Loading...

M40Z111WMH6F

STMicroelectronics

M40Z111WMH6F by STMicroelectronics

M40Z111WMH6F by STMicroelectronics is a versatile power management IC with a nominal voltage of 3V, operating temperature range from -40 °C to 85 °C, and supports up to 4mA current. Ideal for industrial applications, it features a compact SO package and adjustable thresholds. Its dual terminal design ensures efficient surface mounting in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,165 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,165

-

-

-

-

Anansix

USA . 2,086 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,086

-

-

-

-

Vyrian

USA . 1,661 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,661

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,306 parts In-Stock

1+ parts

$16.874

100+ parts

-

1k+ parts

$15.186

10k+ parts

-

2,306

$16.874

-

$15.186

-

MKK Technologies

India . 107 parts In-Stock

1+ parts

$31.730

100+ parts

-

1k+ parts

-

10k+ parts

-

107

$31.730

-

-

-

DigiPath Technology Company

USA . 107 parts In-Stock

1+ parts

$31.730

100+ parts

-

1k+ parts

-

10k+ parts

-

107

$31.730

-

-

-

Corphita

USA . 3,878 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,878

-

-

-

-

Parana Technologies

USA . 1,947 parts In-Stock

1+ parts

-

100+ parts

$20.175

1k+ parts

-

10k+ parts

-

1,947

-

$20.175

-

-

Overview

Elevate your designs with the M40Z111WMH6F from STMicroelectronics, a leader in power management solutions. This robust IC ensures reliable performance across diverse applications, from industrial controls to consumer electronics. Featuring a compact design and exceptional temperature resilience, it delivers efficient power support while minimizing energy consumption. Trust in STMicroelectronics' commitment to quality for a product that enhances your systems and empowers innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures reliability and longevity, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for reduced PCB space and enables automated assembly, enhancing efficiency in production.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design, maximizing space utilization on the PCB.

Nominal Supply Voltage (Vsup): 3 V

Operating at a nominal voltage of 3V ensures compatibility with a wide range of applications and devices.

Power Supplies (V): 3/3.3

Supports both 3V and 3.3V supply voltages, making it versatile for various electronic circuits.

No. of Terminals: 28

Having 28 terminals allows for extensive functionality and connectivity options within the circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for compact designs, where space is at a premium.

Maximum Operating Temperature: 85 °C

Designed to operate at high temperatures, this IC can perform reliably in harsh environments.

Minimum Operating Temperature: -40 °C

The wide temperature range (-40 °C to 85 °C) ensures stable performance in diverse environmental conditions.

Terminal Finish: MATTE TIN

Matte tin provides good solderability and corrosion resistance, enhancing the longevity of connections.

Terminal Position: DUAL

Dual terminal positions allow for flexible layout options on the PCB, making integration easier.

Maximum Seated Height: 3.05 mm

A low seated height helps maintain a slim profile, contributing to a compact end product design.

Width: 8.56 mm

A narrow width allows for space-efficient designs, accommodating tighter layouts on PCBs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, it is critical for managing power within a system, ensuring stable operation.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage makes it suitable for battery-powered applications, enhancing its versatility.

Length: 18.1 mm

The length is optimized for various applications, balancing space requirements and functionality.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates suitability for rugged applications, ensuring durability.

Maximum Supply Current (Isup): 4 mA

With a low maximum supply current, it is energy-efficient, making it ideal for low-power designs.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, providing a robust performance.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and best solder joint reliability, facilitating manufacturing.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is standard for many applications, simplifying PCB design and assembly.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6V, it provides flexibility for a wider range of applications.

Adjustable Threshold: YES

The adjustable threshold feature allows customization for specific application needs, enhancing flexibility.

Technical Specifications

Power Management ICs M40Z111WMH6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

18.1 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.5

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

3.05 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

4 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

8.56 mm

Trade Compliance

M40Z111WMH6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19