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M40Z111WMH6E

STMicroelectronics

M40Z111WMH6E by STMicroelectronics

M40Z111WMH6E by STMicroelectronics is a versatile power management IC with a nominal voltage of 3V, supporting temperatures from -40 °C to 85 °C. It features a compact 28-terminal design and adjustable thresholds for efficient power supply applications. Ideal for industrial use, it operates within a range of 2.7V to 3.6V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,641 parts In-Stock

1+ parts

-

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3,641

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Anansix

USA . 2,614 parts In-Stock

1+ parts

-

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1k+ parts

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2,614

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Vyrian

USA . 1,559 parts In-Stock

1+ parts

-

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1,559

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 346 parts In-Stock

1+ parts

$4.026

100+ parts

-

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10k+ parts

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346

$4.026

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IDEA Electronic Components Group

UK . 115 parts In-Stock

1+ parts

$18.257

100+ parts

-

1k+ parts

$16.432

10k+ parts

-

115

$18.257

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$16.432

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MKK Technologies

India . 2,358 parts In-Stock

1+ parts

$34.332

100+ parts

-

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2,358

$34.332

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DigiPath Technology Company

USA . 2,358 parts In-Stock

1+ parts

$34.332

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2,358

$34.332

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Component Stockers USA

USA . 376 parts In-Stock

1+ parts

$99.990

100+ parts

-

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376

$99.990

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Parana Technologies

USA . 1,640 parts In-Stock

1+ parts

-

100+ parts

$21.830

1k+ parts

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1,640

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$21.830

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Corphita

USA . 1,584 parts In-Stock

1+ parts

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1,584

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Overview

Elevate your projects with the M40Z111WMH6E from STMicroelectronics, a leader in power management solutions. Designed for reliability across diverse applications, this robust IC operates seamlessly in industrial environments, ensuring optimal performance from -40 °C to 85 °C. Enjoy the benefits of precise voltage regulation and energy efficiency, making it the perfect choice for powering your innovative designs while minimizing operational costs. Choose quality, choose STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material enhances reliability and protection against environmental factors.

Surface Mount: YES

Enables space-efficient designs and improved performance in modern PCB layouts.

Package Shape: RECTANGULAR

Optimizes space utilization on the PCB and allows for better integration with other components.

Nominal Supply Voltage (Vsup): 3 V

Ideal for common low-voltage applications, ensuring compatibility with numerous systems.

Power Supplies (V): 3/3.3

Versatile power supply options simplify integration with various device requirements.

No. of Terminals: 28

Provides ample connectivity options for complex functionalities in power management.

Package Style (Meter): SMALL OUTLINE

Compact design suitable for space-constrained applications without compromising performance.

Maximum Operating Temperature: 85 °C

Suitable for operations in high-temperature environments, enhancing reliability and longevity.

Minimum Operating Temperature: -40 °C

Allows operation in extreme cold environments, expanding application range.

Terminal Position: DUAL

Facilitates easier mounting and enhances layout flexibility for complex circuits.

Maximum Seated Height: 3.05 mm

Low profile design helps with compact circuit board layouts and reduces overall device height.

Width: 8.56 mm

Narrow width aids in multi-IC arrangements, optimizing space on the PCB.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specialized functionality enhances system efficiency and simplifies power management.

Minimum Supply Voltage (Vsup): 2.7 V

Wide supply voltage range allows compatibility with various applications and devices.

Length: 18.1 mm

Balanced dimensions provide good surface area for thermal management while maintaining compactness.

Temperature Grade: INDUSTRIAL

Designed for robust performance in industrial applications, ensuring long-term reliability.

Maximum Supply Current (Isup): 4 mA

Low current draw contributes to energy efficiency, making it suitable for battery-operated devices.

Technology: CMOS

Enhanced efficiency and lower power consumption compared to traditional technologies.

Terminal Form: GULL WING

The gull wing terminal design is advantageous for automated assembly processes.

Terminal Pitch: 1.27 mm

Standard pitch allows for compatibility with a wide range of PCB designs and manufacturing processes.

Maximum Supply Voltage (Vsup): 3.6 V

Flexible voltage handling capabilities provide adaptability to various system designs.

Adjustable Threshold: YES

Offers configurability for tailored performance in different applications, enhancing versatility.

Technical Specifications

Power Management ICs M40Z111WMH6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G28

Length:

18.1 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.5

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

3.05 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

4 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

8.56 mm

Trade Compliance

M40Z111WMH6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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