Loading...

M40Z300AVMQ1E

STMicroelectronics

M40Z300AVMQ1E by STMicroelectronics

M40Z300AVMQ1E by STMicroelectronics is a CMOS power management IC with a nominal voltage of 2.9V and operates within 0 °C to 70 °C. It features a compact 16-terminal SO package, ideal for space-constrained applications. This versatile IC supports power supply circuits efficiently with a max current of 4mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,963 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,963

-

-

-

-

Anansix

USA . 2,852 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,852

-

-

-

-

Digiode

USA . 2,808 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,808

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,870 parts In-Stock

1+ parts

$15.776

100+ parts

-

1k+ parts

$14.199

10k+ parts

-

1,870

$15.776

-

$14.199

-

MKK Technologies

India . 1,203 parts In-Stock

1+ parts

$29.666

100+ parts

-

1k+ parts

-

10k+ parts

-

1,203

$29.666

-

-

-

DigiPath Technology Company

USA . 1,203 parts In-Stock

1+ parts

$29.666

100+ parts

-

1k+ parts

-

10k+ parts

-

1,203

$29.666

-

-

-

Corphita

USA . 4,599 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,599

-

-

-

-

Parana Technologies

USA . 780 parts In-Stock

1+ parts

-

100+ parts

$18.863

1k+ parts

-

10k+ parts

-

780

-

$18.863

-

-

Overview

Unlock the power of efficiency with the M40Z300AVMQ1E from STMicroelectronics! Renowned for its commitment to quality and innovation, STMicroelectronics delivers this versatile Power Management IC designed for seamless integration in a variety of applications. Offering exceptional reliability in temperature-sensitive environments, this compact solution ensures optimal performance while minimizing energy consumption. Elevate your designs today and experience the benefits of cutting-edge technology at your fingertips!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body provides durability and protects the internal components, making this IC reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easier and more efficient integration into compact designs, reducing overall PCB space requirements.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy layout on PCBs, making it suitable for various applications where space is a premium.

Nominal Supply Voltage (Vsup): 2.9 V

A nominal supply voltage of 2.9 V indicates flexibility for low-voltage applications, enhancing compatibility with modern electronic devices.

Power Supplies (V): 3.3

Supports a standard power supply voltage of 3.3 V, making it ideal for a wide range of digital circuits and systems.

No. of Terminals: 16

With 16 terminals, this IC can accommodate multiple connections, providing versatility in functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances board density and supports compact design requirements in modern electronic solutions.

Maximum Operating Temperature: 70 °C

An extended maximum operating temperature of 70 °C ensures reliable performance even in moderately high-temperature environments.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, the IC is suitable for a wide range of commercial applications without risk of failure.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent corrosion resistance and ensures reliable connections over time.

Terminal Position: DUAL

Dual terminal position enables flexible layout options in circuit designs, enhancing implementation strategies for various applications.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm contributes to a low-profile design, which is ideal for space-constrained applications.

Width: 3.9 mm

A compact width of 3.9 mm allows for integration into tight spaces, facilitating design in miniaturized electronic devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically as a power supply support circuit, it integrating seamlessly into power management applications.

Minimum Supply Voltage (Vsup): 3 V

A minimum supply voltage of 3 V enhances flexibility, allowing usage in various electronic applications that operate within this range.

Length: 9.9 mm

With a length of 9.9 mm, this IC fits well within compact designs, facilitating efficient circuit board layouts.

Temperature Grade: COMMERCIAL

Commercial temperature grading ensures suitability for consumer electronics, balancing performance and cost-efficiency.

Maximum Supply Current (Isup): 4 mA

A maximum supply current of 4 mA indicates low power consumption, which is essential for energy-efficient designs.

Technology: CMOS

Utilizing CMOS technology contributes to low power consumption, high noise immunity, and scalability in design applications.

Terminal Form: GULL WING

The gull wing terminal form provides excellent soldering characteristics, enhancing the reliability of the IC's connection to the PCB.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard for many designs, ensuring compatibility with existing manufacturing processes.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6 V allows for a variety of operational configurations, making it ideal for a range of power management tasks.

Technical Specifications

Power Management ICs M40Z300AVMQ1E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

4 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

2.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

M40Z300AVMQ1E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19