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MC145028DW

NXP Semiconductors

MC145028DW by NXP Semiconductors

RECEIVER IC; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Bristol Electronics

USA . 5,167 parts In-Stock

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Digiode

USA . 4,676 parts In-Stock

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Vyrian

USA . 4,226 parts In-Stock

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Anansix

USA . 908 parts In-Stock

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Electronics Depot

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ACDS - Activité Composants Distribution Service

France . 109 parts In-Stock

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LittleDiode

UK . 5 parts In-Stock

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One Stop Electronics

USA . 1,063 parts In-Stock

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$13.800

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Microchip USA

USA . 287 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 15,915 parts In-Stock

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UNI Independent Distributors

Spain . 5,057 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,970 parts In-Stock

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Metaverse IC Inc.

Canada . 1,850 parts In-Stock

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Benley Electronics

USA . 1,588 parts In-Stock

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Kepictronics

USA . 1,318 parts In-Stock

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Corphita

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Eliminating Global Boundries, Inc

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Technical Specifications

Remote Control ICs MC145028DW attributes and parameters. Explore more Remote Control ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

1.2 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Transmission Media:

INFRARED; RF; ULTRA SOUND

Width:

7.5 mm

Trade Compliance

MC145028DW General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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