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M40Z300WMQ6E

STMicroelectronics

M40Z300WMQ6E by STMicroelectronics

M40Z300WMQ6E by STMicroelectronics is a dual-channel power management IC with a supply voltage range of 2.7V to 3.6V and operates in -40 °C to 85 °C. It features a compact SO package (3.9mm x 9.9mm) and supports adjustable thresholds, ideal for industrial applications. Its surface mount design ensures efficient integration into various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,187 parts In-Stock

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4,187

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Digiode

USA . 3,293 parts In-Stock

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3,293

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Anansix

USA . 2,338 parts In-Stock

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2,338

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 227 parts In-Stock

1+ parts

$7.382

100+ parts

-

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227

$7.382

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AZTECH Wire

Italy . 598 parts In-Stock

1+ parts

$12.550

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598

$12.550

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IDEA Electronic Components Group

UK . 1,565 parts In-Stock

1+ parts

$17.255

100+ parts

-

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$15.529

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1,565

$17.255

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$15.529

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MKK Technologies

India . 1,633 parts In-Stock

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$32.446

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1,633

$32.446

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DigiPath Technology Company

USA . 1,633 parts In-Stock

1+ parts

$32.446

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1,633

$32.446

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Corphita

USA . 3,308 parts In-Stock

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3,308

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Parana Technologies

USA . 2,112 parts In-Stock

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$20.630

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2,112

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$20.630

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Overview

Elevate your projects with the M40Z300WMQ6E from STMicroelectronics—a leader in innovative power management solutions. This robust IC ensures reliability across diverse applications, from industrial automation to consumer electronics. With its compact design and impressive temperature range, it seamlessly integrates into any setup while delivering exceptional performance. Experience unmatched efficiency and precision that empower your devices to reach new heights of excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body offers durability and protection against environmental factors, making it suitable for industrial applications.

Surface Mount: YES

Surface mount technology allows for high-density configurations on PCBs, saving space and enabling simplified assembly processes.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient layout planning on PCB, promoting better thermal performance and signal integrity.

Nominal Supply Voltage (Vsup): 3 V

Operating at a nominal supply voltage of 3V ensures compatibility with a wide range of digital circuits, enhancing versatility.

Power Supplies (V): 3/3.3

Support for both 3V and 3.3V power supplies increases flexibility for various applications, allowing for seamless integration.

No. of Terminals: 16

Having 16 terminals allows for multiple connections, suitable for complex power management tasks while maintaining compactness.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to reduced PCB space requirements, enabling more compact designs and layout efficiency.

Maximum Operating Temperature: 85 °C

The ability to operate at a maximum temperature of 85 °C ensures reliability in high-temperature environments typically found in industrial settings.

Minimum Operating Temperature: -40 °C

Withstanding temperatures as low as -40 °C makes this IC suitable for extreme conditions, ensuring reliable performance in diverse applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish ensures excellent conductivity and corrosion resistance, enhancing device longevity and performance.

Terminal Position: DUAL

Dual terminal positioning improves the layout options on the PCB, allowing for more efficient routing and design flexibility.

Maximum Seated Height: 1.75 mm

A low maximum seated height ensures a compact device profile, facilitating designs with tighter form factors.

Width: 3.9 mm

A narrow width allows for placement in constrained spaces, making it suitable for miniaturized electronic devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically for power supply support, this IC enhances voltage regulation and stability in power management applications.

Minimum Supply Voltage (Vsup): 2.7 V

It can operate down to 2.7V, making it compatible with lower voltage applications, further broadening its usability.

Maximum Time At Peak Reflow Temperature (s): 30

Allowing a maximum of 30 seconds at peak reflow temperature ensures compatibility with standard soldering processes, enhancing manufacturability.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates robust thermal stability, suitable for lead-free solder processes.

Length: 9.9 mm

A compact length supports placement in small devices, making this IC ideal for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade guarantees reliability in harsh environments, ensuring consistent performance across a range of applications.

Maximum Supply Current (Isup): 4 mA

With a maximum supply current of only 4 mA, this IC is energy-efficient, contributing to lower power consumption in devices.

No. of Channels: 2

Having two channels allows for flexible power distribution and management, supporting applications with multiple load requirements.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing overall device performance.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improved mechanical stability on PCBs, further enhancing reliability.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for easier PCB layout design and compatibility with standard manufacturing processes.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate moisture sensitivity, guiding manufacturers in proper handling and storage to ensure reliability.

Maximum Supply Voltage (Vsup): 3.6 V

Supporting a maximum supply voltage of 3.6V allows for greater flexibility in design, accommodating a variety of input power sources.

Adjustable Threshold: YES

The adjustable threshold feature allows for fine-tuning the device to meet specific application requirements, enhancing its versatility.

Technical Specifications

Power Management ICs M40Z300WMQ6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

IT CAN ALSO BE OPERATED FROM A 3V TO 3.6V SUPPLY

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

4 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

M40Z300WMQ6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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