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M40Z300AVMH6F

STMicroelectronics

M40Z300AVMH6F by STMicroelectronics

M40Z300AVMH6F by STMicroelectronics is a CMOS power management IC designed for industrial applications. It operates within a supply voltage range of 3-3.6V, features 28 terminals, and supports temperatures from -40 °C to 85 °C. Its compact SO package ensures efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,841 parts In-Stock

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2,841

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Digiode

USA . 1,838 parts In-Stock

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1,838

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Anansix

USA . 467 parts In-Stock

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467

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 742 parts In-Stock

1+ parts

$19.270

100+ parts

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1k+ parts

$17.343

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742

$19.270

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$17.343

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MKK Technologies

India . 2,193 parts In-Stock

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$36.237

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$36.237

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DigiPath Technology Company

USA . 2,193 parts In-Stock

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$36.237

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2,193

$36.237

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Corphita

USA . 2,809 parts In-Stock

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2,809

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Parana Technologies

USA . 1,915 parts In-Stock

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$23.041

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1,915

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$23.041

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Overview

Unlock unparalleled efficiency with the M40Z300AVMH6F from STMicroelectronics, a leader in power management solutions. This versatile IC ensures stability and reliability across diverse applications, from industrial automation to consumer electronics. Its robust design withstands extreme temperatures, offering exceptional performance while minimizing energy consumption. Elevate your projects with ST's commitment to quality and innovation—where superior technology meets practical benefits for every customer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection against environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for efficient manufacturing processes, reducing PCB space and supporting automated assembly methods.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on the circuit board, allowing for easier layout and design flexibility.

Nominal Supply Voltage (Vsup): 2.9 V

A nominal supply voltage of 2.9 V ensures compatibility with a variety of low-voltage applications, enhancing operational efficiency.

Power Supplies (V): 3.3

Operating at 3.3 V is ideal for modern digital circuits, providing reliable performance for a wide range of devices.

No. of Terminals: 28

With 28 terminals, this IC offers multiple connection options, facilitating greater functionality and integration into complex systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes the footprint, making it ideal for compact and space-sensitive designs.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in various industrial environments where heat may be a concern.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC is suitable for harsh conditions, expanding its usability across diverse applications.

Terminal Position: DUAL

Dual terminal positioning allows for versatile mounting options and enhances the ease of soldering on PCBs.

Maximum Seated Height: 3.05 mm

A low maximum seated height aids in maintaining a thin profile in devices, particularly important in portable electronics.

Width: 8.56 mm

A width of 8.56 mm helps optimize layout while maintaining ease of handling during assembly processes.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC is critical for stabilizing and managing power across various electronic components.

Minimum Supply Voltage (Vsup): 3 V

The operational range starting at 3 V ensures compatibility with a broad spectrum of applications and power supply designs.

Maximum Time At Peak Reflow Temperature: 10 s

With a maximum reflow time of only 10 seconds, this IC can endure the soldering process while maintaining reliability.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C ensures compatibility with standard soldering processes, critical for high-volume production.

Length: 18.1 mm

The length of 18.1 mm strikes a balance between compactness and connectivity ease, making it suitable for various designs.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates robustness against temperature fluctuations, making it suitable for demanding applications.

Maximum Supply Current (Isup): 4 mA

A maximum supply current of just 4 mA ensures low power consumption, enhancing the energy efficiency of the overall system.

Technology: CMOS

Utilizing CMOS technology ensures low static power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals enhance solder joint reliability and facilitate easy visual inspection post-soldering.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for efficient routing and assembly, particularly helpful in densely packed PCBs.

Maximum Supply Voltage (Vsup): 3.6 V

Supporting a maximum supply voltage of 3.6 V ensures this IC can be used in a wider array of devices without the risk of damage.

Technical Specifications

Power Management ICs M40Z300AVMH6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G28

Length:

18.1 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.5

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

3.05 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

4 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

2.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

10

Width (mm):

8.56 mm

Trade Compliance

M40Z300AVMH6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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