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M3005AB1

STMicroelectronics

M3005AB1 by STMicroelectronics

M3005AB1 by STMicroelectronics is a CMOS transmitter IC designed for infrared remote control applications. It operates b/w 4-12V, with a max temp of 70 °C and features a compact rectangular package (7.62mm width). Ideal for consumer electronics, it ensures reliable performance in various environments.

Median Price

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Lifecycle Status

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Digiode

USA . 4,664 parts In-Stock

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Vyrian

USA . 4,388 parts In-Stock

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ECAB

Sweden . 614 parts In-Stock

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Anansix

USA . 440 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 21 parts In-Stock

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Huijzer Components

Netherlands . 10 parts In-Stock

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GES GmbH

Germany . 4 parts In-Stock

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LittleDiode

UK . 2 parts In-Stock

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IDEA Electronic Components Group

UK . 593 parts In-Stock

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$2.523

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MKK Technologies

India . 1,854 parts In-Stock

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DigiPath Technology Company

USA . 1,854 parts In-Stock

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Corphita

USA . 4,624 parts In-Stock

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Parana Technologies

USA . 707 parts In-Stock

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Assy Fe

Spain . 114 parts In-Stock

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Overview

Elevate your designs with the M3005AB1 from STMicroelectronics, a leader in high-quality semiconductor solutions. This versatile remote control IC delivers exceptional infrared transmission performance, ensuring seamless connectivity for a range of applications from consumer electronics to automation systems. With robust temperature resilience and user-friendly integration, the M3005AB1 empowers you to create reliable, innovative products that enhance user experiences while reducing development time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body ensures reliability and protection against environmental factors, making it suitable for various applications.

Transmission Media: INFRARED

Infrared transmission allows for effective line-of-sight communication, which is essential for remote control functionality.

Package Shape: RECTANGULAR

The rectangular package design optimizes space and simplifies integration in various electronic devices.

General IC Type: TRANSMITTER IC

As a transmitter IC, this product is specifically designed for sending signals efficiently, making it ideal for remote control applications.

Power Supplies (V): 4/12

Supports a wide voltage range (4V to 12V), providing versatility for different power supply scenarios in remote control systems.

No. of Terminals: 20

With 20 terminals, it offers ample connectivity options for peripherals, enhancing its functionality in custom designs.

Package Style (Meter): IN-LINE

In-line package style allows for easier placement on PCBs, ensuring efficient manufacturing and assembly processes.

Maximum Operating Temperature: 70 °C

Operational at up to 70 °C, it can function in a variety of environments without overheating, increasing its reliability in real-world conditions.

Minimum Operating Temperature: -20 °C

With a minimum operating temperature of -20 °C, it is suitable for applications in colder environments, enhancing its usability.

Terminal Finish: TIN LEAD

The tin-lead terminal finish improves solderability, which can result in more reliable connections during assembly.

Terminal Position: DUAL

Dual terminal position enhances design flexibility, allowing for different mounting options on PCBs for optimal layout.

Maximum Seated Height: 3.93 mm

A low seated height ensures compatibility with compact designs, making it easier to integrate into space-constrained environments.

Width: 7.62 mm

The 7.62 mm width helps facilitate optimal placement on various circuit boards, making it suitable for different designs.

Minimum Supply Voltage (Vsup): 4 V

A minimum supply voltage of 4V provides flexibility for operation in battery-powered applications.

Temperature Grade: COMMERCIAL

Commercial temperature grade makes it suitable for general consumer electronics, ensuring stable performance in typical environments.

Technology: CMOS

Utilizing CMOS technology enhances energy efficiency, making it an excellent choice for battery-operated devices.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust mechanical support and is ideal for a variety of mounting techniques.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is a standard size that facilitates easy connectivity and compatibility with existing designs.

Maximum Supply Voltage (Vsup): 11 V

With a maximum supply voltage of 11V, it can accommodate a range of power requirements, making it versatile for different applications.

Technical Specifications

Remote Control ICs M3005AB1 attributes and parameters. Explore more Remote Control ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e0

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

4/12

Qualification:

Not Qualified

Maximum Seated Height:

3.93 mm

Sub-Category:

Remote Control ICs

Maximum Supply Voltage (Vsup):

11 V

Minimum Supply Voltage (Vsup):

4 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Transmission Media:

INFRARED

Width:

7.62 mm

Trade Compliance

M3005AB1 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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