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M74HC139B1R

STMicroelectronics

M74HC139B1R by STMicroelectronics

M74HC139B1R by STMicroelectronics is a CMOS Decoder & Drivers with 2 functions, 39 ns propagation delay, and 4.5V nominal voltage. It has a MILITARY temperature grade and is suitable for applications requiring inverted output polarity and standard input conditioning in military-grade equipment.

Median Price

$0.086

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 916 parts In-Stock

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$0.086

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Verical

USA . 916 parts In-Stock

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$0.086

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Chip1Stop

Japan . 916 parts In-Stock

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Digiode

USA . 216 parts In-Stock

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$0.082

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Semi Source

USA . 6,500 parts In-Stock

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Vyrian

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ACDS - Activité Composants Distribution Service

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Bristol Electronics

USA . 1,000 parts In-Stock

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Dan-Mar Components

USA . 1,000 parts In-Stock

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Resion

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Semtec, LLC

USA . 390 parts In-Stock

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Anansix

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Prism Electronics

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J2 Sourcing AB

Sweden . 50 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 50 parts In-Stock

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LWI Electronics Inc

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Distributors (Availability)

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Corphita

USA . 4,260 parts In-Stock

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$0.077

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Component Stockers USA

USA . 2,855 parts In-Stock

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$0.180

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$0.100

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IDEA Electronic Components Group

UK . 571 parts In-Stock

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$15.135

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$13.621

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AZTECH Wire

Italy . 916 parts In-Stock

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$17.900

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MKK Technologies

India . 61 parts In-Stock

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$28.460

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DigiPath Technology Company

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QUARKTWIN TECHNOLOGY LTD

USA . 16,805 parts In-Stock

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Microchip USA

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Perfect Parts

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Infinite Electronics LLP (Excess)

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Parana Technologies

USA . 410 parts In-Stock

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Assy Fe

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Glotronic Ltd.

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Cyclops Electronics Ltd (Excess)

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Overview

Elevate your electronic design projects with the M74HC139B1R by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-notch quality and reliability. This decoder & driver offers unparalleled performance with fast propagation delay and standard input conditioning. With its inverted output polarity and military-grade temperature rating, this product is perfect for a wide range of applications. Trust STMicroelectronics to provide you with the value, benefits, and advantages you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the internal components of the decoder & drivers.

Propagation Delay At Nominal Supply: 39 ns

Allows for fast and efficient signal processing within the decoder & drivers.

Input Conditioning: STANDARD

Ensures compatibility with a wide range of input signals, making this product versatile.

Package Shape: RECTANGULAR

Facilitates easy integration into existing circuit designs.

Nominal Supply Voltage / Vsup (V): 4.5

Optimal supply voltage for efficient operation of the decoder & drivers.

Load Capacitance (CL): 50 pF

Suitable for driving typical loads in digital circuits.

Power Supplies (V): 2/6

Can be powered by a range of voltage supplies, enhancing flexibility in design.

Maximum Seated Height: 5.1 mm

Compact design allows for space-saving installation in electronic devices.

Temperature Grade: MILITARY

Suitable for use in demanding environments where temperature fluctuations are common.

Technical Specifications

Decoder & Drivers M74HC139B1R attributes and parameters. Explore more Decoder & Drivers devices from STMicroelectronics

Specs

Family:

HC/UH

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

39 ns

Propagation Delay (tpd):

195 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

M74HC139B1R Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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