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M74HC11TTR

STMicroelectronics

M74HC11TTR by STMicroelectronics

M74HC11TTR by STMicroelectronics is a CMOS logic gate with 3 functions and 3 inputs, featuring a propagation delay of 26 ns. It operates b/w 2-6 V and supports load capacitance up to 50 pF. Ideal for military applications, it comes in a compact SOIC package.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 7,644 parts In-Stock

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Digiode

USA . 4,804 parts In-Stock

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Anansix

USA . 1,581 parts In-Stock

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AZTECH Wire

Italy . 1,216 parts In-Stock

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$10.320

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$10.320

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IDEA Electronic Components Group

UK . 598 parts In-Stock

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$30.318

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$27.286

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598

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$27.286

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MKK Technologies

India . 369 parts In-Stock

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$57.010

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369

$57.010

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DigiPath Technology Company

USA . 369 parts In-Stock

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$57.010

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Component Stockers USA

USA . 390 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 5,974 parts In-Stock

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Microchip USA

USA . 5,389 parts In-Stock

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Corphita

USA . 4,126 parts In-Stock

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Parana Technologies

USA . 826 parts In-Stock

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$36.249

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Overview

Unlock unmatched performance with the M74HC11TTR from STMicroelectronics—your go-to choice for reliable logic gates. Renowned for their superior quality and innovative engineering, STMicroelectronics ensures this component delivers rapid response times and exceptional durability, making it perfect for a range of applications from industrial automation to consumer electronics. Elevate your designs with advanced functionality, energy efficiency, and trusted longevity that only a leader in semiconductor technology can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection from environmental factors, making the product reliable for various applications.

Propagation Delay At Nominal Supply: 26 ns

With a fast propagation delay of 26 ns, this product can handle high-speed operations efficiently, making it ideal for applications requiring quick response times.

Surface Mount: YES

The surface mount capability allows for a compact design and simplifies PCB assembly, making it suitable for modern electronic devices.

No. of Functions: 3

Having three functions provides versatility in its use, allowing for more complex logic operations in a single component, reducing board space and component count.

No. of Inputs: 3

With three inputs, this logic gate can perform multiple logical operations, enhancing its functionality for various circuit designs.

Package Shape: RECTANGULAR

The rectangular package shape is standard and easily integratable into various circuit layouts, facilitating easier soldering and assembly.

Nominal Supply Voltage / Vsup (V): 4.5

A nominal supply voltage of 4.5 V provides compatibility with a wide range of circuits while ensuring efficient operation.

Load Capacitance (CL): 50 pF

The low load capacitance of 50 pF allows for faster switching times, which is beneficial for high-frequency applications.

Power Supplies (V): 2/6

Supporting a wide range of power supply voltages (2 to 6 V) makes this product versatile for different system requirements.

No. of Terminals: 14

The 14 terminals provide sufficient connection points for complex circuitry, enhancing the design flexibility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design allow for space-saving on PCBs, useful in compact electronic devices.

Maximum I (ol): 4 Amp

A maximum output current of 4 Amp supports power-hungry applications, enabling it to drive larger loads effectively.

Propagation Delay (tpd): 130 ns

Although the propagation delay of 130 ns is higher than the nominal supply value, it still provides reasonable performance for many applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this logic gate is suitable for high-temperature environments.

Minimum Operating Temperature: -55 °C

A wide operating temperature range (-55 °C to 125 °C) ensures reliability in extreme conditions, making it ideal for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent corrosion resistance and ensures better electrical connectivity.

Terminal Position: DUAL

Dual terminal positioning allows for improved routing flexibility on PCBs without compromising performance.

Maximum Seated Height: 1.2 mm

A maximum seated height of 1.2 mm contributes to low-profile designs, making it suitable for slim devices.

Width: 4.4 mm

The compact width of 4.4 mm aids in space conservation on PCB layouts, allowing more components to fit in limited areas.

Minimum Supply Voltage (Vsup): 2 V

The product can operate at a minimum supply voltage of 2 V, making it adaptable to low-voltage circuits.

Length: 5 mm

The 5 mm length helps in maintaining a compact design while providing sufficient space for connections.

Temperature Grade: MILITARY

MILITARY-grade classification ensures high reliability and performance under stringent conditions, ideal for critical applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high-speed operation, making it suitable for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form facilitates easier soldering and is compatible with standard PCB assembly processes.

Packing Method: TR

Packaged using TR (tape and reel), this product simplifies inventory management and automated assembly.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm enables densely packed designs while maintaining accessibility for soldering.

Maximum Supply Voltage (Vsup): 6 V

Supporting a maximum supply voltage of 6 V allows for higher performance and flexibility in design.

Technical Specifications

Logic Gates M74HC11TTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

3

No. of Inputs:

3

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

26 ns

Propagation Delay (tpd):

130 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

M74HC11TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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