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M3005LD

STMicroelectronics

M3005LD by STMicroelectronics

M3005LD by STMicroelectronics is a CMOS transmitter IC designed for infrared remote control applications. It operates b/w 2V and 6.5V, with a max temp of 70 °C and features a compact SO package (7.5mm x 12.8mm). Ideal for consumer electronics, it ensures reliable performance in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,643 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,643

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-

-

-

Digiode

USA . 1,854 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,854

-

-

-

-

Vyrian

USA . 1,514 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,514

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,124 parts In-Stock

1+ parts

$0.696

100+ parts

-

1k+ parts

$0.627

10k+ parts

-

1,124

$0.696

-

$0.627

-

MKK Technologies

India . 1,431 parts In-Stock

1+ parts

$1.310

100+ parts

-

1k+ parts

-

10k+ parts

-

1,431

$1.310

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-

-

DigiPath Technology Company

USA . 1,431 parts In-Stock

1+ parts

$1.310

100+ parts

-

1k+ parts

-

10k+ parts

-

1,431

$1.310

-

-

-

Corphita

USA . 4,272 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,272

-

-

-

-

Parana Technologies

USA . 997 parts In-Stock

1+ parts

-

100+ parts

$0.833

1k+ parts

-

10k+ parts

-

997

-

$0.833

-

-

Overview

Elevate your remote control projects with the M3005LD from STMicroelectronics, a trusted leader in innovative technology. This high-quality infrared transmitter IC combines reliability with superior performance, fitting seamlessly into various applications, from home automation to consumer electronics. Enjoy enhanced energy efficiency and compact design, ensuring your devices operate flawlessly while adding value to your designs. Choose M3005LD for excellence that speaks for itself!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resistance to environmental factors, making it suitable for various consumer applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern PCBs, facilitating efficient manufacturing processes.

Transmission Media: INFRARED

Infrared transmission is ideal for remote control applications, ensuring reliable communication without interference from radio frequencies.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on circuit boards, making it easier to design compact electronic devices.

General IC Type: TRANSMITTER IC

As a transmitter IC, this component is specifically designed for sending signals, ensuring high performance in remote control devices.

Power Supplies: 2/6.5 V

Wide input voltage range allows for flexibility in various applications, accommodating different power supply requirements.

No. of Terminals: 20

Having 20 terminals allows for multiple functionalities and connections, making it versatile for complex designs.

Package Style: SMALL OUTLINE

The small outline package style minimizes space usage on printed circuit boards, essential for modern electronics where size is critical.

Maximum Operating Temperature: 70 °C

An operating temperature limit of 70 °C ensures reliability in various environmental conditions typically found in consumer electronics.

Minimum Operating Temperature: -20 °C

With an operating temperature limit of -20 °C, this IC is suitable for applications in colder environments, enhancing its versatility.

Terminal Finish: TIN LEAD

Tin lead terminal finish ensures good solderability and electrical performance, providing reliable connections in a broad range of applications.

Terminal Position: DUAL

Dual terminal positioning aids in improved layout and space utilization on the PCB, leading to more efficient circuit designs.

Maximum Seated Height: 2.65 mm

A low seated height facilitates compact designs, allowing for slimmer remote control devices.

Width: 7.5 mm

The narrow width makes this IC a good fit for space-constrained applications, supporting sleek device designs.

Minimum Supply Voltage: 2 V

The minimum supply voltage of 2 V supports battery-powered applications, enhancing energy efficiency in remote controls.

Length: 12.8 mm

Compact length makes it suitable for modern small electronic designs, providing convenience for manufacturers.

Temperature Grade: COMMERCIAL

Commercial temperature grade specification ensures reliability for everyday consumer applications.

Technology: CMOS

CMOS technology contributes to low power consumption and high noise immunity, vital for battery-operated remote control applications.

Terminal Form: GULL WING

Gull wing terminal form aids in easy soldering and assembly while ensuring stable mounting on PCBs.

Terminal Pitch: 1.27 mm

1.27 mm terminal pitch allows for high-density interconnections on PCBs, making this IC suitable for compact electronic devices.

Maximum Supply Voltage: 6.5 V

A maximum supply voltage of 6.5 V provides flexibility in application design, enabling use with various power supplies.

Technical Specifications

Remote Control ICs M3005LD attributes and parameters. Explore more Remote Control ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Length:

12.8 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2/6.5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Remote Control ICs

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Transmission Media:

INFRARED

Width:

7.5 mm

Trade Compliance

M3005LD General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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