

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975

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$0.323

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Distributors (In-Stock)

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Digiode

USA . 766 parts In-Stock

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$0.307

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766

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Vyrian

USA . 5,757 parts In-Stock

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5,757

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Cogito LLC

Ukraine . 5,317 parts In-Stock

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ComSIT Distribution GmbH

Germany . 4,125 parts In-Stock

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Freddi Giovanni

Italy . 3,125 parts In-Stock

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Anansix

USA . 2,126 parts In-Stock

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ECAB

Sweden . 878 parts In-Stock

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878

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LWI Electronics Inc

India . 220 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 75 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,557 parts In-Stock

1+ parts

$0.291

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1,557

$0.291

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Microchip USA

USA . 372 parts In-Stock

1+ parts

$5.850

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372

$5.850

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IDEA Electronic Components Group

UK . 1,729 parts In-Stock

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$30.611

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$27.550

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$30.611

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$27.550

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MKK Technologies

India . 896 parts In-Stock

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$57.562

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896

$57.562

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DigiPath Technology Company

USA . 896 parts In-Stock

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$57.562

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896

$57.562

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QUARKTWIN TECHNOLOGY LTD

USA . 13,844 parts In-Stock

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Perfect Parts

USA . 5,580 parts In-Stock

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5,580

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Kepictronics

USA . 3,000 parts In-Stock

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3,000

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Metaverse IC Inc.

Canada . 3,000 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Parana Technologies

USA . 2,334 parts In-Stock

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$36.600

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$36.600

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Assy Fe

Spain . 236 parts In-Stock

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Overview

Unlock the power of advanced digital circuits with the M74HC175B1R by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics offers unparalleled quality and reliability in their products, making them a trusted choice for engineers and hobbyists alike. This latch & flip-flop device boasts a range of applications, from data storage to signal synchronization, providing versatile solutions for various projects. With its high performance and efficiency, the M74HC175B1R delivers value and benefits that exceed expectations, ensuring seamless integration and optimal functionality. Elevate your designs with this innovative component and experience the advantages it brings to your creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and resistance to environmental factors, making the latch or flip-flop reliable for long-term use.

Propagation Delay (tpd): 225 ns

Low propagation delay ensures quick response time, making this latch or flip-flop suitable for high-speed applications.

Maximum Frequency At Nominal Supply: 21000000 Hz

The high maximum frequency allows for efficient operation in fast-paced systems, making this product ideal for applications requiring rapid data processing.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliable performance in extreme environmental conditions, making this latch or flip-flop suitable for rugged applications.

No. of Bits: 4

This latch or flip-flop has 4 bits, providing sufficient storage capacity for data manipulation in digital circuits.

Technical Specifications

Latches & Flip-Flops M74HC175B1R attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

21000000 Hz

Maximum I (ol):

4 Amp

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

2/6

Propagation Delay (tpd):

225 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

25 MHz

Trade Compliance

M74HC175B1R Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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