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TMS3637P

Texas Instruments

TMS3637P by Texas Instruments

TRANSMITTER/RECEIVER IC; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,955 parts In-Stock

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7,955

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Digiode

USA . 3,715 parts In-Stock

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3,715

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ComSIT Distribution GmbH

Germany . 450 parts In-Stock

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450

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ComSIT USA

USA . 450 parts In-Stock

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450

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Ack Elektronik San.Tic.Ltd.Sti

. 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 214 parts In-Stock

1+ parts

$3.558

100+ parts

-

1k+ parts

$4.081

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214

$3.558

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$4.081

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IDEA Electronic Components Group

UK . 2,248 parts In-Stock

1+ parts

$3.998

100+ parts

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$3.598

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2,248

$3.998

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$3.598

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ChromeModa Solutions

Germany . 2,053 parts In-Stock

1+ parts

$3.998

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$3.278

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2,053

$3.998

$3.278

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AZTECH Wire

Italy . 665 parts In-Stock

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$12.710

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One Stop Electronics

USA . 450 parts In-Stock

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$20.800

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$20.800

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Kepictronics

USA . 8,000 parts In-Stock

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Corphita

USA . 2,749 parts In-Stock

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2,749

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DigiPath Technology Company

USA . 2,098 parts In-Stock

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$3.605

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2,098

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$3.605

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Assy Fe

Spain . 77 parts In-Stock

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77

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Technical Specifications

Remote Control ICs TMS3637P attributes and parameters. Explore more Remote Control ICs devices from Texas Instruments

Specs

Additional Features:

RF AND DIRECT WIRE CAN ALSO BE USED FOR TRANSMISSION

General IC Type:

JESD-30 Code:

R-PDIP-T8

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/6

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Remote Control ICs

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transmission Media:

INFRARED

Width:

7.62 mm

Trade Compliance

TMS3637P General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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