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M3005LAB1

STMicroelectronics

M3005LAB1 by STMicroelectronics

M3005LAB1 by STMicroelectronics is a CMOS transmitter IC designed for infrared remote control applications. It operates b/w 2V and 6.5V, with a max temp of 70 °C and features a compact rectangular package (7.62mm wide). Ideal for consumer electronics, it ensures reliable performance in various devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,860 parts In-Stock

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2,860

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Digiode

USA . 2,079 parts In-Stock

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2,079

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Anansix

USA . 1,047 parts In-Stock

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1,047

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ECAB

Sweden . 319 parts In-Stock

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319

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,076 parts In-Stock

1+ parts

$2.961

100+ parts

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$2.665

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2,076

$2.961

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$2.665

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MKK Technologies

India . 181 parts In-Stock

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$5.567

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181

$5.567

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DigiPath Technology Company

USA . 181 parts In-Stock

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$5.567

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181

$5.567

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Corphita

USA . 4,890 parts In-Stock

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4,890

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Assy Fe

Spain . 62 parts In-Stock

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62

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Parana Technologies

USA . 8 parts In-Stock

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$3.540

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$3.540

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Overview

Elevate your remote control solutions with the M3005LAB1 from STMicroelectronics, a leader in semiconductor innovation. This high-quality infrared transmitter IC combines robust performance with exceptional reliability, designed to thrive in diverse applications and environments. With its efficient power supply range and durable construction, it ensures seamless operation while minimizing energy consumption. Experience unparalleled value and peace of mind knowing you’re backed by the expertise of a trusted manufacturer!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body ensures robustness and protection against environmental factors, making it ideal for various applications.

Transmission Media: INFRARED

Infrared transmission is widely used for remote controls, providing reliable performance and reducing interference from other signals.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of PCB space, accommodating compact designs in consumer electronics.

General IC Type: TRANSMITTER IC

As a transmitter IC, it is specifically designed for remote control applications, ensuring optimal performance in sending signals.

Power Supplies (V): 2/6.5

With a wide power supply range, the IC can operate in various devices requiring different voltage levels, enhancing versatility.

No. of Terminals: 20

The 20 terminals provide ample connectivity options, allowing for complex designs and functionalities in applications.

Package Style (Meter): IN-LINE

The in-line package style simplifies the integration into PCBs, facilitating assembly and reducing manufacturing complexity.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliability in warmer environments, suitable for diverse applications and conditions.

Minimum Operating Temperature: -20 °C

A low minimum operating temperature means this IC can function effectively in colder climates, broadening its usability.

Terminal Finish: TIN LEAD

The tin-lead finish offers excellent solderability and reliability, ensuring stable performance over time in electronic circuits.

Terminal Position: DUAL

Dual terminal positioning enhances flexibility in circuit design and layout, improving ease of installation.

Maximum Seated Height: 3.93 mm

A low seated height allows for surface mount designs, contributing to lower profile devices and space-efficient placements.

Width: 7.62 mm

A compact width aids in design engineering, allowing for tighter packing of components on the PCB without sacrificing performance.

Minimum Supply Voltage (Vsup): 2 V

Supports low supply voltages, making it suitable for battery-operated devices and energy-efficient applications.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates reliability in standard operating conditions, meeting the needs of consumer electronics.

Technology: CMOS

Using CMOS technology means lower power consumption and higher integration, resulting in better efficiency and longer battery life.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust mechanical support and easier handling during assembly processes.

Terminal Pitch: 2.54 mm

A 2.54 mm terminal pitch is a standard size, promoting compatibility with various circuit boards and simplifying assembly.

Maximum Supply Voltage (Vsup): 6.5 V

The capability to operate up to 6.5 V allows for compatibility with a broad range of devices, making it a versatile choice for designers.

Technical Specifications

Remote Control ICs M3005LAB1 attributes and parameters. Explore more Remote Control ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e0

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6.5

Qualification:

Not Qualified

Maximum Seated Height:

3.93 mm

Sub-Category:

Remote Control ICs

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Transmission Media:

INFRARED

Width:

7.62 mm

Trade Compliance

M3005LAB1 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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