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TRF1410DWR

Texas Instruments

TRF1410DWR by Texas Instruments

TRF1410DWR by Texas Instruments is a Remote Control IC with RF transmission media. It features 20 terminals, operates b/w -40 to 85 °C, and has a supply voltage range of 4.5V to 5.5V. Ideal for industrial applications requiring a compact SMALL OUTLINE package design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,349 parts In-Stock

1+ parts

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5,349

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Digiode

USA . 1,682 parts In-Stock

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1,682

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 873 parts In-Stock

1+ parts

$2.972

100+ parts

-

1k+ parts

$3.472

10k+ parts

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873

$2.972

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$3.472

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DigiPath Technology Company

USA . 2,369 parts In-Stock

1+ parts

$3.272

100+ parts

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2,369

$3.272

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ChromeModa Solutions

Germany . 5,949 parts In-Stock

1+ parts

$3.339

100+ parts

$2.738

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5,949

$3.339

$2.738

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IDEA Electronic Components Group

UK . 669 parts In-Stock

1+ parts

$3.339

100+ parts

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1k+ parts

$3.005

10k+ parts

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669

$3.339

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$3.005

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AZTECH Wire

Italy . 381 parts In-Stock

1+ parts

$6.479

100+ parts

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381

$6.479

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One Stop Electronics

USA . 998 parts In-Stock

1+ parts

$18.800

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998

$18.800

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Corphita

USA . 2,811 parts In-Stock

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2,811

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Overview

Elevate your remote control experience with the TRF1410DWR by Texas Instruments. Known for their top-quality manufacturing, Texas Instruments delivers cutting-edge Remote Control ICs that are unmatched in performance and reliability. The TRF1410DWR offers seamless RF transmission, compact design, and industrial-grade temperature tolerance, making it ideal for a wide range of applications. Elevate your remote control systems with the value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Makes it easier for installation and integration into electronic devices, saving time and effort.

Transmission Media: RF

Uses radio frequency transmission for efficient and reliable communication between the remote control and the device, minimizing interference.

Package Shape: RECTANGULAR

Compact rectangular shape allows for easy placement and positioning within electronic devices.

General IC Type: RECEIVER IC

Specifically designed for receiving signals, making it ideal for remote control applications.

No. of Terminals: 20

Provides a sufficient number of connection points for various functionalities, enhancing flexibility in design and use.

Package Style (Meter): SMALL OUTLINE

Compact design saves space in electronic devices and facilitates efficient circuit board layout.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, ensuring reliable performance even in harsh environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in low temperatures, making it suitable for a wide range of operating conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and backup options for connectivity, improving reliability.

Maximum Seated Height: 2.65 mm

Low profile design allows for slim and sleek integration into electronic devices.

Width: 7.5 mm

Narrow width makes it suitable for compact electronic devices where space is limited.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage requirement enables operation in devices with limited power availability.

Length: 12.8 mm

Compact length fits well within the constraints of modern electronic devices.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial operating conditions, ensuring reliability in demanding environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminals provide secure and reliable connections, reducing the risk of signal loss or disconnection.

Terminal Pitch: 1.27 mm

Close terminal pitch allows for dense packaging and integration into small circuit board designs.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage capability provides flexibility for use in a variety of electronic devices.

Technical Specifications

Remote Control ICs TRF1410DWR attributes and parameters. Explore more Remote Control ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Transmission Media:

RF

Width:

7.5 mm

Trade Compliance

TRF1410DWR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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