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M40Z300AVMH1E

STMicroelectronics

M40Z300AVMH1E by STMicroelectronics

M40Z300AVMH1E by STMicroelectronics is a versatile power management IC with a nominal voltage of 2.9V and supports up to 3.6V. It features a compact 28-terminal package, ideal for space-constrained applications. Operating b/w 0 °C and 70 °C, it ensures reliable performance in commercial environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,744 parts In-Stock

1+ parts

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4,744

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Digiode

USA . 2,257 parts In-Stock

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2,257

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Anansix

USA . 2,056 parts In-Stock

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2,056

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,307 parts In-Stock

1+ parts

$20.470

100+ parts

-

1k+ parts

$18.423

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1,307

$20.470

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$18.423

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MKK Technologies

India . 2,071 parts In-Stock

1+ parts

$38.492

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2,071

$38.492

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DigiPath Technology Company

USA . 2,071 parts In-Stock

1+ parts

$38.492

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2,071

$38.492

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Corphita

USA . 3,611 parts In-Stock

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3,611

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Parana Technologies

USA . 2,144 parts In-Stock

1+ parts

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100+ parts

$24.475

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2,144

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$24.475

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Overview

Unlock the potential of your designs with the M40Z300AVMH1E from STMicroelectronics, a leader in innovative power management solutions. This compact, high-performance IC ensures reliability and efficiency, making it perfect for a wide range of applications—from consumer electronics to industrial systems. With ST’s commitment to quality and state-of-the-art technology, elevate your projects with enhanced performance while enjoying reduced power consumption and increased longevity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability, making it suitable for various applications in power management.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of board space, making it ideal for space-constrained applications.

Package Shape: RECTANGULAR

The rectangular package shape aids in efficient thermal management and allows for easy integration into PCB layouts.

Nominal Supply Voltage (Vsup): 2.9 V

Operating around this nominal voltage enhances efficiency for low-power applications, especially in battery-operated devices.

Power Supplies (V): 3.3

The compatibility with 3.3V power supplies is widely used in modern electronics, ensuring versatility in various designs.

No. of Terminals: 28

A 28-terminal configuration allows for robust connectivity options, facilitating complex circuit designs and functionalities.

Package Style (Meter): SMALL OUTLINE

The small outline package style supports high-density designs, appealing to modern portable electronics.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliability in standard environments, suitable for consumer electronics.

Minimum Operating Temperature: 0 °C

This wide temperature range indicates good performance in a variety of operating conditions, adding to the product's adaptability.

Terminal Position: DUAL

Dual terminal positioning enhances the performance characteristics by providing better connectivity and soldering quality.

Maximum Seated Height: 3.05 mm

The compact seated height allows for low-profile designs, making it an ideal choice for space-constrained applications.

Width: 8.56 mm

The width is optimized for fitting into various designs without compromising layout flexibility.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specializing as a power supply support circuit means it can provide effective voltage regulation and support for power management tasks.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage ensures functionality with a range of power sources, making it versatile for different applications.

Maximum Time At Peak Reflow Temperature (s): 10

This specification indicates compatibility with most standard soldering processes, ensuring ease of manufacturing.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C allows robust soldering capabilities, offering a reliable assembly process.

Length: 18.1 mm

The product length allows for a balance of compactness while accommodating sufficient terminal connections.

Temperature Grade: COMMERCIAL

Commercial temperature grade signifies suitability for general use, ensuring dependable performance in consumer applications.

Maximum Supply Current (Isup): 4 mA

A maximum supply current of 4 mA denotes low power consumption, ideal for energy-efficient designs.

Technology: CMOS

Utilizing CMOS technology ensures low power operation and high efficiency, which is critical for modern electronic devices.

Terminal Form: GULL WING

Gull wing terminals promote ease of soldering and improve mechanical stability, enhancing assembly reliability.

Terminal Pitch: 1.27 mm

The standard terminal pitch allows for compatibility with common PCB layouts and promotes ease of handling during assembly.

Maximum Supply Voltage (Vsup): 3.6 V

Supporting a maximum supply voltage of 3.6 V ensures the device can handle slight voltage variations, increasing its reliability.

Technical Specifications

Power Management ICs M40Z300AVMH1E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G28

Length:

18.1 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.5

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

3.05 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

4 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

2.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

10

Width (mm):

8.56 mm

Trade Compliance

M40Z300AVMH1E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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