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TMS3637D

Texas Instruments

TMS3637D by Texas Instruments

TMS3637D by Texas Instruments is a Remote Control IC with 8 terminals, operating at 3-6V. It uses Infrared transmission media in a small outline package style. Ideal for transmitter/receiver applications with temp range -25 to 85°C.

Median Price

$2.175

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 579 parts In-Stock

1+ parts

-

100+ parts

$1.950

1k+ parts

$1.740

10k+ parts

$1.640

579

-

$1.950

$1.740

$1.640

DigiKey

USA . 579 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.560

10k+ parts

-

579

-

-

$2.560

-

Verical

USA . 579 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.175

10k+ parts

$2.050

579

-

-

$2.175

$2.050

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,450 parts In-Stock

1+ parts

$2.062

100+ parts

-

1k+ parts

-

10k+ parts

-

2,450

$2.062

-

-

-

Vyrian

USA . 2,795 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,795

-

-

-

-

ComSIT Distribution GmbH

Germany . 831 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

831

-

-

-

-

DigiKey Marketplace

USA . 579 parts In-Stock

1+ parts

-

100+ parts

$2.260

1k+ parts

-

10k+ parts

-

579

-

$2.260

-

-

ACDS - Activité Composants Distribution Service

France . 60 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

60

-

-

-

-

Holdelec - ElecDif-Pro

France . 60 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

60

-

-

-

-

Pride Electronics

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 242 parts In-Stock

1+ parts

$1.953

100+ parts

-

1k+ parts

-

10k+ parts

-

242

$1.953

-

-

-

Parana Technologies

USA . 94 parts In-Stock

1+ parts

$2.024

100+ parts

-

1k+ parts

$2.548

10k+ parts

-

94

$2.024

-

$2.548

-

DigiPath Technology Company

USA . 2,012 parts In-Stock

1+ parts

$2.229

100+ parts

-

1k+ parts

-

10k+ parts

-

2,012

$2.229

-

-

-

ChromeModa Solutions

Germany . 2,333 parts In-Stock

1+ parts

$2.274

100+ parts

$1.865

1k+ parts

-

10k+ parts

-

2,333

$2.274

$1.865

-

-

IDEA Electronic Components Group

UK . 703 parts In-Stock

1+ parts

$2.274

100+ parts

-

1k+ parts

$2.047

10k+ parts

-

703

$2.274

-

$2.047

-

Overview

Elevate your remote control experience with the TMS3637D by Texas Instruments. Known for their exceptional quality and reliability, Texas Instruments offers cutting-edge technology in the realm of Remote Control ICs. This transmitter/receiver IC boasts a compact design and versatile functionality, making it ideal for a wide range of applications. With a power supply range of 3-6V and infrared transmission media, the TMS3637D provides customers with seamless connectivity and optimal performance. Upgrade to Texas Instruments today and unlock a world of possibilities in remote control technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product easy to handle and affordable.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Transmission Media: INFRARED

Provides reliable and efficient communication between devices, especially in remote control applications.

Package Shape: RECTANGULAR

The rectangular shape is commonly used and easy to integrate into various electronic designs.

General IC Type: TRANSMITTER/RECEIVER IC

This versatile IC type allows for both transmission and reception of signals, making it suitable for remote control operations.

Power Supplies (V): 3/6

Supports both 3V and 6V power supplies, offering flexibility in different operating conditions.

No. of Terminals: 8

Provides ample connection points for interfacing with other components and peripherals.

Package Style (Meter): SMALL OUTLINE

The small outline package saves space on the circuit board, ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ensuring reliable operation in various environmental conditions.

Minimum Operating Temperature: -25 °C

Capable of functioning in low-temperature environments, making it suitable for diverse applications.

Terminal Position: DUAL

The dual terminal position offers versatility in mounting options and facilitates connection with other components.

Maximum Seated Height: 1.75 mm

Low profile design enables compact and space-saving integration within electronic assemblies.

Width: 3.9 mm

Compact width dimensions allow for efficient placement on the circuit board, minimizing space usage.

Minimum Supply Voltage (Vsup): 3 V

Supports a low minimum supply voltage, suitable for battery-operated devices with energy-efficient requirements.

Length: 4.9 mm

The small length dimension contributes to a compact form factor, beneficial for space-constrained applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the product.

Terminal Form: GULL WING

The gull wing terminal form enables easy soldering and secure attachment to the PCB, ensuring reliable electrical connections.

Terminal Pitch: 1.27 mm

The fine terminal pitch allows for precise positioning on the circuit board, ensuring proper alignment and electrical connections.

Maximum Supply Voltage (Vsup): 6 V

Supports a maximum supply voltage of 6V, suitable for applications requiring higher power capabilities.

Technical Specifications

Remote Control ICs TMS3637D attributes and parameters. Explore more Remote Control ICs devices from Texas Instruments

Specs

Additional Features:

RF AND DIRECT WIRE CAN ALSO BE USED FOR TRANSMISSION

General IC Type:

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/6

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Remote Control ICs

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transmission Media:

INFRARED

Width:

3.9 mm

Trade Compliance

TMS3637D General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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