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M709LB1

STMicroelectronics

M709LB1 by STMicroelectronics

M709LB1 by STMicroelectronics is a CMOS transmitter IC designed for infrared remote control applications. It operates b/w 2.2V and 5V, features a rectangular plastic/epoxy package with 24 terminals, and withstands temperatures from 0 °C to 70°C. Ideal for consumer electronics, it ensures reliable performance in various devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,888 parts In-Stock

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2,888

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Vyrian

USA . 2,288 parts In-Stock

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2,288

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Digiode

USA . 1,106 parts In-Stock

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1,106

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ECAB

Sweden . 598 parts In-Stock

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598

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 820 parts In-Stock

1+ parts

$3.223

100+ parts

-

1k+ parts

$2.900

10k+ parts

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820

$3.223

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$2.900

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MKK Technologies

India . 1,050 parts In-Stock

1+ parts

$6.060

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1,050

$6.060

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DigiPath Technology Company

USA . 1,050 parts In-Stock

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$6.060

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1,050

$6.060

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Parana Technologies

USA . 1,554 parts In-Stock

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$3.853

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1,554

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$3.853

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Corphita

USA . 756 parts In-Stock

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756

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Assy Fe

Spain . 37 parts In-Stock

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37

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Overview

Unlock seamless connectivity with the M709LB1 from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This versatile infrared remote control IC enhances user experiences across various applications, from home entertainment systems to industrial automation. With superior reliability and a robust design, it ensures outstanding performance while simplifying integration. Choose the M709LB1 for quality that empowers your products and elevates customer satisfaction.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures that the remote control IC is both lightweight and capable of withstanding environmental factors, making it ideal for various consumer electronics.

Transmission Media: INFRARED

Infrared transmission provides a reliable and widely used method for wireless communication, ensuring compatibility with a variety of devices and allowing for remote control functionality without interference.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy integration into circuit designs, optimizing space and layout in devices while maintaining performance standards.

General IC Type: TRANSMITTER IC

As a transmitter IC, this product is specifically designed for remote control applications, ensuring optimal performance for sending commands to other devices.

Power Supplies (V): 2/5.5

The wide power supply range allows flexibility in design, enabling it to operate effectively in various applications and ensuring compatibility with standard power sources.

No. of Terminals: 24

Having 24 terminals provides extensive connectivity options, which can accommodate multiple functionalities and configuration, facilitating complex circuit designs.

Package Style (Meter): IN-LINE

The in-line package style makes assembly simpler and helps in efficient board layout, providing ease of integration with other components.

Maximum Operating Temperature: 70 °C

Designed for operation at temperatures up to 70 °C, this IC is suitable for many electronic applications, ensuring reliability under varied environmental conditions.

Minimum Operating Temperature: 0 °C

The capability to function from 0 °C ensures operational reliability in cooler environments, making it versatile for various consumer electronic devices.

Terminal Finish: TIN LEAD

Tin lead terminals provide good solderability and are durable, ensuring reliable connections during assembly and prolonging the lifespan of the product.

Terminal Position: DUAL

The dual terminal position allows for greater adaptability in circuit designs, aiding in efficient connections and usage in different applications.

Width: 15.24 mm

A compact width ensures that this IC can fit into space-constrained designs, making it suitable for smaller handheld remote controls.

Minimum Supply Voltage (Vsup): 2.2 V

With a low minimum supply voltage of 2.2V, this IC can operate on lower power sources, making it energy-efficient and ideal for battery-powered devices.

Temperature Grade: COMMERCIAL

Being commercially graded, this product meets standard reliability requirements, providing peace of mind for robust performance in everyday consumer electronics.

Technology: CMOS

CMOS technology enables low-power consumption and high noise immunity, enhancing the overall efficiency and performance of the remote control IC.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure mounting and ease of handling during assembly, contributing to durability and reliability in various applications.

Terminal Pitch: 2.54 mm

A standard terminal pitch of 2.54 mm supports ease of PCB design and assembly, allowing for compatibility with common circuit board layouts.

Maximum Supply Voltage (Vsup): 5 V

The maximum supply voltage of 5V ensures compatibility with a wide range of electronic circuits, making it suitable for many remote control applications.

Technical Specifications

Remote Control ICs M709LB1 attributes and parameters. Explore more Remote Control ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e0

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/5.5

Qualification:

Not Qualified

Sub-Category:

Remote Control ICs

Maximum Supply Voltage (Vsup):

5 V

Minimum Supply Voltage (Vsup):

2.2 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Transmission Media:

INFRARED

Width:

15.24 mm

Trade Compliance

M709LB1 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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