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TDA2320D

STMicroelectronics

TDA2320D by STMicroelectronics

TDA2320D by STMicroelectronics is a compact infrared remote control IC designed for industrial applications. It operates b/w 4-20V, supports dual functions, and withstands temperatures from -40 °C to 105 °C. Its small outline package ensures efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,583 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,583

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-

-

-

Anansix

USA . 2,260 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,260

-

-

-

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Vyrian

USA . 535 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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535

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,531 parts In-Stock

1+ parts

$1.589

100+ parts

-

1k+ parts

$1.430

10k+ parts

-

1,531

$1.589

-

$1.430

-

MKK Technologies

India . 1,086 parts In-Stock

1+ parts

$2.988

100+ parts

-

1k+ parts

-

10k+ parts

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1,086

$2.988

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DigiPath Technology Company

USA . 1,086 parts In-Stock

1+ parts

$2.988

100+ parts

-

1k+ parts

-

10k+ parts

-

1,086

$2.988

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-

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Corphita

USA . 4,363 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,363

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Parana Technologies

USA . 15 parts In-Stock

1+ parts

-

100+ parts

$1.900

1k+ parts

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10k+ parts

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15

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$1.900

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Overview

Unlock seamless control with the TDA2320D from STMicroelectronics, a leader in innovative semiconductor solutions. This compact remote control IC offers unmatched reliability for diverse applications, ensuring your devices respond effortlessly. With superior thermal performance and low power consumption, it enhances user experience while reducing operational costs. Choose TDA2320D for quality, efficiency, and the trusted legacy of STMicroelectronics—where excellence meets technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction ensures reliability and robustness in various environments, making it suitable for industrial applications.

Surface Mount: YES

Surface mount capability allows for easier integration into compact designs, facilitating modern manufacturing processes and saving space on PCBs.

No. of Functions: 2

With two functions, this IC provides versatility in remote control applications, allowing for simplified design and enhanced functionality.

Transmission Media: INFRARED

Using infrared transmission provides a reliable and established method for communication in remote control systems, minimizing interference from other technologies.

Package Shape: RECTANGULAR

The rectangular package shape is standard and allows easy placement on PCBs, providing better layout options in electronic designs.

General IC Type: SUPPORT CIRCUIT

As a support circuit IC, it aids in managing various functions, making it an essential component for a functional remote control system.

Power Supplies (V): 5

Operating at a nominal supply voltage of 5V enhances compatibility with common power sources in remote control applications.

No. of Terminals: 8

Eight terminals provide ample connectivity options for integrating with other components, enhancing the overall functionality of the circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style optimizes space on printed circuit boards, allowing for denser layouts in consumer electronics.

Maximum Operating Temperature: 105 °C

A maximum operating temperature of 105 °C ensures reliable performance even in high-temperature environments, ideal for challenging industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC is suitable for use in extreme conditions, expanding its applications in outdoor or harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish improves solderability and corrosion resistance, ensuring long-term reliability in connections.

Terminal Position: DUAL

Dual terminal position allows for flexible PCB design options, accommodating various layout requirements in electronic devices.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm contributes to a low-profile design, essential for slim devices and compact electronic systems.

Width: 3.9 mm

At just 3.9 mm wide, this IC can fit easily into tight spaces while maintaining effectiveness, perfect for modern electronic designs.

Minimum Supply Voltage (Vsup): 4 V

The minimum supply voltage of 4V ensures compatibility with a range of power options, enhancing versatility in different applications.

Length: 4.9 mm

With a compact length of 4.9 mm, this IC is ideal for small-form-factor devices where space is at a premium.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grades, this product can withstand harsh conditions, making it reliable in demanding environments.

Technology: BIPOLAR

Bipolar technology provides better performance in terms of speed and power handling, making it suitable for efficient signal processing.

Terminal Form: GULL WING

The gull wing terminal formType allows for easy reflow soldering, enhancing manufacturability and ensuring solid electrical connections.

Maximum Supply Current: 2 mA

A maximum supply current of only 2 mA ensures low power consumption, making it an efficient choice for battery-operated devices.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm offers a compact configuration that improves layout density while ensuring sufficient spacing for reliable soldering.

Maximum Supply Voltage (Vsup): 20 V

Supporting a maximum supply voltage of 20V makes this IC versatile for a range of applications that demand higher operational voltages.

Technical Specifications

Remote Control ICs TDA2320D attributes and parameters. Explore more Remote Control ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Remote Control ICs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

4 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Transmission Media:

INFRARED

Width:

3.9 mm

Trade Compliance

TDA2320D General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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