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M40Z300AVMH6E

STMicroelectronics

M40Z300AVMH6E by STMicroelectronics

M40Z300AVMH6E by STMicroelectronics is a power management IC designed for industrial applications, featuring a nominal voltage of 2.9V and operating temp range from -40 °C to 85 °C. It comes in a compact 28-terminal SO package with gull-wing terminals. Ideal for efficient power supply support circuits, it operates within a max voltage of 3.6V and consumes up to 4mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,760 parts In-Stock

1+ parts

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2,760

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Vyrian

USA . 2,720 parts In-Stock

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2,720

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Anansix

USA . 785 parts In-Stock

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785

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,409 parts In-Stock

1+ parts

$21.112

100+ parts

-

1k+ parts

$19.001

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1,409

$21.112

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$19.001

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MKK Technologies

India . 248 parts In-Stock

1+ parts

$39.700

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248

$39.700

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DigiPath Technology Company

USA . 248 parts In-Stock

1+ parts

$39.700

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248

$39.700

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Corphita

USA . 3,182 parts In-Stock

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3,182

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Parana Technologies

USA . 2,263 parts In-Stock

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$25.243

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2,263

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$25.243

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Overview

Unlock the potential of your designs with the M40Z300AVMH6E from STMicroelectronics—a leader in power management solutions. Engineered for reliability, this robust IC delivers exceptional efficiency across a wide range of applications, ensuring stable performance even in challenging environments. Its compact design and surface mount capability make it perfect for modern electronics. Elevate your projects with superior quality and dependability that only STMicroelectronics can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and longevity, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for smaller footprints on PCBs, enabling more compact designs.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy layout and efficient space utilization on circuit boards.

Nominal Supply Voltage (Vsup): 2.9 V

The low nominal supply voltage increases compatibility with low-power applications.

Power Supplies (V): 3.3

Support for 3.3V power supplies is standard for many digital circuits, increasing versatility.

No. of Terminals: 28

With 28 terminals, it offers extensive functionality and connectivity options.

Package Style (Meter): SMALL OUTLINE

The small outline design promotes space-saving in circuit designs while ensuring performance.

Maximum Operating Temperature: 85 °C

This high operating temperature rating makes it suitable for industrial applications where heat is a concern.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C ensures reliability in extreme environmental conditions.

Terminal Position: DUAL

Dual terminal positioning enhances connection flexibility on the PCB.

Maximum Seated Height: 3.05 mm

A low seated height allows for better integration in low-profile designs.

Width: 8.56 mm

A compact width aids in saving PCB space in densely populated areas.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically for power supply management, ensuring stable and efficient operation.

Minimum Supply Voltage (Vsup): 3 V

The minimum voltage requirement allows it to function efficiently in various applications.

Maximum Time At Peak Reflow Temperature (s): 10

The ability to withstand peak reflow temperatures ensures compatibility with standard soldering processes.

Peak Reflow Temperature °C: 260

A high peak reflow temperature indicates robustness during assembly, reducing risk of damage.

Length: 18.1 mm

The moderate length enables flexible placement on the PCB while maintaining effective functionality.

Temperature Grade: INDUSTRIAL

Industrial-grade components ensure reliability and stability in demanding environments.

Maximum Supply Current (Isup): 4 mA

A low maximum supply current contributes to energy efficiency, making it ideal for portable devices.

Technology: CMOS

CMOS technology ensures low power consumption and high speed, enhancing overall performance.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and improved mechanical stability.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch strikes a balance between compactness and ease of handling.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V offers flexibility for various power supply configurations.

Technical Specifications

Power Management ICs M40Z300AVMH6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G28

Length:

18.1 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.5

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

3.05 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

4 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

2.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

10

Width (mm):

8.56 mm

Trade Compliance

M40Z300AVMH6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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