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M74HC131TTR

STMicroelectronics

M74HC131TTR by STMicroelectronics

M74HC131TTR by STMicroelectronics is a CMOS decoder/driver with a 60 ns propagation delay and operates b/w 2-6 V. It features a compact 16-terminal SOIC package, ideal for high-speed applications in military environments. Its inverted output supports versatile logic designs.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Anansix

USA . 1,539 parts In-Stock

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1,539

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Vyrian

USA . 659 parts In-Stock

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659

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Digiode

USA . 374 parts In-Stock

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374

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,995 parts In-Stock

1+ parts

$21.503

100+ parts

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1k+ parts

$19.353

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1,995

$21.503

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$19.353

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MKK Technologies

India . 851 parts In-Stock

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$40.435

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851

$40.435

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DigiPath Technology Company

USA . 851 parts In-Stock

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$40.435

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851

$40.435

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Corphita

USA . 3,810 parts In-Stock

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Parana Technologies

USA . 2,067 parts In-Stock

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$25.710

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2,067

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$25.710

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Overview

Unlock the potential of your projects with the M74HC131TTR from STMicroelectronics—a leader in high-quality semiconductor solutions. This versatile decoder and driver enhances performance while offering unmatched reliability for applications ranging from automotive to industrial control. With a compact design and efficient power management, the M74HC131TTR delivers exceptional speed and efficiency, empowering you to innovate without limits. Experience excellence that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliability and protects against environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 60 ns

A short propagation delay allows for faster signal processing, improving overall system speed and efficiency.

Surface Mount: YES

This feature facilitates compact design and aids in automated assembly processes, reducing overall manufacturing costs.

Input Conditioning: STANDARD

Standard input conditioning makes integration easier with a wide range of existing circuits.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space, making it a versatile choice for various designs.

Nominal Supply Voltage / Vsup (V): 4.5

An optimal supply voltage provides consistent performance with minimal power consumption.

Load Capacitance (CL): 50 pF

A low load capacitance allows for high-speed operation, ensuring that the device can handle rapid signal changes.

Power Supplies (V): 2/6

The option to operate between 2V and 6V offers flexibility for use in different applications.

No. of Terminals: 16

A 16-terminal configuration provides ample connection points for complex circuitry, enhancing functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact package style is ideal for space-constrained applications while also supporting modern PCBs.

Maximum I (ol): 4 Amp

A high output current rating allows this device to drive larger loads, making it versatile in various applications.

Propagation Delay (tpd): 300 ns

While slightly longer, this propagation delay is still acceptable for many applications requiring reliable signal integrity.

Maximum Operating Temperature: 125 °C

High temperature tolerance ensures that the device can operate in demanding environments without failure.

Minimum Operating Temperature: -55 °C

This low-temperature operation capability makes the product suitable for harsh environmental conditions.

Terminal Finish: TIN LEAD

The tin-lead finish provides excellent solderability and protects against corrosion.

Terminal Position: DUAL

Dual terminal positioning enhances connection options, improving layout flexibility on PCBs.

Maximum Seated Height: 1.2 mm

A low seated height supports compact design requirements in modern electronic devices.

Width: 4.4 mm

The narrow width can help maintain smaller form factors for electronic assemblies.

Output Polarity: INVERTED

Inverted output polarity can be beneficial in specific applications, making it flexible for various circuit designs.

Minimum Supply Voltage (Vsup): 2 V

Allows for operation at lower power levels, which can contribute to energy savings in designs.

Length: 5 mm

This compact length further enhances the device's space-saving capabilities, crucial for advanced circuitry.

Temperature Grade: MILITARY

This high-temperature grade guarantees reliability and durability for military and aerospace applications.

Maximum Frequency At Nominal Supply: 22700000 Hz

A high operational frequency enhances the ability to process fast signals, key in high-speed digital applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to long battery life in portable devices.

Terminal Form: GULL WING

Gull wing terminals provide easy soldering and assembly, reducing production time and costs.

Packing Method: TR

Tape and reel packing enhances manufacturing efficiency and supports automatic placement processes.

Terminal Pitch: 0.65 mm

A tight terminal pitch aids in compact PCB design, allowing for more components in a given area.

Maximum Supply Voltage (Vsup): 6 V

The capability to operate at higher voltage levels allows for compatibility with a broader range of applications.

Technical Specifications

Decoder & Drivers M74HC131TTR attributes and parameters. Explore more Decoder & Drivers devices from STMicroelectronics

Specs

Family:

HC/UH

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

22700000 Hz

Maximum I (ol):

4 Amp

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

60 ns

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

M74HC131TTR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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