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M3005B1

STMicroelectronics

M3005B1 by STMicroelectronics

STMicroelectronics' M3005B1 is a REMOTE CONTROL TRANSMITTER IC in PLASTIC/EPOXY package with 20 terminals. Operating temp range: 0-70 °C, power supply: 4/10V. Ideal for remote control applications due to its CMOS technology and IN-LINE package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,668 parts In-Stock

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Digiode

USA . 2,915 parts In-Stock

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ECAB

Sweden . 674 parts In-Stock

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Anansix

USA . 233 parts In-Stock

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Q Components

USA . 55 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 34 parts In-Stock

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Huijzer Components

Netherlands . 1 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,257 parts In-Stock

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$2.266

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$2.039

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MKK Technologies

India . 1,834 parts In-Stock

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$4.261

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DigiPath Technology Company

USA . 1,834 parts In-Stock

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$4.261

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Corphita

USA . 1,163 parts In-Stock

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Parana Technologies

USA . 435 parts In-Stock

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$2.709

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Assy Fe

Spain . 1 parts In-Stock

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Overview

Enhance the functionality of your remote control devices with the M3005B1 from STMicroelectronics. Known for their top-notch quality and reliability, STMicroelectronics delivers innovative solutions for various applications in the electronics industry. The M3005B1 is designed to provide seamless performance and efficiency, making it an ideal choice for remote control transmitter ICs. With its durable plastic/epoxy package body material and commercial temperature grade, this product ensures long-lasting durability and stable operation. Upgrade your remote control systems today with the M3005B1 and experience the unmatched value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and enhances the product's resistance to physical damage, making it suitable for long-term use.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and placement within electronic devices, contributing to efficient usage of space.

General IC Type: REMOTE CONTROL TRANSMITTER IC

Specifically designed for remote control applications, ensuring optimal performance and compatibility with various remote control devices.

Power Supplies (V): 4/10

Supports a range of power supplies from 4V to 10V, offering flexibility in power input options for different types of electronic systems.

No. of Terminals: 20

Having 20 terminals allows for a wide range of connections and functions, making the IC versatile and adaptable to various control requirements.

Package Style (Meter): IN-LINE

In-line package style simplifies the installation and connection process, making it easier to integrate the IC into existing electronic systems.

Maximum Operating Temperature: 70 °C

Capable of operating at temperatures up to 70 °C, ensuring reliability and performance under varying environmental conditions.

Minimum Operating Temperature: 0 °C

Operational down to 0 °C, making it suitable for a wide range of applications in different climates and environments.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish offers good solderability and conductivity, ensuring stable connections and optimal signal transmission.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves the reliability of connections, reducing the risk of signal loss or disconnection.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that the IC is suitable for standard commercial applications, offering a balance of performance and cost-effectiveness.

Technology: CMOS

CMOS technology provides low power consumption, high speed, and noise immunity, making the IC energy-efficient and reliable for remote control functionality.

Terminal Form: THROUGH-HOLE

Through-hole terminal form is easy to solder and secure, ensuring strong connections and preventing potential damage during installation or operation.

Terminal Pitch: 2.54 mm

Terminal pitch of 2.54 mm allows for easy connections and compatibility with standard PCB layouts, facilitating integration into electronic systems.

Technical Specifications

Remote Control ICs M3005B1 attributes and parameters. Explore more Remote Control ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e0

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

4/10

Qualification:

Not Qualified

Sub-Category:

Remote Control ICs

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

M3005B1 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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