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M709B1

STMicroelectronics

M709B1 by STMicroelectronics

M709B1 by STMicroelectronics is a CMOS transmitter IC designed for infrared remote control applications. It operates b/w 4.5V and 10.5V, features a rectangular plastic/epoxy package with 24 terminals, and withstands temperatures from 0 °C to 70°C. Ideal for consumer electronics, it ensures reliable performance in various devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,797 parts In-Stock

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ECAB

Sweden . 892 parts In-Stock

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892

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ComSIT Distribution GmbH

Germany . 610 parts In-Stock

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610

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Vyrian

USA . 364 parts In-Stock

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364

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Anansix

USA . 287 parts In-Stock

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287

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Sogenti Electronics

Canada . 60 parts In-Stock

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60

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ACDS - Activité Composants Distribution Service

France . 43 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 16 parts In-Stock

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Goldney Electronics S.L.

Spain . 7 parts In-Stock

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GES GmbH

Germany . 5 parts In-Stock

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LittleDiode

UK . 2 parts In-Stock

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Component Electronics Inc.

Canada . 2 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 1 parts In-Stock

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IDEA Electronic Components Group

UK . 1,961 parts In-Stock

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$1.571

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$1.414

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$1.571

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$1.414

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MKK Technologies

India . 216 parts In-Stock

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$2.955

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216

$2.955

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DigiPath Technology Company

USA . 216 parts In-Stock

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$2.955

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216

$2.955

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Kepictronics

USA . 8,460 parts In-Stock

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Corphita

USA . 3,272 parts In-Stock

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Assy Fe

Spain . 556 parts In-Stock

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Parana Technologies

USA . 265 parts In-Stock

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$1.879

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265

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$1.879

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Perfect Parts

USA . 96 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 43 parts In-Stock

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Glotronic Ltd.

UK . 34 parts In-Stock

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Overview

Elevate your remote control applications with the M709B1 by STMicroelectronics, a leader in innovative electronic solutions. This high-performance infrared transmitter IC offers unmatched reliability and efficiency, making it ideal for a variety of consumer electronics. With its robust design and commercial-grade temperature tolerance, customers benefit from seamless operation and extended product lifespan. Trust STMicroelectronics to deliver quality that enhances your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures resistance to environmental factors, making the IC reliable for various applications.

Transmission Media: INFRARED

Infrared transmission is widely used for remote controls, offering a reliable and cost-effective solution for wireless communication.

Package Shape: RECTANGULAR

The rectangular shape provides an optimal footprint, making it easy to integrate into various designs and space-constrained applications.

General IC Type: TRANSMITTER IC

As a transmitter IC, it specializes in sending signals, making it ideal for remote control applications.

Power Supplies (V): 4.5/10.5

The versatile voltage range allows compatibility with various power sources, enhancing its usability in different devices.

No. of Terminals: 24

Having 24 terminals provides ample connectivity options, allowing for expanded functionality and customizability.

Package Style (Meter): IN-LINE

The in-line package style facilitates easier mounting and assembly on circuit boards, improving manufacturing efficiency.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable performance in both commercial and consumer environments.

Minimum Operating Temperature: 0 °C

Operational capability starting at 0 °C makes it suitable for a wide range of temperature-sensitive applications.

Terminal Finish: TIN LEAD

The tin-lead finish promotes good solderability and reliability in connections, ensuring long-lasting performance.

Terminal Position: DUAL

Dual terminal positioning allows for flexible PCB layouts, accommodating various design requirements.

Width: 15.24 mm

A compact width of 15.24 mm optimizes space usage on circuit boards, ideal for tight designs.

Minimum Supply Voltage (Vsup): 4.5 V

Starting at a minimum supply voltage of 4.5 V enables operation in lower-power applications, enhancing battery life.

Temperature Grade: COMMERCIAL

Rated for commercial temperature ranges, this IC is suitable for mass-produced consumer electronics.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it perfect for efficient signal processing.

Terminal Form: THROUGH-HOLE

Through-hole design ensures robust mechanical support and makes it easier to handle during assembly.

Terminal Pitch: 2.54 mm

A standard terminal pitch of 2.54 mm allows for compatibility with most PCB designs and enhances manufacturability.

Maximum Supply Voltage (Vsup): 10.5 V

The ability to operate at a maximum voltage of 10.5 V allows for flexibility in high-powered applications.

Technical Specifications

Remote Control ICs M709B1 attributes and parameters. Explore more Remote Control ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e0

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

4.5/10.5

Qualification:

Not Qualified

Sub-Category:

Remote Control ICs

Maximum Supply Voltage (Vsup):

10.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Transmission Media:

INFRARED

Width:

15.24 mm

Trade Compliance

M709B1 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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