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MC145027DW

NXP Semiconductors

MC145027DW by NXP Semiconductors

RECEIVER IC; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; No. of Functions: 1;

Median Price

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Lifecycle Status

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Digiode

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Anansix

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ComSIT Distribution GmbH

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Fibra_Brandt Electronic GMBH

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ACDS - Activité Composants Distribution Service

France . 46 parts In-Stock

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Cogito LLC

Ukraine . 23 parts In-Stock

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Prism Electronics

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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GES GmbH

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LittleDiode

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One Stop Electronics

USA . 2,331 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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A-Z Elektronik GmbH

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Microchip USA

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Metaverse IC Inc.

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Perfect Parts

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Corphita

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

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Technical Specifications

Remote Control ICs MC145027DW attributes and parameters. Explore more Remote Control ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

1.2 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Transmission Media:

INFRARED; RF; ULTRA SOUND

Width:

7.5 mm

Trade Compliance

MC145027DW General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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