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M709AB1

STMicroelectronics

M709AB1 by STMicroelectronics

M709AB1 by STMicroelectronics is a CMOS transmitter IC designed for infrared remote control applications. It operates within a supply voltage range of 3-10.5V and features a max operating temperature of 70 °C. With 24 terminals in an in-line package, it ensures reliable performance in various consumer electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,340 parts In-Stock

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2,340

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Anansix

USA . 747 parts In-Stock

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747

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Digiode

USA . 164 parts In-Stock

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164

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ECAB

Sweden . 24 parts In-Stock

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24

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,208 parts In-Stock

1+ parts

$1.662

100+ parts

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1k+ parts

$1.495

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1,208

$1.662

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$1.495

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MKK Technologies

India . 1,852 parts In-Stock

1+ parts

$3.124

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1,852

$3.124

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DigiPath Technology Company

USA . 1,852 parts In-Stock

1+ parts

$3.124

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1,852

$3.124

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Parana Technologies

USA . 2,262 parts In-Stock

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$1.987

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2,262

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$1.987

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Corphita

USA . 171 parts In-Stock

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171

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Overview

Elevate your remote control designs with the M709AB1 from STMicroelectronics—your go-to choice for reliable, high-performance infrared transmission. Designed with precision and built to last, this transmitter IC offers unmatched quality from a trusted manufacturer known for innovation. Perfect for consumer electronics, home automation, and more, it ensures seamless communication at optimal power levels, delivering value and efficiency that enhance user experiences. Choose M709AB1 for superior performance in every application!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy construction ensures longevity and reliability in various environments.

Transmission Media: INFRARED

Infrared transmission provides a reliable and widely accepted method for remote control applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient space utilization in device design.

General IC Type: TRANSMITTER IC

Designed specifically as a transmitter IC, ensuring optimized performance for remote control applications.

Power Supplies (V): 3/10.5

Versatile power supply range accommodates various system voltage requirements.

No. of Terminals: 24

Adequate number of terminals facilitates comprehensive connectivity options for integration.

Package Style (Meter): IN-LINE

In-line package style simplifies integration into small form factor designs.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliability in warm environments.

Minimum Operating Temperature: 0 °C

Ability to operate at low temperatures increases application versatility.

Terminal Finish: TIN LEAD

Tin lead terminal finish ensures good solderability and durability for connections.

Terminal Position: DUAL

Dual terminal positioning allows for flexible mounting options in designs.

Width: 15.24 mm

Compact width facilitates easy accommodation within space-constrained designs.

Minimum Supply Voltage (Vsup): 3 V

Low minimum supply voltage allows for operation in battery-powered devices, enhancing portability.

Temperature Grade: COMMERCIAL

Commercial temperature grade makes the IC suitable for general consumer electronics.

Technology: CMOS

CMOS technology ensures low power consumption and high efficiency in operation.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust mechanical support in circuit boards.

Terminal Pitch: 2.54 mm

Standard terminal pitch enhances compatibility with a wide range of PCB layouts.

Maximum Supply Voltage (Vsup): 10.5 V

Allows safe operation at higher voltages, providing flexibility in design and application.

Technical Specifications

Remote Control ICs M709AB1 attributes and parameters. Explore more Remote Control ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e0

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/10.5

Qualification:

Not Qualified

Sub-Category:

Remote Control ICs

Maximum Supply Voltage (Vsup):

10.5 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Transmission Media:

INFRARED

Width:

15.24 mm

Trade Compliance

M709AB1 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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