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M3004AB1

STMicroelectronics

M3004AB1 by STMicroelectronics

M3004AB1 by STMicroelectronics is a CMOS transmitter IC designed for infrared remote control applications. It operates b/w 4-12 V, with a max temp of 70 °C and features a compact in-line package with 20 terminals. Ideal for consumer electronics, it ensures reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,412 parts In-Stock

1+ parts

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2,412

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Anansix

USA . 669 parts In-Stock

1+ parts

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669

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Digiode

USA . 240 parts In-Stock

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240

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Corel Iberica Componentes, S.L.

Spain . 19 parts In-Stock

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19

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,534 parts In-Stock

1+ parts

$1.763

100+ parts

-

1k+ parts

$1.586

10k+ parts

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1,534

$1.763

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$1.586

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MKK Technologies

India . 1,512 parts In-Stock

1+ parts

$3.315

100+ parts

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1,512

$3.315

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DigiPath Technology Company

USA . 1,512 parts In-Stock

1+ parts

$3.315

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1,512

$3.315

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Corphita

USA . 3,636 parts In-Stock

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3,636

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Parana Technologies

USA . 2,245 parts In-Stock

1+ parts

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100+ parts

$2.108

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2,245

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$2.108

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Assy Fe

Spain . 39 parts In-Stock

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39

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Overview

Elevate your remote control designs with the M3004AB1 from STMicroelectronics, a trusted leader in semiconductor innovation. This high-quality transmitter IC ensures reliable infrared communication, making it ideal for a variety of applications, from consumer electronics to industrial automation. With its robust temperature range and efficient power supply options, you gain flexibility and performance, empowering your projects to thrive in any environment. Experience unparalleled quality and support that only STMicroelectronics can provide!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides excellent durability and protection against environmental factors, making it suitable for various applications.

Transmission Media: INFRARED

Infrared transmission allows for wireless communication without interference from other signals, ensuring reliable performance in remote control applications.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient and can easily fit into compact designs, making it ideal for integration into various devices.

General IC Type: TRANSMITTER IC

As a transmitter IC, this product is specifically designed for sending signals, making it a vital component in remote controls.

Power Supplies (V): 4/12

The wide range of power supply options (4V to 12V) offers flexibility in design, accommodating various system requirements.

No. of Terminals: 20

With 20 terminals, this IC provides ample connection points for interfacing with other components, enhancing versatility in application.

Package Style (Meter): IN-LINE

The in-line package style simplifies assembly and allows for easy integration into PCBs, streamlining the manufacturing process.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable operation in common ambient conditions, contributing to product longevity.

Minimum Operating Temperature: -20 °C

With a minimum operating temperature of -20 °C, this IC is suitable for outdoor applications and environments with varying temperatures.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and ensures stable connections, which is crucial for reliable performance.

Terminal Position: DUAL

The dual terminal position offers enhanced flexibility in circuit layout and design, which can simplify the integration into various applications.

Maximum Seated Height: 3.93 mm

With a maximum seated height of 3.93 mm, this IC is compact and helps in maintaining a low profile in the final product design.

Width: 7.62 mm

The compact width of 7.62 mm allows for efficient space utilization on PCBs, making it suitable for small devices.

Minimum Supply Voltage (Vsup): 4 V

A minimum supply voltage of 4V allows for flexible power management and compatibility with low-voltage systems.

Temperature Grade: COMMERCIAL

Rated for commercial temperature grade, this IC meets the requirements for general consumer electronics, ensuring quality and reliability.

Technology: CMOS

CMOS technology is power-efficient and enables high-speed performance, making this IC a smart choice for modern remote control systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and are ideal for prototyping, ensuring durability in various applications.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch is a standard size that ensures compatibility with a wide range of circuit boards, simplifying component integration.

Maximum Supply Voltage (Vsup): 12 V

Supporting a maximum supply voltage of 12V makes this IC suitable for a variety of applications requiring higher power levels.

Technical Specifications

Remote Control ICs M3004AB1 attributes and parameters. Explore more Remote Control ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e0

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

4/12

Qualification:

Not Qualified

Maximum Seated Height:

3.93 mm

Sub-Category:

Remote Control ICs

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

4 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Transmission Media:

INFRARED

Width:

7.62 mm

Trade Compliance

M3004AB1 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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